EP2AGX260EF29I3N - Arria II GX FPGA, 244K LE, 780-FBGA | Intel (Altera)
MPN: EP2AGX260EF29I3N ✗ Tapus ng BuhayEP2AGX260EF29I3N Ulas
What is a mid-range FPGA? A field-programmable gate array is a semiconductor IC containing an array of configurable logic blocks (CLBs), dedicated block RAM, DSP slices, and high-speed transceivers that can be reprogrammed post-manufacture to implement custom digital logic, signal-processing pipelines, or interface protocols. Within the programmable-logic hierarchy, the Arria II GX sits between the lower-cost Cyclone family and the high-end Stratix family, targeting transceiver-rich applications such as wired communications, broadcast video, and high-performance DSP.
Key features include 372 maximum user I/O, up to 12 transceiver channels supporting rates up to 6.375 Gbps, 8 PLLs, dedicated DDR2/DDR3 memory controllers with hardened PHY, and 8.7 Mbit of M20K block RAM. The Arria II GX architecture combines a 6-input adaptive logic module (ALM) with variable-precision DSP blocks, achieving up to 244,188 LEs and up to 1,023 embedded 18×18 multipliers for high-throughput DSP workloads.
The integrated transceivers support CPRI, PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and Serial Digital Interface (SDI), enabling direct connectivity to backplanes, optical modules, and ASIC/ASSP co-processors without external PHY. The hard PCIe Gen2 IP block and multi-gigabit SERDES make the part especially attractive in communications infrastructure and high-end industrial imaging designs.
Typical applications include wireless baseband processing, 3G/4G remote radio heads (RRH), SD/HD-SDI broadcast video routers, 40G/100G line-card prototyping, PCIe Gen2 endpoint cards, high-speed digitizers, and military/defense signal processing. The 780-ball FCBGA package provides the I/O density required by transceiver-heavy designs while remaining manufacturable on standard PCB substrates.
When designing with this FPGA, follow Intel's Quartus Prime power-estimator and pin-connection guidelines: provide adequate decoupling on every transceiver and PLL supply rail, route the high-speed serial channels with controlled-impedance striplines, and respect the 0.9 V ±5 % core voltage tolerance to avoid logic failures under transient loading.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Mga alternatibo na pwedeng ilagay na EP2AGX260EF29I3N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP2AGX260EF29I3N (parehas na form factor at footprint) — pagkakaiba sa Operating Temperature, Package, Mounting Type, Process Technology, Family.
EP2AGX260EF29I3G
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP2AGX260EF29C6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP2AGX260EF29C6G
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP2AGX260EF29C5N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP2AGX260EF29C4N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP2AGX190EF29I3G
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP2AGX260EF29I3N Mga Pinakamataas na Rating at Electrical Characteristics
| Series | Arria II GX |
| Manufacturer | Intel (formerly Altera) |
| Family | Arria II GX |
| Logic Elements (LE) | 244,188 |
| Logic Array Blocks (LABs) | 10,260 |
| Embedded Memory | 12,038,144 bits |
| Total Block RAM | 8.7 Mbit (M20K blocks) |
| Maximum User I/O | 372 |
| Transceiver Channels | 12 (up to 6.375 Gbps) |
| PLLs | 8 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial) |
| Packhaging | 780-ball FCBGA / 780-BBGA |
| Uri ng Pagpapasok | Surface Mount |
| Tindminan RoHS | Compliant |
| Hard IP | PCIe Gen2 endpoint, DDR2/DDR3 PHY |
Pin Configuration ng EP2AGX260EF29I3N
| Pin 1 | VCC — Core supply (0.9 V) |
| Pin A1 | GXB_TX_p[0] — Transceiver 0 TX positive (typical BGA ball, exact signal per datasheet) |
| Pin A2 | GXB_TX_n[0] — Transceiver 0 TX negative |
| Pin B1 | GXB_RX_p[0] — Transceiver 0 RX positive |
| Pin B2 | GXB_RX_n[0] — Transceiver 0 RX negative |
| Pin AF1 | IO[0] — User I/O bank 0 |
| Pin AF29 | IO[371] — User I/O bank 8 |
| Pin REF1 | VCCA_PLL[1] — PLL analog supply |
| Pin REF2 | VCCD_PLL[1] — PLL digital supply |
| Pin GND | GND — Common ground balls distributed under die for power return |
Tipikal na mga Gamit
EP2AGX260EF29I3N ay nararapat para sa 7 aplikasyons: Wireless Baseband Processing (4G/LTE RRH), Broadcast Video Router / SDI Switcher, PCIe Gen2 Endpoint Card, High-Speed Digitizer / Oscilloscope Front-End, 40G/100G Line-Card Prototyping, Military / Defense Signal Processing, Industrial Imaging / Machine Vision.
Wireless Baseband Processing (4G/LTE RRH)
The EP2AGX260EF29I3N fits 4G/LTE remote-radio-head baseband because its 244,188 logic elements and 1,023 embedded 18×18 multipliers can absorb FFT/iFFT and channel-codec datapaths at line rate. The 12 transceivers at up to 6.375 Gbps implement CPRI/OBSAI fronthaul links to the baseband unit, eliminating an external PHY. With 12 Mbit block RAM, designers can hold multiple OFDM symbols on-chip and use the hard DDR2/DDR3 controller for ADC sample buffering. Compared with a discrete DSP+ASIC architecture, the Arria II GX reduces BOM by consolidating baseband, fronthaul, and CPRI stack into one reprogrammable device, shortening time-to-market for evolving LTE/LTE-A releases.
Inirekomenda
Broadcast Video Router / SDI Switcher
For SD/HD/3G-SDI broadcast video routers, the EP2AGX260EF29I3N provides 12 transceivers at 2.97 Gbps supporting up to 3G-SDI, plus 244K LE for crosspoint switching fabric and embedded audio shuffling. The hard PCIe Gen2 IP enables host-side matrix control from a workstation, while 8.7 Mbit of M20K block RAM acts as line-rate audio/video FIFO. Industrial temperature grading suits central apparatus room environments. Compared with a fixed-function crosspoint ASIC, this FPGA lets the same board handle new SDI standards (12G-SDI via quad-link) with a firmware update, eliminating board respins when broadcast plants upgrade to UHD workflows.
Inirekomenda
PCIe Gen2 Endpoint Card
The EP2AGX260EF29I3N's hard PCIe Gen2 endpoint IP (x4/x8 lane capable) suits DSP accelerator cards, frame grabbers, and software-defined-radio front-ends that need 5 Gbps host bandwidth. The 12 high-speed transceivers drive PCIe lanes plus auxiliary Aurora or Serial RapidIO sideband links to companion FPGAs, while 244K LE absorb kernel logic for FFT, FIR, or convolutional decoding. The 780-FBGA package keeps the card within a 16-lane footprint, and 8.7 Mbit block RAM holds DMA descriptors and data prefetch buffers. Compared with a PCIe soft-IP solution in smaller FPGAs, the Arria II GX hard IP achieves lower latency and frees fabric for application kernels.
Inirekomenda
High-Speed Digitizer / Oscilloscope Front-End
For test-and-measurement digitizers, the EP2AGX260EF29I3N pairs 244K LE of DSP fabric with 12 transceivers at 6.375 Gbps to capture and pre-process multi-Gsps ADC streams. The 1,023 embedded 18×18 multipliers implement real-time FIR filtering, channel calibration, and decimation, while 12 Mbit of block RAM stages sample blocks before PCIe Gen2 host transfer. Industrial temperature range and 780-FBGA footprint suit compact 4-channel benchtop scope form factors. Compared with multi-FPGA designs, a single Arria II GX digitizer reduces timing-skew complexity and simplifies calibration firmware.
Inirekomenda
40G/100G Line-Card Prototyping
The EP2AGX260EF29I3N aggregates 12 SERDES lanes at 6.375 Gbps into multi-10G streams for early 40G/100G line-card prototyping before moving to ASIC. Hard PCIe Gen2 provides control-plane connectivity, while 244K LE runs MAC, PCS, and OTN framing for line-side aggregation. Designers can validate higher-layer protocols in firmware rather than committing to a multi-million-dollar mask set. The 780-FBGA package and 0.9 V core simplify PCB power design compared with multi-rail ASICs. Compared with building blocks of small FPGAs, one Arria II GX reduces inter-chip interconnect and timing closure complexity.
Inirekomenda
Military / Defense Signal Processing
For defense electronic-warfare, radar preprocessing, and secure-comm modules, the EP2AGX260EF29I3N delivers 244K LE with industrial temperature grade (-40 °C to +100 °C) and a 780-ball FCBGA package that withstands vibration-prone platforms. The 12 SERDES channels support tactical-radio links (Link 16, Link 22) at 6.375 Gbps, while 8.7 Mbit block RAM stores pulse-Doppler FFT bursts. The hard PCIe Gen2 endpoint integrates cleanly with ruggedized SBCs. Compared with ASIC-based defense platforms, the FPGA permits in-field firmware updates for new threat libraries without hardware respin.
Inirekomenda
Industrial Imaging / Machine Vision
The EP2AGX260EF29I3N powers multi-camera machine-vision inspection systems by combining 244K LE of pixel-processing fabric with 12 transceivers driving CoaXPress or GigE Vision uplinks. Embedded multipliers run real-time defect-detection kernels, while 12 Mbit block RAM stages full-frame buffers between Camera Link taps and the host. Hard PCIe Gen2 supports 5 Gbps image transfer to the host PC, and industrial temperature grading handles -40 °C to +100 °C factory floor environments. Compared with DSP+ASIC vision pipelines, the Arria II GX lets vision integrators upgrade algorithms in firmware as AI models evolve.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP2AGX260EF29I3N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP2AGX260EF29I3G | EP2AGX260EF29C6N | EP2AGX260EF29C6G | EP2AGX260EF29C5N | EP2AGX260EF29C4N | EP2AGX190EF29I3G |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 190,000 (-22%) |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial | Commercial (0 to +85 C) | Commercial | Commercial | Commercial | Industrial |
| Speed Grade | -3 (fastest) | -3 | -6 (slower) | -6 (slower) | -5 | -4 | -3 |
| Maximum User I/O | 372 | 372 | 372 | 372 | 372 | 372 | 372 |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 | 12 | 12 | 12 | 12 | 12 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Pangunahing mga Pagkakaiba
- Industrial temperature rating with same speed grade as production variant (kumpara saEP2AGX260EF29C6N)
- Highest logic density of any 780-FBGA Arria II GX part (kumpara saEP2AGX190EF29I3G)
- Faster -3 timing closure for transceiver-heavy designs (kumpara saEP2AGX260EF29C6N)
Talaan ng Disenyo
Estimated: at 100% logic utilization with all 12 transceivers active, EP2AGX260EF29I3N draws 6-9 W from the 0.9 V core rail. Provide at least four 0.1 uF X7R decoupling capacitors per VCC ball plus bulk 470 uF polymer capacitors on the 0.9 V plane. Use a 5-6 layer PCB with a dedicated ground plane and follow Intel's PowerPlay early power estimator before final layout.
Route all 12 high-speed SERDES channels with 100 ohm differential impedance striplines, with intra-pair skew below 1 ps and length matching within 5 mils. Place AC-coupling capacitors within 200 mils of the BGA ball, on the transmitter side. Each transceiver channel requires its own isolated analog supply (VCCA_GXB) with ferrite-bead filtering from the digital 0.9 V plane to minimize jitter.
The MSL3 moisture sensitivity rating of FCBGA packages requires pre-bake at 125 C for 24 hours before reflow if the sealed package is opened beyond floor life. Use a reflow profile with peak temperature below 245 C and a maximum of two reflow cycles. Damage from moisture absorption can cause internal delamination invisible from outside - inspect JEDEC J-STD-033 compliance for any board-level returns.
For PCIe Gen2 x4/x8 lanes, the EP2AGX260EF29I3N's hard IP requires reference-clock input of 100 MHz HCSL with 25 MHz spread-spectrum option. Use an Intel-recommended clock buffer such as the 9ZXL0851 to fan out the reference clock to multiple cards. Verify the PCIe link-training sequence in the Quartus Prime transceiver toolkit before committing to layout.
Impormasyon ng Pagsunod sa Kautusan
RoHS and REACH compliance confirmed by Altera/Intel product records. AEC-Q100 not applicable - this is an FPGA IC not a discrete automotive-grade component. Conflict-minerals compliance standard for Intel/Altera FPGAs.
