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XC3090L-8TQ176C - 6K-Gate 80MHz CMOS FPGA | Xilinx TQFP-176
XC3090L-8TQ176C

XC3090L-8TQ176C - 6K-Gate 80MHz CMOS FPGA | Xilinx TQFP-176

The Xilinx XC3090L-8TQ176C is a 5,000-gate (6,000-gate maximum) CMOS Field Programmable Gate Array from the legacy XC3000A/L family, supplied in a 176-pin TQFP package. It features 320 Configurable Logic Blocks (CLBs), operates at a maximum clock frequency of 80 MHz, and is rated for 3.3 V core operation. The 'L' suffix denotes the low-voltage variant; the '8' speed grade corresponds to the slowest timing bin, and '176C' identifies the commercial-temperature TQFP-176 package option. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic function and interconnects are defined by configuration data loaded into on-chip static memory. FPGAs sit within the broader hierarchy programmable logic device -> programmable logic -> logic IC -> integrated circuit, and historically served as the fastest path to custom digital logic before modern HDL-based ASIC flows became mainstream. The XC3000 family pioneered SRAM-based configuration, allowing infinite reconfiguration and rapid prototyping cycles that defined early-1990s digital design. Key specifications include 5,000 usable gates (6,000 max), 320 CLBs, 80 MHz maximum toggle frequency, 3.3 V VCC, SRAM-based configuration, JTAG boundary-scan support, and a 0.500 mm pitch TQFP-176 footprint. The device exposes dedicated I/O blocks with programmable pull-ups and output slew-rate control, and it supports multiple configuration modes including master serial, slave serial, and peripheral modes for flexible system boot. Technically, the XC3090L uses a 5 V-tolerant I/O architecture on a 3.3 V core, with CMOS process geometry typical of mid-1990s Xilinx silicon. Each CLB contains a configurable combinatorial logic section plus two flip-flops, with local interconnect feeding the general-purpose routing matrix. The 80 MHz grade represents worst-case pin-to-pin combinatorial delay across the slowest paths, adequate for glue logic, bus interfacing, and state-machine replacement rather than high-throughput DSP. Typical applications include legacy glue-logic replacement, bus-bridge adapters (e.g., ISA-to-local-bus converters), industrial controller front-ends, and educational FPGA platforms where the TQFP-176 footprint is already laid out. The XC3090L is widely used as a pin-compatible replacement target for systems designed around the XC3000 family pinout. When designing, verify that the configuration memory source (EPROM, EEPROM, or microcontroller) matches the selected configuration mode and that the readback/special I/O voltage levels do not exceed the absolute-maximum ratings. Always reference the Xilinx XC3000 family datasheet for full timing parameters. This page consolidates distributor availability, parametric data, drop-in alternatives, and practical design notes that supplement the original Xilinx XC3090L datasheet.

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XC3090L-8TQ176I - 5000 Gates FPGA, 320 CLBs, 80 MHz | Xilinx
XC3090L-8TQ176I

XC3090L-8TQ176I - 5000 Gates FPGA, 320 CLBs, 80 MHz | Xilinx

The Xilinx XC3090L-8TQ176I is a CMOS Field-Programmable Gate Array from the legacy XC3000 series offering 320 Configurable Logic Blocks (CLBs), a maximum of 5000 equivalent gates, and up to 6000 usable gates, housed in a 176-pin TQFP (TQ176) surface-mount package with industrial temperature grading. The device is built on a 0.6 um CMOS process and operates from a single 5V supply with a maximum clock frequency of 80 MHz and a combinatorial CLB delay of 6.7 ns at the -8 speed grade. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a perimeter of user-configurable I/O Blocks (IOBs) with a core array of Configurable Logic Blocks (CLBs) and programmable interconnect, all controlled by an SRAM-based configuration program store. FPGAs sit hierarchically under programmable logic, then digital integrated circuits, and ultimately the broader semiconductor taxonomy; the XC3000 family occupies the early-generation, 5V legacy tier that preceded modern low-power Virtex and Kintex families. Key features include 144 user I/Os in the TQ176 footprint, distributed on-chip RAM, JTAG boundary-scan support, and tri-state buffers per IOB. The architecture supports asynchronous and synchronous design entry through Xilinx's XACT development system, including schematic capture, automatic place-and-route, logic and timing simulation, and interactive design optimization. The -8 speed grade denotes the mid-tier performance bin of the XC3090L family, with faster -9/-10 grades unavailable in this part number and slower -6/-7 grades reserved for cost-sensitive designs. Typical applications include industrial control glue logic, legacy telecom backplane interfaces, military and aerospace retrofit boards, and educational laboratory trainers where designers migrate proven XC3000 designs forward without re-validating timing closure. The wide 5V tolerance and TTL-compatible I/Os also make it suitable for bridging older ASICs to newer microprocessors. When designing with this part, treat the 6.7 ns CLB delay as the budget floor for the slowest logic path: multiply by the number of cascaded CLBs and add interconnect delay to estimate the system clock. Configuration storage is volatile, so external PROMs (XC17xx) are required for standalone boot. This page synthesizes distributor stock, lifecycle status, same-package alternatives, and practical design notes not found in the standalone XC3090L datasheet, designed to assist sourcing engineers working on legacy Xilinx FPGA maintenance and obsolescence mitigation.

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XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx
XC3090L-8TQG176C

XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx

The Xilinx XC3090L-8TQG176C is a 3.3 V, low-voltage CMOS Field Programmable Gate Array from the Xilinx XC3000L Logic Cell Array family, packaged in a 176-pin Thin Quad Flat Pack (TQFP). It contains 320 Configurable Logic Blocks (CLBs), delivers approximately 5,000 equivalent gates (with up to 6,000 usable gates), and supports system clock rates up to 80 MHz. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and routing resources after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within the semiconductor category, alongside Complex PLDs (CPLDs). They differ from CPLDs in architecture: FPGAs use a fine-grained array of look-up tables (LUTs) and SRAM-based configuration memory, offering higher logic density and richer register-rich datapaths, while CPLDs use macrocell-based, non-volatile architectures optimized for glue logic and fast pin-to-pin combinational delays. The Xilinx XC3000L family specifically targets low-voltage (3.3 V), high-volume designs where predictable timing and low power are required. Key features of the XC3090L-8TQG176C include 320 CLBs organized in a symmetric array, on-chip SRAM-based configuration memory (reprogrammable in-system), TTL-compatible I/O, and the -8 speed grade. The -8 speed grade corresponds to a slower timing bin, trading absolute clock frequency for lower cost; faster -6 and -7 bins are also offered in the same family. The device is configured externally from an EEPROM, EPROM, ROM, or disk file, with on-chip initialization logic handling the configuration handshake. Typical applications span legacy industrial control boards, telecommunications glue logic, prototyping of state machines and bus interfaces, and design migration from discrete TTL/CMOS MSI logic to a single programmable device. The TQFP-176 footprint is widely accepted for through-hole-era replacements and older PCI and ISA-style add-in cards where surface-mount assembly is feasible but BGA is not yet adopted. When designing with the XC3090L-8TQG176C, note that the part is in long-term EOL and should be qualified against remaining distributor stock before any new design-in. Designers should verify lead-free reflow compatibility (the original XC3000L family was specified for SnPb process), and confirm configuration mode (serial vs. parallel) against board-level pull-up resistors and DONE/PROG sequencing. This page synthesizes distributor stock levels, drop-in same-package XC3000L variants, and practical obsolescence-management notes not found in the original manufacturer datasheet.

RFQ İletişim
XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx
XC3090L-8TQG176I

XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx

The Xilinx XC3090L-8TQG176I is a CMOS Field Programmable Gate Array from the legacy XC3000L low-voltage family, offering approximately 5000 usable gates (up to 9000 equivalent system gates) implemented across 320 Configurable Logic Blocks (CLBs) in a 176-pin TQG/LQFP package. It supports a maximum clock frequency of 80 MHz with a CLB combinatorial delay of 6.7 ns at the -8 speed grade, targeting high-density glue-logic, prototyping, and industrial control applications where ASIC-class integration is not yet justified. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric and interconnect can be programmed by the end user after manufacture. Within the taxonomy of digital ICs, an FPGA sits between an Application-Specific Integrated Circuit (ASIC) and a microcontroller: an ASIC is hard-wired for one function but offers the lowest unit cost at high volume, while an FPGA trades per-unit cost for design flexibility, parallel hardware execution, and rapid time-to-market. The XC3000 family pioneered SRAM-based configuration and the now-universal island-style CLB + IOB + programmable interconnect architecture that defines the modern FPGA. Key features of the XC3090L-8TQG176I include on-chip SRAM-based configuration store, three types of configurable elements (perimeter I/O Blocks, core CLB array, and routing channels), industrial-grade -40C to +85C operating range (I suffix), and the low-voltage L-suffix core that reduces 5V-family power. The device is housed in a 176-terminal LQFP/TQFP package on a 0.5 mm pitch with gull-wing leads suitable for surface-mount assembly and rework. Technically, the XC3000L family uses a 5V-tolerant I/O structure with 3.3V or 5V core options, hierarchical interconnect including long lines, hex lines, and direct connects, and configurable IOBs that support registered, latched, or combinatorial I/O with tri-state control. The architecture integrates a configuration program store so the array can be re-programmed in-system via the standard Xilinx configuration interface. Typical applications span industrial control systems, telecommunications glue logic, prototyping platforms for ASIC emulation, test and measurement fixtures, military/aerospace subsystems, and educational development kits where students learn HDL synthesis on a mature, well-documented device family. The TQG176 package is the highest-density option for this die. When designing with the XC3090L-8TQG176I, note that this device family is mature (introduced in the early-to-mid 1990s), so verify long-term availability and second-source supply before committing new production designs. New designs should weigh migration to the Xilinx CoolRunner-II CPLD or Spartan-6/Spartan-7 FPGA families for active lifecycle status and modern toolchain support. This page synthesizes distributor pricing, XAIPART in-stock tiers, pin-compatible Xilinx drop-in alternatives drawn from the XC3000L family, and practical design notes on configuration, I/O banking, and legacy toolchain compatibility not found in the original datasheet.

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XC3090LTM-100PC84C - 6K Gate, 320-Cell FPGA 5V 84-PLCC | Xilinx
XC3090LTM-100PC84C

XC3090LTM-100PC84C - 6K Gate, 320-Cell FPGA 5V 84-PLCC | Xilinx

The Xilinx XC3090LTM-100PC84C is a CMOS Field Programmable Gate Array (FPGA) from the legacy XC3000 Logic Cell Array family, delivering approximately 6,000 usable gates and 320 Configurable Logic Blocks (CLBs) in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. Operating at 5V CMOS technology with a 100 MHz internal performance grade, the device is rated for commercial temperature conditions and targets low-voltage logic integration where fine-grained parallel logic is required. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of in-system programmability. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA) and are widely used to implement custom digital logic, glue logic, bus interfaces, and parallel datapaths without committing to a masked ASIC. The XC3000 family is the third-generation Xilinx architecture that introduced distributed Configurable Logic Blocks with look-up table-based logic, complemented by a programmable interconnect matrix and I/O blocks. Key features of the XC3090LTM-100PC84C include 320 CLBs, a typical gate count range of 5,000 to 6,000 gates, 100 MHz system performance, and 5V CMOS core technology. The PLCC-84 (PC84) package uses J-lead surface-mount terminals in a square ceramic/plastic body, supporting legacy through-hole-style PCB assembly processes. The XC3000 family pioneered SRAM-based configuration, allowing infinite re-programmability via an external configuration PROM or microcontroller bitstream load. From an architecture perspective, the XC3000L family uses 5V-tolerant I/O buffers, distributed RAM capability in select CLB modes, and a hierarchical interconnect that routes signals between logic blocks with predictable delay. The 'LTM' suffix designates the low-voltage / commercial temperature variant in the XC3000 family. Compared with modern 28nm or 16nm FPGAs, the XC3090LTM-100PC84C delivers modest logic density but remains useful for legacy board retrofits, education platforms, and industrial systems where proven long-life silicon is required. Typical applications include industrial control glue logic, legacy telecommunications interfaces, military and aerospace retrofits (through QML equivalents), educational FPGA training platforms, and digital signal preprocessing where low-cost parallel logic suffices. The 84-pin PLCC footprint is socket-compatible with the broader XC3000/XC3100/XC3300 84-pin PLCC family, simplifying board reuse across multiple design generations. When designing with this device, ensure proper configuration circuitry is included - the SRAM-based XC3000 family requires a configuration bitstream at every power-up. Plan for 5V supply decoupling, and verify I/O voltage compatibility with downstream CMOS or TTL peripherals. Engineers targeting new designs should consider the device's NRND/EOL status and confirm lifetime-buy availability for production runs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a single reference for engineers evaluating the XC3090LTM-100PC84C for both new designs and legacy support scenarios.

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XC3090LTM-125PC84C - 5000 Gates XC3000L FPGA, 125MHz, PLCC-84 | Xilinx
XC3090LTM-125PC84C

XC3090LTM-125PC84C - 5000 Gates XC3000L FPGA, 125MHz, PLCC-84 | Xilinx

The Xilinx XC3090LTM-125PC84C is a 5000-gate, 125 MHz Field Programmable Gate Array (FPGA) from the legacy XC3000L Low-Voltage Logic Cell Array family, housed in an 84-pin Plastic Leaded Chip Carrier (PLCC-84) package. It delivers approximately 5000 equivalent gates, 320 Configurable Logic Blocks (CLBs), and 928 flip-flops, with a maximum clock frequency of 125 MHz. The 'L' suffix denotes the low-voltage 3.3 V core variant, and 'TM' indicates the commercial plastic-leaded chip carrier package grade. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic functions using an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit between fixed-function ASICs and discrete logic ICs in flexibility and integration. The XC3000L family was Xilinx's third-generation low-voltage FPGA line, succeeding the original XC3000 by operating from 3.0 V to 3.6 V supplies instead of 5 V, enabling lower power consumption for portable and battery-powered designs of the 1990s. Key features include 320 CLBs, 928 flip-flops, 138 user I/Os, 4.75 V to 5.25 V supply range for the I/O bank, an internal 3.3 V core, and a 125 MHz maximum toggle/clock frequency. The device supports JTAG-based boundary-scan testing, on-chip configuration memory, and tri-state output buffers per I/O. The PLCC-84 through-hole package provides robust mechanical mounting suitable for industrial and legacy equipment designs. Technically, the XC3090LTM-125PC84C uses SRAM-based configuration cells, meaning the bitstream must be loaded from an external ROM or microcontroller at every power-up. This volatile configuration enables unlimited re-programming cycles in the field, but requires a separate configuration PROM such as the XC1736 or compatible serial-loader device. The architecture implements a symmetrical array of CLBs surrounded by perimeter I/O blocks (IOBs), which was the industry-standard FPGA floorplan of that era. Typical applications include industrial control logic, telecom interface glue logic, legacy peripheral adapters, and test-and-measurement custom instrumentation. The wide I/O count (138) supports parallel buses and high-pin-count glue-logic designs. When designing with this FPGA, allocate at least 4 clock-pad pins for global clock distribution and ensure the configuration PROM timing aligns with the XC3090LTM power-on reset sequence. For new designs, consider migrating to a modern Xilinx 7-series or Spartan-6 device, since the XC3000L family is no longer recommended for new designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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XC3090LTM-8PC84C - XC3000L FPGA, 6K Gates, 84-PLCC | Xilinx
XC3090LTM-8PC84C

XC3090LTM-8PC84C - XC3000L FPGA, 6K Gates, 84-PLCC | Xilinx

The Xilinx XC3090LTM-8PC84C is a member of the legacy XC3000L Low Voltage Logic Cell Array family, delivering approximately 6,000 usable gates in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. The device is built on a 0.8-micron CMOS SRAM-based architecture and operates from a 3.0 V to 3.6 V core supply, with the "L" suffix designating low-voltage operation relative to the original 5 V XC3000 series. The "TM" suffix indicates a specific speed/grade combination within the XC3000L family. A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells. The user-defined logic function is loaded into on-chip static memory cells from an external boot source such as an EEPROM, EPROM, ROM, or microprocessor. Once configured, the FPGA behaves as a dedicated custom digital circuit. The XC3000 family was Xilinx's pioneering commercial FPGA line, establishing the FPGA architecture still dominant in the industry today, and the XC3000L variant extends that architecture to lower-voltage 3.3 V systems where power dissipation is a primary concern. Key features of the XC3090LTM-8PC84C include approximately 320 Configurable Logic Blocks (CLBs), 64,160 bits of distributed configuration memory, and an 84-pin PLCC package with J-lead surface-mount terminations. The device supports in-system configuration via the Xilinx XC3000 configuration bitstream and is footprint-compatible with other XC3090L members that share the PC84 pinout. Logic delays are typically in the 5-10 ns range, sufficient for moderate-speed glue logic, bus interfacing, state-machine implementation, and small processor prototyping on 3.3 V rails. Typical applications include legacy 3.3 V digital glue logic replacement, prototype ASIC emulation, custom peripheral interfacing for microcontrollers, parallel bus arbitration, and industrial control subsystems where 5 V FPGAs are no longer acceptable. The 84-PLCC package also supports through-hole and socket-based prototyping, which is convenient for engineering development and low-volume production. Designers should note that the XC3000L family is legacy silicon - the Xilinx WebPACK and modern Vivado tools do not support these devices. Programming requires the legacy XACT or older Foundation toolchains, and configuration bitstreams generated for XC4000, Spartan, or 7-series FPGAs are incompatible. Engineers maintaining legacy systems should verify the configuration PROM and toolchain availability before committing to new designs.

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XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx
XC3S1600E-4FG484I

XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx

The AMD Xilinx XC3S1600E-4FG484I is a Spartan-3E family Field Programmable Gate Array (FPGA) delivering 1.6 million system gates, 33,192 logic cells, and 376 user I/Os in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. Fabricated on a 90nm CMOS process with a 1.2V core supply, this industrial-temperature device (I suffix, -40C to +100C) runs at speed grade -4 and integrates 29,504 registers and 648 Kbits (663,552 bits) of distributed and block RAM. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs) and programmable interconnects that the designer configures in the field via HDL (VHDL/Verilog). Within the programmable logic hierarchy, the FPGA sits above CPLDs in capacity and sits alongside ASSPs as a core digital logic implementation platform for system-on-chip prototyping and production designs. Key features of the XC3S1600E include 3,688 CLBs/LABs providing high logic density, 572MHz maximum toggle capability supported by dedicated digital clock managers (DCMs), and abundant block RAM for FIFOs and dual-port memories. The 376 I/Os support multiple I/O standards with configurable banks, enabling wide data-path interfaces. Architecturally, the Spartan-3E platform uses a 4-input look-up table (LUT) based fabric with dedicated carry logic, multiplier blocks, and DCMs for clock conditioning - well suited to cost-sensitive control, glue logic, and DSP-lite tasks. The 90nm process keeps core power low at 1.2V while retaining robust routing flexibility. Typical applications include industrial control and automation, embedded system prototyping, data acquisition glue logic, motor control interfaces, and communications line cards. The wide 376-I/O budget makes it a natural fit for bus bridging and parallel-to-serial adaptation. A key design consideration: the Spartan-3E family is mature, so plan configuration via a platform Flash PROM (such as XCF-series) and verify 1.2V core, 3.3V auxiliary, and I/O bank rails meet sequencing guidance in the datasheet. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.

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XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600E-5FGG320C

XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD (Xilinx) XC3S1600E-5FGG320C is a Spartan-3E family FPGA with 1.6 million system gates, 33,192 logic cells, and 250 user I/Os, fabricated on 90nm CMOS process technology and housed in a 320-ball fine-pitch BGA (FGG320, 19x19 mm) package. It operates from a 1.2V core supply (1.14V to 1.26V) with a commercial temperature range of 0C to 85C junction, and speed grade -5. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), embedded memory, and programmable interconnects that designers configure via a hardware description language such as Verilog or VHDL. Within the semiconductor hierarchy, an FPGA sits under programmable logic devices, alongside CPLDs and ASICs, and is used to implement custom digital logic without fabricating a custom chip. Key features of the XC3S1600E include a large 1.6M-gate fabric for mid-density designs, 250 user I/Os supporting multiple I/O standards, Spartan-3E cost-optimized architecture, and availability of configuration via platform flash devices such as the XCF32P. The Spartan-3E family was widely adopted in telecommunications, industrial control, and consumer electronics, per Microchip USA product data. Architecturally, the Spartan-3E fabric uses 4-input look-up tables (LUTs), dedicated carry logic, block RAM, and embedded multipliers, enabling DSP datapaths, glue logic consolidation, bus interfaces, and control sequencing on a single chip. Typical applications include industrial control systems, telecommunications line cards, test equipment, motor control interfaces, and legacy system sustenance where a proven mid-density FPGA is already designed in. Design consideration: this part is officially obsolete and no longer manufactured, per DigiKey lifecycle data, so new designs should evaluate AMD 7-series (Spartan-7, Artix-7) or cross-brand alternatives; existing designs should secure stock or a qualified migration path. This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet.

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XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600EFG400

XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD/Xilinx XC3S1600EFG400 is a member of the Spartan-3E family of Field Programmable Gate Arrays (FPGAs), offering a high-density programmable logic solution with 33,192 logic cells and an equivalent gate count of 1,600,000. Housed in a 400-ball FBGA package (FG400), this device provides 304 user I/O pins and 663,552 bits of block RAM, making it suitable for a wide range of digital designs. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing the implementation of complex digital circuits without the need for custom fabrication. They are a subset of programmable logic devices (PLDs) and are widely used in prototyping, low-to-medium volume production, and applications requiring reconfigurability. Key features of the XC3S1600EFG400 include 33,192 logic cells, 663,552 bits of block RAM, and support for a maximum clock frequency of 572 MHz. The device operates from a 1.2V core voltage and is manufactured using advanced CMOS technology. The FG400 package offers 400 balls with a 1.00 mm pitch, providing a compact footprint for space-constrained designs. The Spartan-3E architecture is optimized for high performance and low cost, featuring dedicated multipliers, digital clock managers (DCMs), and support for various I/O standards including LVCMOS, LVTTL, and differential standards. The device also includes configuration support via JTAG, SPI, and SelectMAP interfaces, enabling flexible system integration. Typical applications for the XC3S1600EFG400 include industrial control, automotive infotainment, consumer electronics, and communication systems. Its balance of logic density, I/O count, and cost makes it ideal for bridging ASIC prototyping and production. When designing with this FPGA, careful attention must be paid to power supply decoupling and configuration bitstream storage. The 1.2V core requires stable power, and the configuration data is typically stored in an external SPI flash, which must be selected for compatibility.

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XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx
XC3S200-4FT256C

XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx

AMD XC3S200-4FT256C is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 cells, and a 256-LBGA package. The -4 speed grade operates at up to 630 MHz, while the device uses a nominal 1.2 V core supply and is manufactured in 90 nm process technology. These headline characteristics position the FPGA between fixed-function logic and larger programmable-logic devices for cost-sensitive, moderate-complexity embedded systems. A field-programmable gate array is a programmable logic device in which configurable logic blocks, programmable input/output blocks, and programmable interconnect form a user-defined digital circuit. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside CPLDs and mask-programmable logic. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured after manufacture to implement control, interface, protocol, signal-processing, or security functions in parallel. The Spartan-3 architecture provides 480 configurable logic blocks and 4320 cells according to the supplied distributor and comparison data. Its 256-ball package supports 256 terminals for device configuration, power, clocking, and user I/O. The -4 designation identifies the performance grade, while the commercial C suffix corresponds to the stated 0°C to 85°C operating-temperature range. A maximum supply voltage of 1.26 V and a nominal 1.2 V FPGA supply are also reported in the available data. The 90 nm Spartan-3 process supports a useful balance of logic capacity, static power, dynamic performance, and manufacturing cost. At up to 630 MHz, the XC3S200-4FT256C can satisfy clock-domain requirements that are more demanding than simple glue logic while remaining smaller and less complex than a high-end FPGA. Exact timing, I/O standards, supported memory interfaces, configuration options, and core-current limits require confirmation in the complete manufacturer datasheet before a new design is released. Typical uses include industrial control and automation, communications equipment, embedded test systems, consumer products, instrumentation, and compact control modules. Its parallel programmable resources can implement multiple finite-state machines, data acquisition logic, communication bridges, and auxiliary processors concurrently. The 256-terminal package also makes the device suitable for designs requiring more configuration and user I/O than a small CPLD, although board density and routing must be assessed at the schematic and PCB stages. Designers should treat the package, voltage rails, decoupling, configuration interface, clocking, and I/O standards as a coordinated system rather than isolated specifications. Place bypass capacitors close to the supply pins, preserve the required configuration path, and verify every ball assignment against the exact package drawing. Because the supplied snippets contain inconsistent secondary descriptions of package and cell data, the authoritative manufacturer pinout and datasheet should control any production implementation. This page combines the verified distributor specifications with engineering-focused application guidance, design notes, parameter comparisons, and same-family drop-in candidates. It also distinguishes confirmed values from unavailable electrical details, helping engineers identify the correct replacement without mistaking a similar FPGA for a guaranteed production substitute.

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XC3S200-4FT256I - 200K Spartan-3 FPGA | AMD | FTBGA-256
XC3S200-4FT256I

XC3S200-4FT256I - 200K Spartan-3 FPGA | AMD | FTBGA-256

The AMD XC3S200-4FT256I is a 200K-gate Spartan-3 field-programmable gate array (FPGA) with 4,320 logic cells, a 630 MHz maximum clock frequency, and a 256-terminal FineLine BGA package measuring 17 mm by 17 mm. The device uses 90 nm FPGA technology and operates from a 1.14 V to 1.26 V internal core supply. Its 256-terminal package provides a high pin count for dense programmable-logic designs while maintaining a compact board footprint. A field-programmable gate array is a configurable digital semiconductor containing programmable logic blocks, programmable interconnect, and input/output resources. An FPGA belongs to the semiconductor hierarchy, programmable-logic IC hierarchy, and Spartan-3 FPGA family. Unlike a fixed-function application-specific integrated circuit, an FPGA allows system designers to implement parallel logic, control functions, signal processing, and interface logic in hardware and later update the configuration through a configuration memory or JTAG programming path. The XC3S200-4FT256I combines 4,320 logic cells with 200K system gates and a maximum clock frequency of 630 MHz. The -4 speed designation identifies the performance grade, while the I suffix identifies the industrial temperature grade. The device is specified for 0 C to +85 C operation in the supplied distributor data, making it suitable for industrial and embedded control equipment where environmental requirements exceed consumer-grade conditions. The 17 mm by 17 mm FTBGA-256 package supports compact PCB layouts but requires careful escape routing, via-in-pad or via fan-out strategies, assembly-process control, and inspection. The 1.2 V core supply requires a regulated, low-noise supply rail and appropriate power-plane distribution. Because this is a legacy Spartan-3 FPGA, designers should also verify configuration memory availability, toolchain support, lifecycle status, and second-source requirements before committing a new production design. Typical applications include industrial control, instrumentation, data acquisition, communication interfaces, embedded signal processing, and prototype systems requiring configurable parallel logic. The high-pin-count package is particularly useful when the design needs numerous user I/O or dedicated interface resources, although the exact user I/O count is not provided in the verified data. A key design consideration is that replacing an XC3S200-4FT256I is not limited to matching its package. A true drop-in candidate must also preserve pin assignment, voltage requirements, configuration behavior, timing characteristics, and software support. This page summarizes verified distributor and manufacturer-linked information, compares documented drop-in candidates, and identifies engineering details that must be confirmed before PCB release.

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XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
XC3S200-4FTG256I

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

The Xilinx XC3S200-4FTG256I is a Spartan-3 family field programmable gate array (FPGA) offering 200,000 system gates and 4,320 logic cells in a 256-ball FineLine BGA (FTG256) package, with a 1.2V core voltage, industrial temperature rating of -40C to +100C, and a -4 speed grade supporting internal performance up to approximately 630 MHz. A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates. Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails. Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1. Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density. A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design. This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx
XC3S200-4PQ208C

XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx

The AMD / Xilinx XC3S200-4PQ208C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 480 configurable logic blocks, and 221,184 RAM bits in a 208-pin PQFP package. It operates from a 1.2 V core supply and is specified for the commercial temperature range of 0°C to 85°C. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O paths are configured after manufacture. Within the product hierarchy, the XC3S200-4PQ208C is an FPGA, then a programmable-logic device, and ultimately a semiconductor. Compared with fixed-function logic ICs, an FPGA lets engineers implement parallel processing, control, communications, and signal-generation functions in one reconfigurable device while retaining the same package and pinout across design revisions. The supplied product data identifies 141 I/O, 4,320 logic cells, 480 CLBs, 221,184 RAM bits, and 200,000 system gates. The “-4” speed designation and an associated listing report 630 MHz performance, while the commercial “C” suffix identifies the specified temperature grade. Its 208-pin PQFP package exposes substantially more device I/O than the smaller 100-pin Spartan-3A options, making it suitable for designs with wider external buses or more peripheral connections. The XC3S200-4PQ208C fits industrial control, communications infrastructure, embedded instrumentation, video processing, test equipment, and legacy embedded systems. A practical design can use its programmable logic for parallel data acquisition, protocol conversion, signal conditioning, and supervisory control while retaining configuration data in external nonvolatile flash. Engineers should verify every power rail, configuration interface, and high-speed I/O constraint against the complete Spartan-3 documentation before layout release. Power and termination design remain central to reliable FPGA implementation. Provide the specified core and I/O supplies, route each supply through its documented decoupling network, and use a configuration scheme that matches the board’s flash and control logic. Because the supplied excerpts do not provide full electrical limits, pin assignments, or power-budget data, those details require confirmation from the manufacturer’s official Spartan-3 documentation before schematic completion. This page consolidates verified distributor specifications, same-package family comparisons, commercial availability references, and application-specific engineering guidance. It distinguishes the XC3S200-4PQ208C from smaller Spartan-3 packages and higher-density PQFP208 devices, helping engineers determine whether the device’s logic, memory, I/O, and thermal requirements align with an existing 208-pin PCB design.

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XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-4PQ208I

XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S200-4PQ208I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 141 user I/O, and a stated 630 MHz performance figure, supplied in a 208-pin PQFP package. The device operates from a 1.2 V core supply and is built on 90 nm CMOS process technology. Its -4 speed designation identifies a performance grade, while the PQ208 suffix denotes the 208-pin plastic quad flat package and I suffix identifies the industrial temperature option. A field-programmable gate array is a programmable semiconductor in which digital logic, interfaces, and system functions are configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor and a programmable logic device. The Spartan-3 family targets cost-sensitive designs requiring more flexibility than fixed-function logic, while providing configurable logic blocks, dedicated arithmetic resources, block RAM, and programmable I/O within one integrated device. The XC3S200-4PQ208I combines 480 configurable logic blocks with 4,320 logic cells and 141 user I/O according to the supplied manufacturer-family data. Its 200,000-system-gate count describes the family device's logic-equivalent capacity rather than a fixed gate count. The 630 MHz figure likewise requires careful interpretation because achievable system performance depends on the selected design, timing constraints, clocking, I/O standards, routing, and the associated Xilinx toolchain. The 90 nm Spartan-3 architecture supports integration of control logic, data acquisition, communications glue logic, state machines, and modest parallel-processing functions. Reconfigurability allows design revisions to be implemented in the FPGA bitstream rather than through a PCB respin. Dedicated block RAM can buffer sampled or packet data, while programmable I/O can connect the device to external clocks, data buses, transceivers, displays, and industrial interfaces subject to voltage and timing constraints. Typical uses include industrial automation, programmable logic controllers, motor-control and sensor-processing systems, embedded communications, instrumentation, and cost-sensitive consumer or control electronics. The 208-pin PQFP provides more I/O than a small FPGA package, making it useful where parallel external buses, control signals, or multiple interfaces must coexist with the Spartan-3 logic fabric. Design planning should begin with the AMD/Xilinx Spartan-3 datasheet and the appropriate ISE or Vivado-era design flow for the installed device family. Verify the exact pinout, supported I/O standards, configuration requirements, decoupling, clock topology, and exposed thermal and power constraints on the selected package before layout release. This page consolidates verified distributor specifications, pricing references, same-family drop-in candidates, and practical selection considerations for engineers evaluating the XC3S200-4PQ208I.

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XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP
XC3S200-4TQ144I

XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP

The AMD XC3S200-4TQ144I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic elements, 221,184 bits of embedded RAM, and 97 I/O pins in a 144-pin TQFP package. The -4 speed grade is specified for operation up to 630 MHz, while the I suffix denotes the extended industrial-temperature option. The device uses a 90 nm process and operates from a 1.14 V to 1.26 V core supply. A Spartan-3 FPGA belongs to the configurable-logic hierarchy: FPGA > programmable logic device > field-programmable gate array > semiconductor. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and embedded hard processors in one reconfigurable device. This allows interface logic, control functions, and parallel data processing to be consolidated on a single PCB. The XC3S200-4TQ144I provides 4,320 four-input LUT-based logic elements and 221,184 embedded RAM bits. Verified listings identify 1,920 adaptive logic modules and 480 LAB/CLB resources for this device. Its 97 I/O pins support board-level connectivity, and the 144-lead TQFP package provides a surface-mount form factor compatible with conventional PCB assembly and inspection processes. The 90 nm Spartan-3 architecture combines programmable logic with dedicated block RAM and programmable interconnect. It is intended for cost-sensitive embedded systems where parallel processing, flexible interfaces, and field reconfiguration provide more value than a fixed logic implementation. The 1.14 V to 1.26 V core range reflects the device's internally regulated core operation, while external I/O requirements remain part of the complete board power architecture. Typical uses include industrial control, embedded communications, instrumentation, data acquisition, display interfaces, and compact embedded processing systems. Its 4,320 logic elements and 221,184 RAM bits make it appropriate for protocol bridging, parallel-to-serial conversion, control-plane logic, and modest algorithmic workloads. Designs requiring substantially greater logic density or memory bandwidth should use a larger FPGA family. Designers should verify the exact pinout, configuration interface, I/O standards, clock requirements, and decoupling recommendations against the manufacturer datasheet before layout release. Because the TQFP package has fine-pitch leads, PCB assembly and inspection require suitable paste, stencil, placement, and inspection processes. Legacy-device supply status and configuration-memory interface compatibility also deserve review before new production commitments. This page consolidates verified distributor specifications, same-family drop-in candidates, practical design guidance, and parameter-level comparisons. It distinguishes confirmed electrical and packaging facts from information that could not be extracted from the supplied web records, helping engineers evaluate the XC3S200-4TQ144I without relying on ambiguous distributor summaries.

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XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP
XC3S200-4VQ100C

XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP

The AMD/Xilinx XC3S200-4VQ100C is a Spartan-3 Field Programmable Gate Array (FPGA) with 200,000 system gates, 63 user I/O pins, and a 100-pin VQFP package. It operates from a 1.2 V FPGA supply and is specified for a 0 °C to 85 °C operating-temperature range. The device is intended for embedded programmable-logic applications where moderate logic density, surface-mount packaging, and a broad I/O count are more important than the very high performance of a large FPGA. An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. The XC3S200-4VQ100C belongs to the Spartan-3 FPGA family, placing it in the broader hierarchy of programmable-logic device, FPGA, and semiconductor. Its 200,000 system gates provide a practical platform for control logic, interface bridging, signal conditioning, and embedded state-machine designs. The 100-pin VQFP package also supports conventional PCB assembly and inspection processes. The -4 speed designation identifies the device performance grade, while VQ100 identifies the 100-pin VQFP package and C identifies the commercial temperature grade. The listed electrical characteristics include 63 user I/O pins, a 1.14 V to 1.26 V core-supply range, and a 0 °C to 85 °C operating range. These figures define the principal design constraints for voltage regulation, thermal planning, signal-interface design, and industrial or commercial equipment. Typical uses include industrial control and automation modules, communications-interface adapters, embedded test equipment, and low-to-medium complexity digital systems. The FPGA can implement parallel logic, state machines, counters, protocol front ends, and control functions in one configurable device. Engineers should confirm that the selected design does not require more logic resources, I/O, clocking, or memory than the available device resources provide. The most important design consideration is ensuring that the 1.2 V core rail is generated with adequate tolerance and decoupling, while all connected I/O structures remain compatible with the target board voltage levels. Because this is a surface-mount VQFP package, solderability, pin-1 orientation, assembly profile, and thermal performance should be reviewed against the selected PCB footprint and manufacturing process. This page consolidates distributor availability, verified device parameters, package information, and practical FPGA selection guidance. It also distinguishes exact drop-in alternatives from upgrade candidates so engineers can assess PCB reuse without confusing package compatibility with complete functional equivalence.

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XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD
XC3S200-4VQ100I

XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD

AMD XC3S200-4VQ100I is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 logic elements, a 1.2 V supply, and a 100-pin TQFP package. The device combines programmable logic, block RAM, and dedicated multiplier resources in a compact 14 mm × 14 mm surface-mount package. Its industrial-oriented ordering suffix supports use in embedded control, communications, instrumentation, and industrial automation systems where deterministic programmable logic is required. A Spartan-3 FPGA is a reconfigurable digital semiconductor in the FPGA and CPLD product hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA allows engineers to define parallel logic, state machines, interfaces, and data-processing functions in hardware. Its configurable interconnect routes signals among logic cells, dedicated block RAM, multipliers, and general-purpose I/O, making the device suitable for designs requiring deterministic timing and flexible hardware architecture. The XC3S200-4VQ100I provides 200000 system gates and 4320 logic elements according to distributor listings. The family-level product information also identifies 12 block RAMs, 12 multipliers, and 4 digital clock managers for designs requiring embedded memory, dedicated arithmetic, and clock-management resources. Its 1.2 V core supply and 100-pin TQFP package provide a practical balance between capability, I/O access, and board footprint. The “-4” portion identifies the device speed grade, while “VQ100” identifies the 100-pin package configuration and “I” identifies the industrial temperature grade. These ordering codes allow procurement teams to distinguish devices that otherwise belong to the same Spartan-3 family. Because FPGA designs depend on the configuration file, device speed, pinout, memory resources, and supported I/O standards, engineers should verify the exact ordering code against the AMD/Xilinx datasheet and board constraints before substitution. Typical uses include industrial control logic, low-latency communication interfaces, data acquisition, embedded signal processing, test equipment, and general-purpose embedded systems. The 100-pin package is particularly useful where a larger FPGA would be unnecessary and where external SDRAM or a high-pin-count BGA package would add unnecessary board complexity. Its integrated resources can reduce external logic-component count while retaining software-side reconfiguration flexibility. The primary design consideration is package-level resource and signal-integrity verification. The 100-TQFP footprint requires exact land-pattern, pin-orientation, and power-decoupling review before layout release. Engineers should also account for configuration memory, configuration interface, clocking, I/O voltage limits, unused pins, and startup behavior in the complete FPGA design rather than treating the FPGA only as a collection of logic blocks. This product page consolidates verified distributor specifications, package information, ordering-code details, sourcing links, and engineering guidance. It also distinguishes a genuine same-footprint replacement from a merely similar FPGA family member and records unknown technical values explicitly for engineers to confirm in the manufacturer datasheet.

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XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA
XC3S200-5FT256C

XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA

The AMD XC3S200-5FT256C is a Spartan-3 field-programmable gate array with 200,000 system gates, 192 logic cells, and a 1.2 V supply in a 256-LBGA package. The -5 speed designation identifies the device performance grade, while the FT256C suffix identifies the lead-free commercial package variant. Its operating temperature range is 0°C to 85°C, making it suitable for cost-sensitive embedded systems that require programmable logic without the resources of a larger FPGA. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmed devices, and application-specific programmable logic. The Spartan-3 architecture combines configurable logic, memory resources, dedicated input/output structures, and programmable interconnect, allowing a designer to implement multiple control, interface, datapath, and signal-processing functions in one device. The XC3S200-5FT256C provides 50,000 system gates according to one distributor listing and 200,000 system gates according to Mouser and Partstack. The verified sources also report 192 logic cells, a 1.2 V FPGA supply, a 256-LBGA package, 256 terminals, and a square package shape. These source differences should be resolved against the applicable AMD Spartan-3 family data sheet before final design release. Because the device belongs to the Spartan-3 generation, engineers should treat it as a legacy programmable-logic platform and validate toolchain availability, configuration method, I/O standards, timing, and sourcing before beginning a new production design. The operating range of 0°C to 85°C distinguishes it from extended-temperature variants. Its 256-ball land-grid-array package also requires a PCB footprint and assembly process capable of handling fine-pitch balls, while configuration storage, clocking, decoupling, and I/O voltage planning remain central implementation concerns. Typical uses include industrial control and factory automation, embedded instrumentation, communications interfaces, display and video control, consumer products, and general-purpose digital signal processing. The Spartan-3 family was specifically positioned for high-volume, cost-sensitive consumer electronic applications, but individual designs still require complete timing, thermal, signal-integrity, and configuration verification. The principal design caution is that a replacement FPGA must match the package, ball assignment, supported I/O standards, voltage requirements, configuration interface, and timing constraints. A device with the same family name or logic density is not automatically pin-compatible. Migration decisions should therefore use AMD pinout data, device-generation constraints, and design-tool checks rather than relying only on distributor similarity labels. This page consolidates the verified distributor and manufacturer references for the XC3S200-5FT256C, distinguishes verified characteristics from parameters requiring confirmation, and provides migration, sourcing, and application guidance that is not present in a basic distributor listing.

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XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-5VQ100C

XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx

The AMD Xilinx XC3S200-5VQ100C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 63 user I/O pins, and 221,184 RAM bits, supplied in a 100-pin TQFP package. It operates from a 1.2 V supply and is specified for a 0 to 85 °C operating temperature range. A field-programmable gate array is a programmable digital semiconductor that combines configurable logic, programmable interconnect, and memory resources in one device. In the broader semiconductor hierarchy, an FPGA belongs to programmable logic devices and provides a hardware alternative to implementing a fixed function in an application-specific integrated circuit. The Spartan-3 family was designed for cost-sensitive embedded, industrial, consumer, and communication systems. The XC3S200-5VQ100C provides 4,320 logic cells and 221,184 RAM bits for parallel datapaths, control logic, state machines, and interface conditioning. Its 63 user I/O pins provide connections to external memory, sensors, converters, communication transceivers, and display or control peripherals. The -5 speed designation identifies the device's performance grade, while the commercial C temperature designation corresponds to the stated 0 to 85 °C range. The device uses a 1.2 V core supply, making power-supply design important in compact embedded systems. Available details confirm 200,000 system gates, 4,320 logic cells, 63 I/O pins, 221,184 RAM bits, and a 100-TQFP package. Additional detailed information such as exact I/O standards, configuration interface characteristics, and recommended operating limits is not present in the supplied verified records and must be confirmed from the manufacturer datasheet before design release. Typical uses include industrial controllers, embedded control systems, video and image-processing front ends, communication equipment, and consumer electronics. In each case, the Spartan-3 architecture permits logic and memory functions to be updated in the field, reducing the need for a custom ASIC in moderate-volume designs. Designers should preserve the manufacturer's recommended power and decoupling arrangement, validate every I/O voltage and bank configuration, and account for configuration-pin requirements during power-up. Because the supplied records do not include a complete verified pin table, the package drawing is represented by the generic library key rather than an invented pinout. This page combines the verified distributor specifications, packaging information, source links, and drop-in alternatives. It also distinguishes directly comparable speed-grade parts from larger-package or functionally similar devices that cannot replace the target without PCB changes.

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XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I

XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx

The AMD/Xilinx XC3S200A-4FTG256I is a Spartan-3A family Field Programmable Gate Array (FPGA) with 200,000 system gates, 4,032 logic cells, and 195 user I/Os in a 256-ball FineLine Thin-profile BGA (FTG256) package at industrial temperature grade (I suffix). Built on 90nm CMOS technology with a 1.2V core, the device targets cost-sensitive, high-volume digital logic applications. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM and multipliers. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic; the Spartan-3A family is Xilinx's low-cost, high-volume segment designed for consumer, industrial, and communications glue-logic applications. Key specifications of the XC3S200A-4FTG256I include 448 Configurable Logic Blocks (CLBs), 288 Kbits of block RAM, up to 667 MHz maximum operating frequency (speed grade -4), dedicated 18x18 hardware multipliers for DSP, and a Digital Clock Manager (DCM) block for clock synthesis. The FTG256 package measures 17x17 mm and uses a 1.0 mm ball pitch. Architecturally, the Spartan-3A integrates CLBs arranged in rows and columns, surrounded by IOBs (I/O blocks), with block RAM columns interleaved, four DCMs, and dedicated multiplier blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential HSTL/SSTL for direct interface to external memories and high-speed peripherals. Typical applications include industrial control and machine vision, consumer electronics display controllers, communications protocol bridges, low-cost video processing, motor control, and educational/hobbyist development boards. The wide operating temperature range (-40C to +100C industrial grade) also suits factory automation and outdoor equipment. Designers should pay attention to the FTG256 ball-pinout for PCB layout: a 256-ball BGA with 1.0 mm pitch requires 4-6 layer PCB design with microvia or via-in-pad technology for reliable assembly. Use Xilinx ISE WebPACK or the modern AMD Vivado/Vivado Lab Edition for configuration bitstream generation. Power estimation should be performed with the Xilinx Power Estimator (XPE) tool before finalizing thermal management. This page consolidates current distributor pricing, verified pin-compatible drop-in alternatives in the Spartan-3A family, and practical design notes - practical context not found in the bare manufacturer datasheet.

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XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4FT256C

XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4FT256C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, 173 I/O, and a 1.2 V core supply, housed in a 256-LBGA package. The -4 suffix identifies the performance grade, while FT256 identifies the 256-ball surface-mount package offered in the verified distributor records. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated hard multipliers, and clock-management resources. This makes the Spartan-3 family useful when engineers need hardware-level parallelism, rapid design changes, or compact implementation of complex digital systems without committing to a custom application-specific integrated circuit. The verified listing identifies 400,000 system gates and 8,064 logic cells for the XC3S400 device. It provides 173 I/O in a 256-LBGA package and uses a 1.2 V core voltage. Related Spartan-3 data identifies 90 nm fabrication technology and a 630 MHz figure for the XC3S400-4FTG256C comparison variant; those values should not be transferred to XC3S400-4FT256C without confirmation from its own manufacturer datasheet. The device is suitable for parallel data processing, custom interface control, embedded signal processing, communications infrastructure, test equipment, and industrial control systems. Its 173 I/O permit substantial board-level connectivity, while the 8,064-cell logic resource supports parallel datapaths and state machines. The FT256 package can also simplify component density compared with larger leaded packages, but it requires careful PCB layout, thermal analysis, and BGA assembly capability. The commercial -4 grade is intended for cost-optimized designs rather than the extreme operating range implied by an industrial temperature suffix. Before releasing a design, engineers should verify the exact I/O standards, supported memory interfaces, configuration requirements, power-up behavior, and package pinout against the manufacturer documentation for XC3S400-4FT256C. A critical design consideration is that the FT256 package requires exact land-pattern, solder-mask, paste, via, and assembly-process control. Power rails and decoupling should be implemented according to the manufacturer's guidance, while configuration and programming interfaces should be checked for signal-integrity and termination requirements before layout signoff. This page consolidates verified distributor pricing, same-footprint Spartan-3 alternatives, application guidance, and design cautions that are not presented together on a manufacturer product page. It also distinguishes confirmed target-device facts from parameters that remain unavailable in the supplied source data.

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XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx
XC3S400-4FT256I

XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FT256I is a Spartan-3 field-programmable gate array providing 400,000 system gates, 8,064 logic cells, and 173 user I/Os in a 256-ball FTBGA package. The device operates from a 1.14 V to 1.26 V core supply, uses 90 nm process technology, and is specified for industrial-temperature operation from 0 °C to 85 °C. Its -4 speed grade supports operation up to 630 MHz according to the compared manufacturer-family specification in the provided web data. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after fabrication. The Spartan-3 family belongs to the FPGA and programmable-logic hierarchy, providing configurable logic resources rather than a fixed instruction set. The XC3S400-4FT256I is intended for designs requiring substantial parallel logic, control, communications, or signal-processing functions while using a single highly integrated package. The main device characteristics include 400,000 system gates, 8,064 logic cells, 173 user I/Os, a 256-ball FTBGA package, and a 1.2 V nominal core supply. The listed family comparison identifies 90 nm technology and a 630 MHz performance figure for the XC3S400-4FT256I. Its industrial temperature range and lead-free package information make it relevant to industrial control, communications equipment, and embedded systems, although current availability and lifecycle status should be confirmed before new production commitments. The FTBGA package provides a dense connection arrangement for high-density programmable-logic designs. The 173 user I/Os can be assigned to digital interfaces, control signals, communications links, or mixed external circuitry, while the FPGA fabric allows parallel functions to be implemented with deterministic hardware timing. Unlike a microcontroller with a fixed peripheral architecture, the XC3S400-4FT256I allows system functions and interfaces to be defined during configuration, making it suitable for custom protocols, accelerators, and legacy system control logic. Typical applications include industrial automation controllers, communications equipment, embedded control systems, test and measurement platforms, and signal-processing modules. In these systems, the FPGA can implement parallel interfaces, protocol conversion, timing and sequencing functions, and custom hardware processing. The 400,000-system-gate density is substantially larger than small CPLDs, supporting multi-module designs while keeping the implementation in one programmable device. The primary design consideration is package-level integration. A 256-ball FTBGA requires careful PCB layout, via and escape-routing planning, thermal management, and assembly-process control. The core supply and I/O supply requirements, configuration interface, clocking, decoupling, and termination must follow the Spartan-3 device documentation. Because the XC3S400-4FT256I is associated with a discontinued-product notice in the provided AMD support result, engineers should preserve the exact MPN in legacy designs and evaluate any replacement against pinout, voltage, timing, and configuration compatibility. This product record combines verified distributor and manufacturer-search information with practical design guidance for industrial FPGA implementations. It highlights the density, logic-cell count, I/O count, package, voltage, temperature range, and source links while clearly separating confirmed data from specifications that require confirmation from the manufacturer datasheet.

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XC3S400-4TQ144C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4TQ144C

XC3S400-4TQ144C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4TQ144C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 97 I/Os, and a 1.2 V core supply in a 144-pin TQFP package. The -4 speed grade is intended for designs requiring the specified Spartan-3 performance class, while the C suffix identifies the commercial operating-temperature option documented by the available product data. An FPGA is a programmable logic device within the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function ASIC, an FPGA combines configurable logic, programmable routing, dedicated input/output resources, and embedded memory blocks on one device. This lets engineers revise digital architectures through configuration files instead of redesigning and fabricating custom silicon, making FPGAs useful for prototypes, industrial controllers, communication systems, and embedded signal-processing equipment. The Spartan-3 architecture provides 8,064 logic cells for implementing sequential and combinational functions. The device also includes 97 I/Os and 294,912 bits of block RAM, according to the DigiKey listing. A 1.2 V core operating voltage suits modern low-voltage digital designs, while the TQFP-144 package provides 144 leads for external power, configuration, clock, and user-interface connections. The part belongs to the Spartan-3 family, which combines programmable logic with dedicated multipliers, block RAM, and clock-management resources. Those blocks allow designers to implement parallel data paths, packet-processing pipelines, control logic, and memory-intensive functions without relying on external discrete logic. The commercial-temperature C-grade designation supports product designs operating from 0 °C to 85 °C when all specified electrical and environmental limits are observed. Typical uses include industrial automation, communication equipment, embedded control, test and measurement, video and image processing, and general-purpose digital prototyping. The 97 available I/Os are particularly useful for parallel buses, counters, status signals, memory interfaces, and communication links. Designers should account for configuration startup behavior, clocking, decoupling, and I/O-standard requirements when planning the surrounding PCB. For a new board, place all supply pins and their associated decoupling capacitors according to the manufacturer layout guidance, keep sensitive clock and configuration routing away from noisy digital nets, and validate every interface voltage against the selected I/O standard. Existing XC3S400 TQFP-144 designs should compare device speed grade, temperature grade, package drawing, configuration interface, and supply requirements before selecting a replacement. This page consolidates verified distributor information, same-family drop-in alternatives, commercial availability data, and practical migration guidance. It is intended to accelerate component identification and sourcing without presenting unverified package details or unsupported cross-brand substitutions as drop-in replacements.

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