Bugün ne değişti, bunun BOM için neden önemli olduğunu ve dikkat edilmesi gerekenler. Her faktüsal iddia kaynağına takip edilebilir; kendi analizi etiketlenir ve ayrı tutulur
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Keychron has opened pre-orders for the G6 HE Hall effect wireless gaming mouse at $89.99, with shipping slated for late November and full specs now disclosed.
NXP introduces the FRDM-IMXRT1186 dev board with an 800 MHz Cortex-M7 and 300 MHz Cortex-M33 SoC, four Ethernet ports, and Arduino/FRDM expansion.
ASRock Industrial ships NUC BOX-304/320 mini PCs and bare motherboards on Intel Wildcat Lake-U, targeting edge and industrial builds with DDR5-6400 ECC and dual 2.5GbE.
Open-source ESP-SDR firmware routes ESP32 I/Q baseband samples over USB or UART, covering 2.4 GHz on most chips and 4.8–6.0 GHz on ESP32-C5.
Geekworm and Mcuzone ship a 5V/5A supercapacitor UPS HAT for the Raspberry Pi 5 in 22F/60F/100F variants, with pogo-pin detection and I2C telemetry.
DEBIX has launched an industrial-grade SBC powered by MediaTek's Genio 720 (MT8391) SoC with a 9-TOPS NPU, dual-display interfaces, and a -40°C to 85°C range.
Nuvoton expanded the NuMicro MA35D0 series with three LQFP128 parts and launched the NuMaker-IoT-MA35D0-A2 board, pairing dual Cortex-A35 with a Cortex-M4 for real-time I/O.
Efinix brings a configurable VexiiRiscv-based 64-bit RISC-V SoC to its Titanium and Trion FPGAs, with DDR3, LPDDR4x, and HyperRAM support for embedded designs.
Rapidus launches its Collaborative Open Rapid Ecosystem with Design Solution Associates, naming 17 design firms across EDA, IP, and chip design to back its 2nm foundry.
Saras Micro Devices' STILE module moves decoupling capacitors into the package substrate to shorten the VRM-to-load path and free PCB underside real estate for vertical power delivery in AI accelerators.
Toshiba adds four low-power dual-channel digital isolators drawing 0.2 mA per channel, rated for 25 Mbps, 30 kV/mus CMTI, and 3,000 Vrms isolation.
Nanoramic launches an eight-product NXSP binder catalog covering nickel-based and LFP cathodes plus Si-C anodes, framed as drop-in for mass production lines.
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