MPXV7025GP vs MPXV7025DPT1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPXV7025GP sa pamamagitan ng NXP Semiconductors at MPXV7025DPT1 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPXV7025GP - ±25kPa Compound Pressure Sensor, 8-SMD | NXP Semiconductors
MPXV7025GP ✓ NakahandaNXP Semiconductors
MPXV7025DPT1 - ±25 kPa Differential Pressure Sensor | NXP
MPXV7025DPT1 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPXV7025GP | MPXV7025DPT1 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Pressure Sensors | Pressure Sensors |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Pressure Type | Compound (positive and vacuum) | Differential |
| Operating Pressure Range | ±3.63 PSI (±25 kPa) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Type ng Output | Analog voltage | Analog Voltage (ratiometric) |
| Hanay ng Output Volte | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Output Span | 4.5 V (typical) | — |
| Pressure Port | Male - 0.13" (3.18 mm) Tube, Side | — |
| Volte ng Pagbibigay | 5 V typical (ratiometric output) | 5.0 V typical |
| Kuru-kuryente ng Pagbibigay | [DATA_NEEDED: supply current] | — |
| Accuracy | [DATA_NEEDED: accuracy %FS] | — |
| Temperature na Operasyon | -40C to +125C | -40 °C to +125 °C |
| Packhaging / Kaso | 8-SMD, Gull Wing, Side Port | 8-BSOP (0.475 in / 12.06 mm width) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Technology | Piezoresistive MEMS with on-chip ASIC | — |
| Port Style | Single side port with barbed stem | Dual ports, same side |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Operating Pressure | — | ±3.63 PSI (±25 kPa) |
| Sensitivity | — | Approximately 90 mV/kPa |
| Port Size | — | Male, 0.13 in (3.302 mm) tube, dual |
| Type ng Sensor | — | Piezoresistive (MEMS silicon) |
| On-Chip Signal Conditioning | — | Yes (calibrated and temperature-compensated) |
| Lead-Free | — | Yes |