EP4CE22E22A7N - 22,320-Cell 1.2V Cyclone IV E FPGA | Intel
MPN: EP4CE22E22A7N ✓ NakahandaEP4CE22E22A7N Ulas
A field-programmable gate array is a programmable digital integrated circuit that contains configurable logic blocks, embedded memory blocks, and programmable input/output resources. Within the semiconductor hierarchy, an FPGA sits between fixed-function logic ICs and application-specific integrated circuits: unlike a masked-program ASIC, its configuration can be changed after manufacture. The Cyclone IV E family combines a low-cost, low-power architecture with device densities intended for cost-sensitive control and communication designs.
The EP4CE22E22A7N provides 22,320 logic elements and operates from a 1.2 V core. Its 144-LQFP exposed-pad package provides a defined PCB land pattern and a direct thermal path when the exposed pad is connected to a ground plane. The ordering code also identifies the E22 package configuration, A7N automotive-grade option, and speed-related suffix, making the complete ordering part number important when checking PCB compatibility, qualification requirements, and procurement traceability.
FPGA designs commonly use programmable logic for protocol bridging, parallel-to-serial conversion, data acquisition, motor and motion control, and low-latency filtering. The same 22,320-cell device can implement parallel datapaths, state machines, and interface controllers because its resources are distributed rather than fixed to a single function. This makes the device useful where requirements evolve after prototype development or where a product family needs several field-reconfigurable hardware variants.
The Cyclone IV E family is manufactured using a 60 nm process technology, helping balance logic density, static power, and cost. Because an FPGA contains many configurable routing and memory resources, board design must account for supply rails, decoupling, clocking, configuration data, and thermal management of the exposed pad. Follow the pin-description and recommended decoupling tables in the manufacturer datasheet when assigning PCB nets.
This page combines the verified device attributes, package information, ordering-code details, comparison guidance, and practical integration considerations that engineers normally have to assemble across multiple documentation pages.
Mga alternatibo na pwedeng ilagay na EP4CE22E22A7N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP4CE22E22A7N (parehas na form factor at footprint) — pagkakaiba sa Logic Elements, Package, Process Technology, Device Type, Operating Temperature.
EP4CE22E22I7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4CE22E22I8LN
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4CE10E22A7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4CE10E22C8N
✅ Drop-In✗ Wala sa Stock
$11.1 / Yunit
Tingnan ang Datasheet →EP4CE6E22I8LN
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP4CE22E22A7N Mga Pinakamataas na Rating at Electrical Characteristics
| Device Family | Cyclone IV E |
| Device Type | FPGA |
| Logic Elements | 22,320 cells |
| Core Supply Voltage | 1.2 V |
| Process Technology | 60 nm |
| Packhaging | 144-pin LQFP with exposed pad |
| Package Pin Count | 144 pins |
| Package Family | LQFP |
| Uri ng Pagpapasok | Surface mount |
| Automotive Qualification | AEC-Q100 automotive grade |
Gabay sa Pin Configuration ng EP4CE22E22A7N lqfp
Pin configuration para sa EP4CE22E22A7N (lqfp package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP4CE22E22A7N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP4CE22E22A7N ay nararapat para sa 6 aplikasyons: Automotive Control and Body Electronics, Industrial Automation and PLC Control, Network Interface and Protocol Bridging, Data Acquisition and Signal Conditioning, Telecommunications Line and Packet Processing, Test, Measurement, and Instrumentation.
Automotive Control and Body Electronics
The EP4CE22E22A7N fits vehicle control modules that combine several deterministic digital functions, including switch decoding, actuator sequencing, diagnostic interfaces, and centralized logic. Its 22,320 logic elements allow multiple parallel control blocks to share one FPGA rather than requiring separate programmable and fixed-function devices. The 1.2 V core and 144-LQFP exposed-pad package support dense, compact control assemblies, while the A7N automotive ordering grade addresses qualification-sensitive vehicle programs. Use the manufacturer power, clocking, and decoupling guidance for the production design.
Inirekomenda
Industrial Automation and PLC Control
The EP4CE22E22A7N is suitable for programmable logic controllers and factory automation modules that coordinate sensors, motors, counters, and safety interlocks. Its 22,320 programmable logic elements support parallel motion sequencing and I/O mapping without constraining the design to a fixed controller architecture. The 1.2 V core and 144-LQFP package allow a compact controller with direct access to industrial I/O standards. Verify industrial temperature and qualification requirements against the selected ordering option before deployment in factory-floor equipment.
Inirekomenda
Network Interface and Protocol Bridging
The EP4CE22E22A7N can implement protocol converters, packet classifiers, and legacy-to-modern interface bridges where multiple data paths must operate concurrently. The 22,320-cell density provides parallel resources for headers, buffers, state machines, and clock-domain crossing logic rather than limiting the design to a single serial channel. Its 1.2 V core reduces the demand on compact power budgets, and the exposed-pad LQFP provides a defined thermal path. Confirm transceiver standards, I/O voltage options, and supported clocking in the device documentation.
Inirekomenda
Data Acquisition and Signal Conditioning
The EP4CE22E22A7N supports parallel data-acquisition front ends that require real-time filtering, triggering, decimation, and data formatting. Its 22,320 logic elements allow multiple acquisition channels and control logic to be implemented concurrently, while embedded resources can reduce external component count when the design fits the device's memory architecture. The 1.2 V core supports compact instrumentation designs with controlled power consumption. Confirm converter interface widths, required logic resources, and timing closure for the target sampling rate.
Inirekomenda
Telecommunications Line and Packet Processing
The EP4CE22E22A7N is appropriate for embedded telecom functions such as line-card control, packet buffering, and time-slot mapping. Its 22,320-cell density enables parallel datapaths that operate concurrently with supervisory control and status monitoring. The 144-LQFP exposed-pad package supports compact line-card hardware, and the 1.2 V core helps integrate with multi-rail communication circuitry. Select the appropriate ordering grade for the deployment environment and verify all I/O, timing, and qualification parameters before release.
Inirekomenda
Test, Measurement, and Instrumentation
The EP4CE22E22A7N can serve as the programmable processing core in instruments that combine pattern generation, response capture, timing control, and analysis. Its 22,320 logic elements allow several channels and state machines to operate in parallel, simplifying designs that would otherwise require multiple dedicated controllers. The 1.2 V core and exposed-pad LQFP package enable compact boards with controlled thermal loading. Use the manufacturer's clock-placement and performance guidance to achieve predictable timing across multiple instrument channels.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP4CE22E22A7N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP4CE22E22I7N | EP4CE22E22I8LN | EP4CE10E22A7N | EP4CE10E22C8N | EP4CE6E22I8LN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin LQFP with exposed pad | 144-pin LQFP with exposed pad | 144-pin LQFP with exposed pad | 144-pin LQFP with exposed pad | 144-pin LQFP with exposed pad | 144-pin LQFP with exposed pad |
| Device Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Elements | 22,320 cells | 22,320 cells | 22,320 cells | 10,320 cells | 10,320 cells | 6,272 cells |
| Ordering Grade | A7N automotive grade | I7N industrial grade | I8LN industrial grade | A7N automotive grade | C8N commercial grade | I8LN industrial grade |
| Automotive AEC-Q100 | Yes | No, industrial ordering grade | No, industrial ordering grade | Yes | No, commercial ordering grade | No, industrial ordering grade |
Pangunahing mga Pagkakaiba
- Full EP4CE22 density with automotive ordering grade (kumpara saEP4CE10E22A7N)
- Retains full density for industrial designs (kumpara saEP4CE6E22I8LN)
- Automotive ordering option rather than commercial grade (kumpara saEP4CE10E22C8N)
- Same-density alternative exists for industrial qualification requirements (kumpara saEP4CE22E22I7N)
Talaan ng Disenyo
Treat the 1.2 V core and the I/O rails as separate power domains. Follow the manufacturer recommended-decoupling tables and power-up sequence rather than assuming that one bulk capacitor can replace local ceramic bypass capacitors. Place the smallest-value ceramic capacitors at the device supply pins with short, low-inductance return paths, and verify voltage tolerances, ramp limits, and sequencing against the system power controller.
The 144-LQFP exposed pad is part of the thermal path as well as the land pattern. Join it to a solid ground plane using the recommended via array so heat can spread into the board rather than remaining inside the package. Copper area alone may be insufficient in a dense industrial or automotive assembly, so evaluate junction temperature with the system airflow, enclosure temperature, and adjacent heat sources using the manufacturer thermal model.
Use the manufacturer 144-LQFP land pattern and exposed-pad geometry without substituting a generic 144-pin footprint. Reserve the configuration interface, clock inputs, and user I/O routing around the package perimeter, while keeping high-speed or sensitive interfaces away from noisy power-return paths. Complete signal-integrity checks on external memory or transceiver interfaces, and confirm all pin assignments against the datasheet pin-description table.
Do not approve a substitute solely because it is also an E22 device with the same LQFP package. EP4CE22 ordering variants preserve density but change the environmental or ordering grade, while EP4CE10 and EP4CE6 alternatives reduce available logic resources. Confirm pin-to-pin compatibility, configuration behavior, operating-grade requirements, timing, memory usage, and design utilization before releasing a substitution.
Impormasyon ng Pagsunod sa Kautusan
The A7N ordering option is identified as automotive grade and AEC-Q100 in the manufacturer-related product listing. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations were not established by the verified device records and therefore remain unknown.
