EPM240GM100C5N vs EPM240GF100I5N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EPM240GM100C5N tarafından Altera ve EPM240GF100I5N tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Altera
EPM240GM100C5N - 192-Cell MAX II G CPLD, 4.7ns, 100-MBGA | Intel / Altera
EPM240GM100C5N ✓ AktifÖzellik Karşılaştırması
| Parametre | EPM240GM100C5N | EPM240GF100I5N |
|---|---|---|
| Marka | Altera | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | MAX II G | — |
| Logic Elements | 240 (192 macrocells) | — |
| User I/Os | 80 | — |
| Pin-to-Pin Delay (tPD) | 4.7 ns | — |
| Paket | 100-MBGA (Micro FineLine BGA), 6 x 6 mm | 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch |
| Ball Pitch | 0.5 mm | — |
| Supply Voltage - Core | 3.3 V | — |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt) | — |
| Programming Interface | JTAG (IEEE 1149.1) - ISP | — |
| Configuration Memory | Non-volatile Flash | — |
| İşletim Sıcaklığı | -40 C to +125 C | — |
| Lead Free / RoHS | Yes / Compliant | — |
| MSL Seviyesi | 3 | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| Process Technology | CMOS, Flash-based | — |
| Series | — | MAX II |
| Logic Elements / Blocks | — | 240 LE |
| Number of Macrocells | — | 192 |
| Maximum User I/O | — | 80 |
| Propagation Delay (tpd, max) | — | 4.7 ns |
| Programmable Type | — | In-System Programmable (ISP) |
| Non-Volatile Memory | — | On-chip flash configuration |
| Internal Supply Voltage | — | 1.71 V to 1.89 V (regulated on-chip) |
| I/O Supply Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature (TJ) | — | -40 C to +100 C |
| JTAG Support | — | IEEE 1149.1 / IEEE 1532 compliant |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| Logic Family | — | CMOS |
| Vertical Migration Family | — | EPM240 / EPM570 / EPM1270 / EPM2210 in same-package footprint |