THS3061DGNR vs THS3061DGN Karşılaştırma
Ayrıntılı yan yana karşılaştırma THS3061DGNR tarafından Texas Instruments ve THS3061DGN tarafından Texas InstrumentsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Texas Instruments
THS3061DGNR - 300MHz 7000V/us CFB Amplifier | Texas Instruments
THS3061DGNR ✓ AktifTexas Instruments
THS3061DGN - 300MHz CFA, 7000V/us Slew Rate | Texas Instruments
THS3061DGN ✓ AktifÖzellik Karşılaştırması
| Parametre | THS3061DGNR | THS3061DGN |
|---|---|---|
| Marka | Texas Instruments | Texas Instruments |
| Kategori | Amplifier ICs | Amplifier ICs |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Amplifier Type | Current Feedback (CFB) | Current Feedback Amplifier (CFA) |
| Number of Channels | 1 | 1 |
| Unity Gain Bandwidth | 300 MHz | 300 MHz |
| 0.1 dB Bandwidth | 120 MHz (G = 2) | 120 MHz (G=2) |
| Slew Rate | 7000 V/us | 7000 V/us |
| Output Current | +/-145 mA into 50 ohm | +/-145 mA into 50 ohms |
| 2nd Harmonic Distortion | -81 dBc at 10 MHz | — |
| Supply Voltage Range | +/-15 V (30 V total) | [DATA_NEEDED: supply voltage range] |
| İşletim Sıcaklığı Aralığı | -40C to +85C | — |
| Paket | HVSSOP-8 (DGN) with PowerPAD, 8 pins | 8-Pin HVSSOP (DGN) with PowerPAD |
| Montaj Türü | Surface Mount | Surface Mount |
| Process Technology | TI BICOM-1 | TI BICOM-1 complementary bipolar |
| Packaging | Tape & Reel (R suffix) | — |
| Kategori | Linear - Amplifiers - Instrumentation, Op Amps, Buffer Amps | — |
| Input Voltage Noise | [DATA_NEEDED: input voltage noise] | [DATA_NEEDED: input voltage noise] |
| Durağan Akım | [DATA_NEEDED: quiescent current] | [DATA_NEEDED: quiescent current] |
| Input Offset Voltage | [DATA_NEEDED: input offset voltage] | — |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Harmonic Distortion | — | -81 dBc at 10 MHz |
| İşletim Sıcaklığı | — | -40C to +85C |
| Input Bias Current | — | [DATA_NEEDED: input bias current] |
| Thermal Pad | — | PowerPAD (exposed pad on package bottom) |