XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx
MPN: XC3S200-4PQ208C ✗ Son Kullanım ZamanıXC3S200-4PQ208C Genel Bakış
A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O paths are configured after manufacture. Within the product hierarchy, the XC3S200-4PQ208C is an FPGA, then a programmable-logic device, and ultimately a semiconductor. Compared with fixed-function logic ICs, an FPGA lets engineers implement parallel processing, control, communications, and signal-generation functions in one reconfigurable device while retaining the same package and pinout across design revisions.
The supplied product data identifies 141 I/O, 4,320 logic cells, 480 CLBs, 221,184 RAM bits, and 200,000 system gates. The “-4” speed designation and an associated listing report 630 MHz performance, while the commercial “C” suffix identifies the specified temperature grade. Its 208-pin PQFP package exposes substantially more device I/O than the smaller 100-pin Spartan-3A options, making it suitable for designs with wider external buses or more peripheral connections.
The XC3S200-4PQ208C fits industrial control, communications infrastructure, embedded instrumentation, video processing, test equipment, and legacy embedded systems. A practical design can use its programmable logic for parallel data acquisition, protocol conversion, signal conditioning, and supervisory control while retaining configuration data in external nonvolatile flash. Engineers should verify every power rail, configuration interface, and high-speed I/O constraint against the complete Spartan-3 documentation before layout release.
Power and termination design remain central to reliable FPGA implementation. Provide the specified core and I/O supplies, route each supply through its documented decoupling network, and use a configuration scheme that matches the board’s flash and control logic. Because the supplied excerpts do not provide full electrical limits, pin assignments, or power-budget data, those details require confirmation from the manufacturer’s official Spartan-3 documentation before schematic completion.
This page consolidates verified distributor specifications, same-package family comparisons, commercial availability references, and application-specific engineering guidance. It distinguishes the XC3S200-4PQ208C from smaller Spartan-3 packages and higher-density PQFP208 devices, helping engineers determine whether the device’s logic, memory, I/O, and thermal requirements align with an existing 208-pin PCB design.
Drop-in alternatifler için XC3S200-4PQ208C — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller XC3S200-4PQ208C (aynı form faktörü ve ayağa oturma) — farklı olan Configurable Logic Blocks, Device Type, Logic Cells, Operating Temperature, System Gates.
XC3S200-4PQ208I
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →XC3S200-4PQG208C
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
XC3S250E-4PQG208I
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
XC3S400-4PQ208C
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
XC3S200-4PQ208C Maksimum Değerlendirmeler & Elektriksel Özellikler
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 200,000 gates |
| Logic Cells | 4,320 cells |
| Configurable Logic Blocks | 480 CLBs |
| Total RAM | 221,184 bits |
| Number of I/O | 141 I/O |
| Maximum Performance | 630 MHz |
| Core Supply Voltage | 1.2 V |
| İşletim Sıcaklığı | 0°C to 85°C |
| Paket | 208-pin PQFP |
| Package Family | PQFP family |
| Package Code | PQ208 |
| Montaj Stili | SMD |
| Package Body | 28 mm × 28 mm |
| Lead-Free Packaging | Lead-free |
XC3S200-4PQ208C 28 mm × 28 mm Pin Yapısı Kılavuzu
XC3S200-4PQ208C (28 mm × 28 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: XC3S200-4PQ208C.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
XC3S200-4PQ208C için uygundur 6 uygulamas: Industrial Control and Automation, Communications Infrastructure, Embedded Instrumentation, Video and Image Processing, Test and Measurement Equipment, Data Acquisition and Signal Conditioning.
Industrial Control and Automation
The XC3S200-4PQ208C fits industrial controllers that need parallel logic, multiple external interfaces, and configurable timing within a 0°C to 85°C environment. Its 4,320 logic cells, 480 CLBs, 221,184 RAM bits, and 141 I/O can support sequencing, machine-state control, data acquisition, and peripheral interfacing without a fixed-function controller. Place it beside the sensors and actuators, use the 1.2 V core rail with documented decoupling, and preserve separate I/O supplies where required. Verify industrial vibration, temperature, and transient requirements at the system level.
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Communications Infrastructure
The XC3S200-4PQ208C is suitable for legacy protocol converters, line-card control, and communications test equipment where parallel logic and numerous external signals are required. Its 141 I/O allow simultaneous connections to transceivers, memories, status interfaces, and configuration logic, while the programmable architecture supports packet framing, CRC, buffering, and state-machine functions. The 208-pin PQFP footprint is substantial, so layout must account for controlled-impedance routing and clean return paths. Confirm configuration-memory interfaces and I/O standards against the complete Spartan-3 documentation.
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Embedded Instrumentation
For embedded instrumentation, the XC3S200-4PQ208C can combine trigger sequencing, measurement control, data formatting, and front-panel or communications logic in one programmable device. Its 221,184 RAM bits provide useful on-chip working storage, and the 4,320-cell logic fabric can implement concurrent measurement pipelines. The 141 available I/O also make the device practical for multi-channel acquisition and legacy peripheral buses. Engineers should define clock domains carefully, constrain timing, and isolate analog interfaces from digital switching activity to avoid compromising measurement accuracy.
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Video and Image Processing
The XC3S200-4PQ208C can support legacy pixel-stream processing, test-pattern generation, timing control, and interface translation in industrial imaging systems. Its 4,320 logic cells and 221,184 RAM bits are suitable for parallel pipelines when the required line-buffer depth and pixel width remain modest. The 141 I/O provide broad connectivity to sensors, memory, and display interfaces. Clock-domain-crossing and video-timing constraints should be entered in the FPGA tool, while power and ground distribution must keep the 1.2 V core supply quiet.
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Test and Measurement Equipment
The XC3S200-4PQ208C is appropriate for programmable test equipment requiring flexible sequencing, pattern generation, and numerous instrument-control signals. Its 480 CLBs and 4,320 logic cells can execute control and acquisition functions concurrently, while 141 I/O reduce the need for external glue logic. For instruments spanning more than the commercial temperature band, evaluate the industrial-grade XC3S200-4PQ208I. Timing-sensitive paths require explicit clock constraints, and analog test paths should remain physically separated from the FPGA's digital switching regions.
Önerilen
Data Acquisition and Signal Conditioning
The XC3S200-4PQ208C can implement multichannel acquisition control, digital filtering, thresholding, and data packing in an embedded system. The 221,184 RAM bits offer local buffering, while 4,320 logic cells and 141 I/O support parallel channels and control peripherals. Its 1.2 V core supply is appropriate for modern programmable-logic implementations, but the board still needs comprehensive decoupling and defined input thresholds. Validate sampling paths with FPGA timing analysis and keep sensitive analog nodes away from high-current output-return paths.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: XC3S200-4PQ208C — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | XC3S200-4PQ208I | XC3S200-4PQG208C | XC3S250E-4PQG208I | XC3S400-4PQ208C |
|---|---|---|---|---|---|
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Package | 208-pin PQFP | 208-pin PQFP | 208-pin PQFP | 208-pin PQFP | 208-pin PQFP |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3E | Spartan-3 |
Ana Farklılayıcılar
- Provides a larger PQ208 I/O interface than smaller Spartan-3 packages (karşılaştırma:XC3S200A-4VQG100I)
- Commercial-temperature grade is distinguished from the industrial suffix (karşılaştırma:XC3S200-4PQ208I)
- Uses a 4,320-cell Spartan-3 configuration with 221,184 RAM bits (karşılaştırma:XC3S250E-4PQG208I)
- Lower density than a PQ208 XC3S400 upgrade (karşılaştırma:XC3S400-4PQ208C)
Tasarım Notları
The verified Mouser listing identifies a 1.2 V core supply, but it does not provide the complete power-up sequence, current limits, or auxiliary rail requirements. Base the schematic on the official Spartan-3 power table for the exact speed grade and package. Place the required bulk and local decoupling capacitors next to their associated supply pins, preserve the recommended supply topology, and verify power sequencing against the device configuration requirements.
Treat the 208-pin PQFP as a high-pin-count mixed-signal component even when the design is primarily digital. Reserve the official land pattern with its documented pin-1 orientation, route high-speed or clock nets away from switching I/O, and provide a continuous ground reference where possible. The supplied excerpts do not contain the official pin table, so do not infer pin assignments from package position; verify every connection against the manufacturer package drawing.
A matching PQ208 package name does not by itself prove that every suffix is a drop-in replacement. Confirm speed grade, temperature grade, device resources, configuration mode, I/O standards, and supply pins before substituting XC3S200-4PQ208I, XC3S200-4PQG208C, XC3S250E-4PQG208I, or XC3S400-4PQ208C. Higher-density devices can alter routing and timing even when they use the same footprint, so retarget and revalidate the FPGA design.
Use explicit clock constraints and analyze every high-speed interface in the FPGA implementation tool. The reported 630 MHz is a device performance figure, not a guarantee that every path will close timing at that rate. Apply the documented I/O drive, slew, loading, and termination rules for the selected logic standard, and keep external clock and configuration signals away from noisy switching outputs.
Uyumluluk Bilgisi
The verified catalog information identifies the exact target as lead-free. Explicit RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals declarations were not included in the supplied excerpts, so those fields remain unknown.