EP3C25U256C8 - 24,624-LE 472.5 MHz FPGA | Intel
MPN: EP3C25U256C8 ✓ NakahandaEP3C25U256C8 Ulas
An FPGA is a reconfigurable digital integrated circuit whose logic, memory, and interconnect resources can be programmed after manufacture. Within the semiconductor hierarchy, the EP3C25U256C8 belongs to the field-programmable gate array family, where an FPGA provides more flexible parallel logic density than a fixed-function application-specific integrated circuit. This flexibility supports design updates, product differentiation, and consolidated implementation of multiple digital functions on one device.
Key device parameters include 24,624 logic elements, 608,256 bits of embedded memory, and 156 available I/O. The 472.5 MHz maximum operating frequency supports moderately high-speed digital logic, while the 256-ball package provides a compact surface-mount option for space-constrained boards. The commercial temperature range is 0°C to +85°C, and the JLCPCB listing identifies the device as RoHS compliant.
The device supports 24,624 CLBs according to the distributor data and provides 608,256 bits of configuration memory. Its I/O count and package arrangement determine how many external signals can be routed between the FPGA and surrounding circuitry. Because a BGA package uses solder balls beneath the component, assembly requires appropriate board design, inspection, and thermal-management practices rather than conventional through-hole or leaded-solder handling.
Typical uses include industrial automation, networking equipment, embedded control, video or image-processing pipelines, and digital interface consolidation. The 472.5 MHz operating frequency is appropriate for parallel datapaths, protocol bridging, control logic, and general-purpose programmable signal processing. The 156 I/O provide substantial connectivity for external memory, converters, transceivers, and control peripherals, subject to the device's bank-specific power and interface constraints.
Designers should verify the exact pinout, supported I/O standards, configuration scheme, power-supply sequencing, and exposed-pad requirements against the manufacturer datasheet before layout. The BGA land pattern and ball assignments must be copied exactly, while power and ground distribution should minimize loop area and provide appropriate decoupling. Configuration storage and programming-device compatibility should also be validated early in the hardware schedule.
This product record combines distributor specifications, package data, lifecycle observations, sourcing links, and explicit drop-in alternatives. It also distinguishes commercial, speed-grade, and industrial-temperature variants, providing engineering context that helps reduce the risk of selecting an electrically similar but mechanically unsuitable substitute.
Mga alternatibo na pwedeng ilagay na EP3C25U256C8 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
EP3C25U256C7N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
EP3C25U256I7N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
EP3C25U256C6N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
EP3C25U256C5N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
EP3C25U256C4N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
EP3C25U256C8 Mga Pinakamataas na Rating at Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 24,624 CLBs |
| Embedded Memory | 608,256 bits |
| Maximum Operating Frequency | 472.5 MHz |
| Number of I/O | 156 I/O |
| Process Technology | CMOS |
| Package Type | UBGA-256 |
| Alternative Package Designation | 256-LFBGA |
| Package Body Size | 14 mm x 14 mm |
| Ball Pitch | 0.80 mm |
| Uri ng Pagpapasok | Surface Mount |
| Number of Terminations | 256 |
| Hanay ng Temperature na Operasyon | 0°C to +85°C |
| Tindminan RoHS | Compliant |
Gabay sa Pin Configuration ng EP3C25U256C8 14 mm x 14 mm
Pin configuration para sa EP3C25U256C8 (14 mm x 14 mm package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP3C25U256C8.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP3C25U256C8 ay nararapat para sa 6 aplikasyons: Industrial Automation and PLC Control, Communications and Protocol Bridging, Digital Signal and Image Processing, Embedded Control and Sensor Aggregation, Video Timing and Display Interface, Programmable Test and Measurement.
Industrial Automation and PLC Control
The EP3C25U256C8 fits deterministic parallel control and machine-interface logic because it provides 24,624 logic elements, 156 I/O, and a 472.5 MHz operating frequency. A controller can combine ladder-logic translation, sensor conditioning, actuator sequencing, and communication interfaces in one programmable device while replacing several fixed-function ICs. Its commercial 0°C to +85°C range suits controlled indoor enclosures. For installations exposed to wider temperatures, the I7 industrial-grade family variant should be considered, and timing closure should be verified using actual machine-control I/O loading.
Inirekomenda
Communications and Protocol Bridging
The EP3C25U256C8 is suitable for protocol conversion and packet-routing logic where parallel datapaths benefit from programmable resources. Its 24,624 logic elements can host framing, state machines, buffering, and multiple interface adapters, while 608,256 bits of embedded memory support small packet queues and protocol state. The 472.5 MHz headline frequency allows multiple logic pipelines to operate concurrently. Engineers should budget the selected transceivers, clocking, and I/O standards separately because the supplied data does not specify which communication interfaces the FPGA supports.
Inirekomenda
Digital Signal and Image Processing
The EP3C25U256C8 can implement parallel filtering, sampling, timing, and data-format conversion because its 24,624 logic elements and 472.5 MHz operating frequency support concurrent pipeline stages. The 608,256 bits of embedded memory provide local storage for line buffers, sample windows, or intermediate results. Compared with a DSP implementation, the FPGA allows architecture changes to be made through configuration rather than silicon redesign. The practical limit depends on multiplier, block-memory, clock, and I/O availability under the target tool version, which are not included in the supplied specifications.
Inirekomenda
Embedded Control and Sensor Aggregation
The EP3C25U256C8 is well suited to consolidating acquisition, filtering, thresholding, and control functions around a system processor or microcontroller. Its 156 I/O provide substantial connectivity for sensors and control peripherals, while the programmable fabric allows signal paths to be revised without changing the PCB. The 608,256-bit memory capacity can buffer samples before host transfer. For production designs, verify analog-interface power, connector assignments, and isolation requirements at board level because those specifications are outside the FPGA's supplied electrical data.
Inirekomenda
Video Timing and Display Interface
The EP3C25U256C8 can support video timing generation, pixel processing, interface conversion, and test-pattern generation where parallel logic is advantageous. Its 24,624 logic elements and 472.5 MHz operating frequency can sustain multi-stage timing pipelines, while 156 I/O offer connectivity to source and destination interfaces. The device does not inherently include a video codec, so external converters, memory devices, and transceiver selection determine the final architecture. Engineers should confirm display timing margins and available I/O standards using the complete Intel documentation.
Inirekomenda
Programmable Test and Measurement
The EP3C25U256C8 can implement adaptable pattern generation, sequencing, capture logic, and real-time analysis in programmable test equipment. Reconfigurable hardware is useful when measurement algorithms, protocols, or timing requirements change across product variants. The 24,624 logic elements and 608,256 bits of memory provide resources for parallel acquisition paths and control state, while the 472.5 MHz rating supports high-speed digital logic. The device should be paired with suitable external ADC, DAC, memory, and I/O devices because their specifications are not contained in the verified FPGA records.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP3C25U256C8 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP3C25U256C7N | EP3C25U256I7N | EP3C25U256C6N | EP3C25U256C5N | EP3C25U256C4N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | UBGA-256 | UBGA-256 | UBGA-256 | UBGA-256 | UBGA-256 | UBGA-256 |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| I/O Count | 156 | 156 | 156 | 156 | 156 | 156 |
| Temperature Grade | Commercial, 0°C to +85°C | Commercial | Industrial | Commercial | Commercial | Commercial |
| Package Body Size | 14 mm x 14 mm | 14 mm x 14 mm | 14 mm x 14 mm | 14 mm x 14 mm | 14 mm x 14 mm | 14 mm x 14 mm |
| Ball Pitch | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm | 0.80 mm |
Pangunahing mga Pagkakaiba
- Commercial-grade timing balance at the stated headline frequency (kumpara saEP3C25U256C5N)
- Higher speed ceiling for timing-constrained parallel logic (kumpara saEP3C25U256C6N)
- Commercial temperature specification for controlled environments (kumpara saEP3C25U256I7N)
- Higher performance than the lower-speed family variant without changing footprint (kumpara saEP3C25U256C4N)
Talaan ng Disenyo
Use the manufacturer land pattern for the 256-ball UBGA rather than constructing it from generic BGA dimensions. The verified package is 14 mm × 14 mm with 0.80 mm pitch, but ball-map details, pad size, solder-mask opening, and assembly allowances must come from the Intel package drawing. Preserve perimeter routing access and avoid placing tall components where they interfere with the stencil or X-ray inspection process.
Plan a partitioned power distribution network for the core and I/O banks using the manufacturer's recommended voltage, current, filtering, and decoupling requirements. Those electrical values are not present in the supplied records and must not be inferred. Keep the regulator and capacitor paths short, provide local bulk and high-frequency decoupling at the relevant supply pins, and verify startup sequencing against the configuration requirements.
Treat the EP3C25U256C8 as a potentially significant heat source because its 472.5 MHz CMOS logic can consume more power as utilization and switching activity increase. The supplied data does not include active power or thermal resistance, so no defensible junction-temperature calculation is possible. Use the Intel power tables to establish worst-case dissipation, then evaluate exposed-pad treatment, copper area, airflow, ambient temperature, and neighboring heat sources in the final assembly.
Do not treat a shared package name as proof that every suffix is an interchangeable production substitute. The C8 part is a 472.5 MHz commercial-grade device; speed-grade and industrial-grade alternatives change timing or environmental requirements even when the 256-ball footprint is unchanged. Before substitution, compare the complete suffix, ball map, supported I/O standards, configuration method, power requirements, timing results, and temperature range.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliance is explicitly identified by the JLCPCB product listing. The verified excerpts do not provide conclusive REACH, lead-free, halogen-free, or conflict-minerals statements. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified component.
