Solidigm’s U.S. NAND plan faces Korean listing review and China export risk
Korean scrutiny of Solidigm’s planned Nasdaq listing could complicate funding for its U.S. NAND plant and China equipment exports.
·3 min basahin
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Itayong Agham bago anumang pagtawag ng model1143
Rito sa mababang kalidad na pinagmulan11%
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SK hynix AI memory launches raise design-in and sourcing questions
SK hynix introduced MARS, High Bandwidth Flash and a 256GB CXL 3.2 product while clarifying export-license and Dalian capacity plans.
·4 min basahin
Intel CPU Price Hike Raises Sourcing Risk for PC and Laptop Buyers
Intel's third processor price increase in 2026 links higher PC costs to scarce memory, with buyers facing tighter margins and potentially longer lead times.
·3 min basahin
What 50-week chip lead times mean for engineering BOMs and sourcing
Memory, FPGA, MCU and analog lead times reached allocation ranges as HBM capacity reallocation tightened conventional supply, requiring longer sourcing plans.
·4 min basahin
Nordic Semiconductor Q3 growth raises supply-cost and allocation questions
Nordic Semiconductor reported strong Q3 growth, increased supply-chain investment, and rising costs that may affect pricing and sourcing plans.
·3 min basahin
Chery’s Ziwei automotive chip line reshapes design-in and sourcing choices
Chery introduced C100 computing, S1500 silicon carbide and M-series vehicle-control chips, offering engineers new options for AI processing, power electronics and platform packaging.
·3 min basahin
DRAM Contract Prices and HBM Capacity Choices Shape 4Q26 Sourcing
TrendForce reports rising fourth-quarter DRAM contract prices, tighter AI-related supply, and possible NVIDIA HBM capacity changes with procurement implications.
·4 min basahin
China’s proposed export controls reshape cross-border technology deals
Draft controls cover AI, life-sciences and photovoltaic technology transfers, while an immediate registration duty changes how multinationals screen China-linked deals.
·4 min basahin
UMC and AP Memory target embedded power delivery for AI systems
UMC and AP Memory completed a Q3 2026 tape-out milestone for silicon capacitors aimed at AI and HPC power-delivery designs. [S1]
·4 min basahin
Memory shortages reshape PC costs and procurement lead times through 2026
AI demand is tightening DRAM and NAND supply, raising component costs, extending lead times and complicating PC, GPU and embedded-system sourcing decisions.
·4 min basahin
Chip supply outlook through 2027 raises questions for memory and lithography sourcing
South Korea sees chip demand exceeding supply through 2027, while Gartner forecasts rapid revenue growth and ASML reports interest extending into 2029.
·4 min basahin
PSMC’s foundry price increases tighten the 2027 supply-planning window
PSMC reports higher foundry pricing, constrained mature-node capacity and long-term agreements covering most 2027 MOSFET and IGBT output.
·3 min basahin
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