LPC55S28JBD64E vs LPC55S26JBD64E Karşılaştırma
Ayrıntılı yan yana karşılaştırma LPC55S28JBD64E tarafından NXP Semiconductors ve LPC55S26JBD64E tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | LPC55S28JBD64E | LPC55S26JBD64E |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Core Processor | Arm Cortex-M33 | ARM Cortex-M33 (r0p3) |
| Core Size | 32-Bit | 32-bit |
| Azami Saat Hızı | 150 MHz | 150 MHz |
| Flash Memory Size | 512 KB (512K x 8) | — |
| SRAM Size | 128 KB | — |
| Series | LPC55S2x | — |
| Paket | 64-HTQFP (10x10 mm) | 64-HTQFP (10 x 10 mm) |
| Montaj Türü | Surface Mount | Surface Mount |
| Security Features | TrustZone, PUF-based security (S-series) | AES, PUF, SHA, CRC, RNG |
| Memory Protection Unit | Yes (MPU) | — |
| Interrupt Controller | NVIC with NMI input (selectable sources) | NVIC with NMI input (selectable sources) |
| İşletim Sıcaklığı | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Besleme Gerilimi | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Nem Hassasiyet Seviyesi (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Maximum Time at Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| RoHS Durumu | Compliant (e3 lead-free finish) | — |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Flash Memory | — | 256 KB |
| SRAM | — | 256 KB |
| Connectivity | — | USB HS, I2C, SPI, UART/USART, I2S, SDIO |
| Peripherals | — | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor |
| ADC Resolution | — | 16 bit |
| ADC Conversion Rate | — | 1.0 Msamples/sec |
| Memory Protection | — | MPU (Memory Protection Unit) |