A3PE3000-2FGG484I vs A3PE3000-1FGG484I Karşılaştırma
Ayrıntılı yan yana karşılaştırma A3PE3000-2FGG484I tarafından Microchip Technology ve A3PE3000-1FGG484I tarafından Microchip TechnologyAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Microchip Technology
A3PE3000-2FGG484I - 3M-Gate Flash FPGA 341 I/O BGA-484 | Microchip
A3PE3000-2FGG484I ✓ AktifMicrochip Technology
A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
A3PE3000-1FGG484I ✓ AktifÖzellik Karşılaştırması
| Parametre | A3PE3000-2FGG484I | A3PE3000-1FGG484I |
|---|---|---|
| Marka | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3,000,000 (3M) |
| User I/O | 341 | — |
| Family | ProASIC3E (Flash) | — |
| Configuration Memory | Nonvolatile on-chip Flash | — |
| Speed Grade | -2 | -1 |
| Paket | 484-Ball FBGA | 484-ball FBGA, 1.0 mm pitch (FGG484) |
| Montaj Türü | Surface Mount | Surface Mount |
| İşletim Sıcaklığı | -40C to +100C (Industrial, I suffix) | 0 to 70 C (per Digchip listing; confirm I-grade limits) |
| Programming | In-system, live field upgrade | — |
| Soft Processor Support | Optional soft ARM support | — |
| Configuration Bits | 516096 | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM capacity] | — |
| Core Supply Voltage | [DATA_NEEDED: Core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage range] | — |
| PLLs | [DATA_NEEDED: Number of PLLs] | — |
| RoHS Durumu | Compliant (green package per manufacturer data) | Compliant (FGG green package) |
| Product Family | — | ProASIC3E |
| Logic Elements | — | 35,000 |
| Embedded SRAM | — | 504 Kbits (516,096 bits) |
| User I/O (FGG484) | — | 341 |
| Total Balls | — | 484 |
| Logic Family | — | CMOS |
| Besleme Gerilimi | — | 1.5 V |
| System Performance | — | 231 MHz |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Max User I/O (Family) | — | 616 |