XC6SLX4-2CSG225I vs XC6SLX4-3CSG225I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX4-2CSG225I sa pamamagitan ng AMD at XC6SLX4-3CSG225I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX4-2CSG225I | XC6SLX4-3CSG225I |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Unknown | Aktibo |
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) | Spartan-6 LX FPGA |
| Logic Cells | 3,840 cells | 3,840 cells |
| I/O Count | 132 I/O | — |
| Maximum Stated Frequency | 375 MHz | — |
| Technology | 45 nm CMOS | — |
| Operating Voltage | 1.14 V to 1.26 V | — |
| Packhaging | 225-CSBGA | 225-LFBGA CSBGA |
| Package Designation | CSG225 | — |
| Speed Grade | -2 | — |
| Temperature Grade | Industrial | Industrial |
| Programmable Logic Resource | 3,840 logic cells | — |
| Digital Clock Manager | DCM resource identified in product data | — |
| Phase-Locked Loop | PLL resource identified in product data | — |
| Uri ng Pagpapasok | Surface mount | — |
| Block RAM | [DATA_NEEDED: Block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP slice count] | 132 slices |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: Operating temperature range] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Registers | — | 221,184 registers |
| Process Technology | — | 45 nm CMOS |
| Core Technology Voltage | — | 1.2 V |
| Terminal Count | — | 225 terminals |
| Package Shape | — | Square BGA |
| Performance Grade | — | -3 |
| Device Family | — | Spartan-6 |
| Series | — | Spartan-6 LX |
| Programmability | — | Field-programmable logic |
| Logic Resource Density | — | 3,840 logic cells |
| DSP Resource Density | — | 132 DSP slices |
| Package Mounting Type | — | Surface-mount BGA |
| Manufacturer | — | AMD/Xilinx |