MPC8272VRTIEA vs MPC8248VRTIEA Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC8272VRTIEA tarafından NXP Semiconductors ve MPC8248VRTIEA tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC8272VRTIEA - PowerQUICC II, 400MHz, 516-FPBGA SoC MPU | NXP
MPC8272VRTIEA ✓ AktifNXP Semiconductors
MPC8248VRTIEA - PowerQUICC II 400MHz MPU | NXP 516-PBGA
MPC8248VRTIEA ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | MPC8272VRTIEA | MPC8248VRTIEA |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Son Alış Zamanı |
| Core Architecture | PowerPC G2_LE (PowerQUICC II) | — |
| Number of Cores | 1 | — |
| Veri Bus Genişliği | 32-bit | — |
| Maximum Core Frequency | 400 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| L1 Instruction Cache | 16 Kbyte | — |
| L1 Data Cache | 16 Kbyte | — |
| Integrated Communications Module | CPM (HDLC, Ethernet, ATM, UTOPIA L2) | — |
| Integrated Security Engine | SEC (DES / 3DES / AES / SHA-1) | — |
| PCI Interface | 32-bit, up to 66 MHz | — |
| USB Interface | USB 1.1 host/device | — |
| External Memory Bus | 64-bit PowerPC 60x bus, 133 MHz | — |
| Paket | 516-FPBGA, 27 x 27 mm | — |
| Montaj Türü | Surface Mount | — |
| İşletim Sıcaklığı Aralığı | 0 C to +105 C | — |
| RoHS Durumu | RoHS Compliant | Compliant |
| Lead Free | Yes | — |
| Family | MPC82xx PowerQUICC II | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II (MPC82xx) |
| Core Processor | — | PowerPC G2_LE |
| Number of Cores / Bus Width | — | 1 Core / 32-Bit |
| Core Frequency | — | 400 MHz |
| Co-Processors / DSP | — | Communications Processor Module (CPM); Security Engine (SEC) |
| Core Voltage | — | 1.5 V |
| I/O Voltage | — | 3.3 V |
| İşletim Sıcaklığı | — | 0 C to +105 C |
| Paket / Kas | — | 516-PBGA (27 mm x 27 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 0.13 um HiP7 |
| On-Chip Connectivity | — | PCI, USB, 10/100 Ethernet via CPM, I2C, SPI, UART |
| Memory Controller | — | DDR SDRAM |