EP3C10F256C8 - 10,320-Cell FPGA, 182 I/O | Intel | Industrial
MPN: EP3C10F256C8 ✗ Tapus ng BuhayEP3C10F256C8 Ulas
A field-programmable gate array is a reconfigurable digital semiconductor that belongs to the FPGA family of programmable logic devices. An FPGA sits within the broader hierarchy of programmable logic ICs, semiconductor integrated circuits, and digital logic devices. Unlike a fixed application-specific integrated circuit, an FPGA allows engineers to implement digital logic, interfaces, and parallel processing functions through a programmable configuration rather than a custom ASIC layout.
The EP3C10F256C8 combines 10,320 logic elements with 182 I/O in a compact 256-LBGA package. These figures make it suitable for systems requiring a substantial programmable-logic resource count without moving to a larger FPGA. The 65 nm process generation reflects the Cyclone III family’s emphasis on power efficiency and moderate system cost. The listed 402 MHz performance and 1.2 V core voltage provide concrete references for clocking and power-design planning.
The 182-I/O configuration is particularly useful for parallel buses, data converters, memory interfaces, industrial control logic, and communication peripherals. Because the device is supplied in a ball-grid-array package, PCB layout must include escape routing, via-in-pad considerations, and thermal analysis. Its 256 terminals provide the physical connection density required by a high-I/O device, although the exact function assigned to each ball is determined by the completed design and pin assignment.
Typical Cyclone III FPGA applications include industrial automation, embedded control, networking infrastructure, communications equipment, and test-and-measurement systems. The device can consolidate control logic, interface adaptation, and parallel processing that might otherwise require several programmable or fixed-function devices. Engineers must still confirm whether a specific protocol, memory interface, clocking arrangement, and I/O standard are supported by the selected Cyclone III variant.
A key design consideration is that the 1.2 V core requirement must be separated from any external interface supplies required by the board. Decoupling, clock jitter, I/O standards, configuration storage, and thermal performance should be validated against the manufacturer datasheet before layout release. Because the verified data does not provide a complete pricing table, detailed timing grades, or the complete 256-ball pin map, those values should be confirmed with the manufacturer or an authorized distributor before procurement.
Mga alternatibo na pwedeng ilagay na EP3C10F256C8 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP3C10F256C8 (parehas na form factor at footprint) — pagkakaiba sa Package, Operating Temperature, RoHS Status, Mounting Type, Embedded 18x18 Multipliers.
EP3C10F256C6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3C10F256C7N
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
EP3C10F256C8N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3C10F256C6
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3C10F256C7
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP3C10F256C8 Mga Pinakamataas na Rating at Electrical Characteristics
| Device Type | Cyclone III FPGA |
| Programmable Logic Elements | 10,320 logic elements |
| User I/O Count | 182 I/O |
| Performance Frequency | 402 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Packhaging | 256-LBGA |
| Terminal Count | 256 terminals |
| Terminal Form | Ball |
| Package Shape | Square |
| Uri ng Pagpapasok | Surface Mount |
| FPGA Family | Cyclone III |
| Programmable Logic Type | Field-programmable gate array |
Gabay sa Pin Configuration ng EP3C10F256C8 square
Pin configuration para sa EP3C10F256C8 (square package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP3C10F256C8.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP3C10F256C8 ay nararapat para sa 6 aplikasyons: Industrial Automation and Control, Communications and Network Interface, Data Acquisition and Signal Processing, Test and Measurement Instrumentation, Embedded Audio and Video Processing, Security and Access Control.
Industrial Automation and Control
The EP3C10F256C8 fits industrial control systems that require a substantial mix of programmable logic and general-purpose I/O. Its 10,320 logic elements can consolidate sequencing, state-machine, interlocks, and interface-adaptation functions, while 182 I/O provide connectivity for sensors, actuators, counters, and field-bus transceivers. The 256-LBGA package also supports compact controller hardware where a discrete PLD-and-ASIC arrangement would otherwise consume additional board area. The 65 nm process and associated 402 MHz performance figure provide useful planning references for the Cyclone III control fabric. Before final qualification, engineers should verify the required industrial temperature range, supported I/O voltage standards, clock resources, and lifecycle availability in the official Cyclone III documentation.
Inirekomenda
Communications and Network Interface
The EP3C10F256C8 is appropriate for communications equipment that separates packet handling, framing, buffering, and interface adaptation into programmable logic. The 182 available I/O can support parallel data paths and multiple external transceivers, while the 10,320-cell resource count is substantial enough for moderate protocol engines without requiring a larger Cyclone III device. Designers can implement clock-domain crossings, test structures, and adaptive control around the programmable fabric. The associated 402 MHz figure indicates that timing-sensitive logic can be evaluated, but actual line rate depends on I/O standards, pin assignments, board-level skew, and the selected device speed grade. Confirm configuration memory, transceiver standards, clock-management resources, and package ball assignments against the manufacturer datasheet before schematic capture.
Inirekomenda
Data Acquisition and Signal Processing
The EP3C10F256C8 can serve as the digital processing fabric in a data-acquisition or embedded signal-processing system. Its 182 I/O offer substantial parallelism for connecting converters, capture logic, memory devices, and digital data buses, while the 10,320 logic elements support filtering, packetization, triggering, and control functions. The 1.2 V core voltage listed in the verified comparison data must be supplied separately from the I/O rails required by external converters. System timing should be budgeted around the associated 402 MHz device figure without assuming that every interface path achieves that rate. Because the verified excerpts do not state the M9K memory resources, PLL availability, or supported high-speed memory interfaces, those capabilities must be checked for the exact device before selecting it.
Inirekomenda
Test and Measurement Instrumentation
The EP3C10F256C8 is suitable for compact test and measurement products that need configurable sequencing, pattern generation, interface adaptation, and real-time control. The 182-I/O count can distribute connections among data converters, status indicators, trigger lines, and communications ports, while 10,320 logic elements allow multiple control paths to be combined in one FPGA. The associated 402 MHz performance figure provides a useful basis for initial timing studies in 65 nm Cyclone III designs. Instrumentation developers should still budget for clock jitter, output skew, input threshold accuracy, and analog front-end bandwidth outside the FPGA. Because the verified data does not identify the exact PLL count, pin standards, or temperature options, confirm those details against the Cyclone III device datasheet and package documentation.
Inirekomenda
Embedded Audio and Video Processing
The EP3C10F256C8 can support programmable audio and video functions that require deterministic parallel data movement. Its 182 I/O provide connections for digital audio buses, display or video interfaces, control signals, and supporting converters, while the programmable fabric can implement buffering, synchronization, format conversion, and control logic. The 256-LBGA package makes the device appropriate for compact multimedia boards, although dense routing and thermal design require careful planning. The associated 402 MHz figure should be treated as a device-level reference rather than a guaranteed pixel or sample rate; throughput depends on the selected interface, clocking plan, and timing margins. Verify the required I/O voltage, PLL resources, supported memory interfaces, and exact ball assignments in the official documentation before finalizing the FPGA selection.
Inirekomenda
Security and Access Control
The EP3C10F256C8 can be used in access-control and security equipment where protocol handling, credential logic, event sequencing, and communications are consolidated in programmable logic. The 10,320-cell fabric provides room for parallel control tasks, while 182 I/O can accommodate card readers, indicators, relays, network interfaces, and local storage. The device allows field updates through its configuration mechanism, which is useful when product requirements evolve, although security-critical firmware and configuration-loading procedures require separate review. The verified excerpts do not provide cryptographic resources, secure configuration details, or operating-temperature limits, so this MPN should not be treated as automatically suitable for security or safety certification. Confirm those capabilities, lifecycle status, and long-term sourcing requirements before design approval.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP3C10F256C8 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP3C10F256C6N | EP3C10F256C7N | EP3C10F256C8N | EP3C10F256C6 | EP3C10F256C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Speed Grade | C8 | C6 | C7 | C8 | C6 | C7 |
Pangunahing mga Pagkakaiba
- Higher C8 speed grade within the directly comparable EP3C10F256 family (kumpara saEP3C10F256C6)
- Same verified logic resource count for in-family migration (kumpara saEP3C10F256C7N)
- Closest same-speed documented option (kumpara saEP3C10F256C8N)
Talaan ng Disenyo
Treat the 256-LBGA layout as a high-density escape-routing problem. Place decoupling and configuration-support components close to their associated power and ball locations, maintain the manufacturer’s recommended layer stack, and provide adequate via access beneath the device. Do not rely on the distributor package name alone to define the land pattern; cross-check the official Cyclone III package drawing because LBGA and TFBGA package documentation may use different ball-pitch or ball-map terminology.
The verified comparison data identifies a 1.2 V core supply, but the complete device requires more than a generic 1.2 V connection. Separate the core and I/O supplies as specified by the manufacturer, verify allowable sequencing, and account for the additional I/O rail requirements of the selected design. Decoupling capacitance, DC tolerance, transient response, and startup behavior must follow the official power-supply recommendations rather than values inferred from the distributor summary.
The 256-ball package provides numerous power and ground connections, but thermal performance still depends on the PCB stack, via field, copper distribution, airflow, and adjacent heat sources. The supplied data does not state junction temperature, power dissipation, or thermal resistance, so no thermal limit should be guessed. Run a complete design-specific thermal analysis after logic utilization, I/O loading, supply voltage, and clock activity are known.
Do not treat a shared EP3C10F256 family designation as proof of unconditional interchangeability. The C6, C7, and C8 suffixes denote different speed classes, while N may affect ordering or finish characteristics. Before substituting a part, compare the manufacturer ordering table, speed-grade limits, temperature grade, package ball map, configuration method, and lifecycle status. Validate timing and interface margins after recompiling the design for the substitute device.
Impormasyon ng Pagsunod sa Kautusan
The verified excerpts do not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable because the product is an FPGA rather than an automotive-qualified discrete device; automotive suitability was not established by the supplied data.
