SPC5645SF1VVU vs SPC5643LFF2MMM1R Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng SPC5645SF1VVU sa pamamagitan ng NXP Semiconductors at SPC5643LFF2MMM1R sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ NakahandaNXP Semiconductors
SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
SPC5643LFF2MMM1R ✓ NakahandaPagsanggunian na paghahambing
| Parametro | SPC5645SF1VVU | SPC5643LFF2MMM1R |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | Power Architecture e200z4d (dual-core lockstep option) | Power Architecture® e200z4 (dual-core with delayed lockstep) |
| Width ng Data Bus | 32-bit | — |
| Maksimum na Taktiko ng Oras | 125 MHz | — |
| Program Memory Size | 2 MB Flash | — |
| Program Memory Type | Flash with ECC | — |
| SRAM Size | [DATA_NEEDED: SRAM size in KB] | — |
| Volte ng Pagbibigay | 3.3 V / 5 V tolerant I/O | — |
| Hanay ng Temperature na Operasyon | -40 C to +105 C | -40 °C to +125 °C (automotive grade) |
| Packhaging / Kaso | 416-PBGA (27x27 mm, 1.0 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| AEC-Q100 Qualification | Yes (Automotive Grade) | Yes (Automotive qualified per NXP product page) |
| Functional Safety | Targeting ASIL-D (dual-core lockstep) | — |
| CAN Controllers | Dual CAN 2.0B (FlexCAN) | — |
| FlexRay | Yes, dual-channel FlexRay module | — |
| Ethernet | [DATA_NEEDED: Ethernet MAC availability] | — |
| Graphics Accelerator | Yes, integrated GFXPU for TFT cluster | — |
| ADC | 12-bit ADC, multi-channel | — |
| Timers | eMIOS unified channels | — |
| Debug Interface | JTAG / Nexus 5001 (Level 3 trace) | Nexus (JTAG, auxiliary) |
| Tindminan RoHS | Compliant | — |
| Process Technology | 90 nm CMOS | — |
| JEDEC MSL | MSL3 (per PBGA JEDEC J-STD-020) | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | MPC5643L (MPC56xx Qorivva family) |
| Core Count | — | 2 (1 main + 1 lockstep checker) |
| Maximum CPU Clock | — | 120 MHz |
| Program Memory (Flash) | — | 1 MB (1M x 8) |
| Data Memory (SRAM) | — | [DATA_NEEDED: SRAM size] |
| Operating Voltage Range | — | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] |
| Packhaging | — | 257-LFBGA / MAPBGA 14x14 mm |
| Functional Safety Target | — | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) |
| Communication Interfaces | — | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) |
| Lead-Free / RoHS | — | Compliant (lead-free BGA) |