10M40DAF672C7G - MAX 10 FPGA 40K LE 672-BGA | Intel
MPN: 10M40DAF672C7G ✓ Aktif10M40DAF672C7G Genel Bakış
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that allows hardware designers to implement arbitrary digital circuits after PCB fabrication. The MAX 10 family sits at the intersection of CPLD and high-density FPGA: it offers instant-on non-volatile configuration via on-die flash, eliminating external boot memories. Within Intel's programmable-logic taxonomy, MAX 10 ranks as a low-power, low-cost, non-volatile FPGA suitable for I/O expansion, bridging, motor control, and industrial automation.
Key differentiating features of the 10M40DAF672C7G include 40K logic elements (the largest density in the MAX 10 family), 1.29 Mbit user flash, 5,888 Kbit embedded SRAM, 4 PLLs, 2 I/O banks with LVDS support, and an integrated 12-bit 1 MSPS ADC with up to 17 analog inputs. The 672-FBGA package exposes 500 general-purpose I/Os - the highest user-IO count in the family - making it suitable for high-pin-count bridging and parallel-processing designs. The device is offered in the commercial C7 speed grade (about -40 °C to +85 °C) and supports JTAG, AS, and PS configuration modes.
Architecturally, MAX 10 uses Logic Array Blocks (LABs) of 16 Adaptive Logic Modules (ALMs), each ALM containing an 8-input fracturable look-up table, two dedicated adders, and four registers. Embedded memory blocks (M9K) deliver true dual-port or single-port RAM, while DSP blocks support 18x18 signed multiplication. The on-die flash supports dual-boot images and instant-on operation, so the device behaves like a CPLD at power-up while retaining full FPGA flexibility.
Typical applications include industrial motor control and drive interfaces, multi-protocol industrial bridging (EtherCAT, PROFINET, Modbus), video processing and image-sensor aggregation, factory-automation PLCs, and portable medical instrumentation. The high IO count also makes it attractive for LED video-wall scan boards and avionics display controllers where every pin matters.
A practical design consideration: route LVDS pairs as length-matched 100 ohm differential nets and place the 1.2 V core decoupling capacitors as close as the FBGA's inner-row balls allow. Because the device integrates configuration flash, designers must still respect the dual-boot image boundary or risk bricking the part if the user image is corrupted during in-field updates.
This page synthesizes distributor pricing, same-package MAX 10 drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a single decision-ready reference.
Drop-in alternatifler için 10M40DAF672C7G — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller 10M40DAF672C7G (aynı form faktörü ve ayağa oturma) — farklı olan Package, Configuration Memory, Speed Grade, Operating Temperature, DSP Blocks.
10M40DAF672C8G
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10M40DAF672I7G
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10M40DCF672C8G
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →10M25DAF672C7G
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
10M40DAF672C7G Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded SRAM (bits) | 1,290,240 |
| User Flash Memory (bits) | 5,888,000 |
| Maximum User I/O | 500 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Number of PLLs | 4 |
| ADC Blocks | 1 x 12-bit, 1 MSPS, up to 17 analog inputs |
| DSP Blocks | 18x18 multipliers |
| Paket | 672-ball FBGA (F672) |
| İşletim Sıcaklığı | -40 C to +85 C (C7 commercial grade) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Montaj Türü | Surface Mount |
| RoHS Durumu | Compliant |
10M40DAF672C7G 672-ball fbga (f672) Pin Yapısı Kılavuzu
10M40DAF672C7G (672-ball fbga (f672) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: 10M40DAF672C7G.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
10M40DAF672C7G için uygundur 6 uygulamas: Industrial Motor Control & Drive Interface, Multi-Protocol Industrial Bridging (EtherCAT/PROFINET/Modbus), Video Processing & Image-Sensor Aggregation, Factory Automation PLCs, LED Video Wall Scan Boards, Portable Medical Instrumentation.
Industrial Motor Control & Drive Interface
The 10M40DAF672C7G fits motor-control designs because its 500 user I/Os and 40K LE fabric can run multi-axis field-oriented control (FOC) state machines, encoder interfaces (EnDat, BISS, SSI), and current-loop PWM generation in parallel. The integrated 12-bit 1 MSPS ADC samples motor phase currents directly, eliminating an external ADC for sub-100 A drives. Combined with the on-die flash that supports instant-on dual-boot for failsafe firmware rollback, the part enables safe industrial drive platforms with a single device.
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Multi-Protocol Industrial Bridging (EtherCAT/PROFINET/Modbus)
Industrial bridging gateways need abundant logic, fast parallel I/O, and deterministic latency - all of which the 10M40DAF672C7G provides. The 40K LE fabric comfortably implements multiple real-time Ethernet protocols concurrently (EtherCAT slave, PROFINET IRT, Modbus TCP) with custom glue logic. The 500 user I/Os drive SPI, UART, and parallel side-channels for legacy field-bus devices, while the on-die flash stores protocol firmware images for instant-on boot in cold industrial environments.
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Video Processing & Image-Sensor Aggregation
The 10M40DAF672C7G's 500 user I/Os accept MIPI-CSI-2 demultiplexed lanes, parallel CMOS image-sensor buses, or HDMI side-channels, while the 40K LE fabric runs image-processing pipelines (color-space conversion, basic histogram, de-Bayer). The 1.29 Mbit embedded SRAM buffers line buffers for 720p pipelines without external memory. Compared with smaller MAX 10 members, the 672-FBGA package doubles the LVDS pair count available for high-speed image-sensor interfaces.
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Factory Automation PLCs
PLC designers value the 10M40DAF672C7G because 500 user I/Os cover hundreds of digital inputs and outputs without an I/O expander, and the on-die flash delivers instant-on ladder-logic boot in <100 ms. The integrated ADC scans analog sensor rails (pressure, flow, temperature) for IEC 61131-3 process-variable inputs. The 4 PLLs generate the jitter-clean clocks required for deterministic PLC scan times, while the 40K LE fabric runs custom safety logic (SIL-2 capable with external MCU supervision).
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LED Video Wall Scan Boards
LED video-wall scan boards demand high pin counts to drive dozens of RGB data lines simultaneously. The 10M40DAF672C7G's 500 user I/Os handle 16-32 parallel hub-card connections with refresh rates above 3,840 Hz, while the 40K LE fabric implements gamma correction, color-space mapping, and brightness compensation. The on-die flash stores calibration tables so the scan board boots instantly without external EEPROM, and the 1.29 Mbit SRAM buffers multi-row scan data without external memory.
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Portable Medical Instrumentation
Portable medical devices such as patient monitors benefit from the 10M40DAF672C7G's instant-on capability and high pin count for parallel sensor aggregation. The 12-bit ADC captures ECG, SpO2, and respiration waveforms directly, while 40K LE fabric runs digital filters and arrhythmia detection. The on-die flash supports secure dual-boot with rollback for FDA validation cycles, and the C7 commercial temperature grade is sufficient for clinical-environment operation. Compared to larger Cyclone or Arria FPGAs, MAX 10 keeps power consumption low enough for battery-powered designs.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: 10M40DAF672C7G — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | 10M40DAF672C8G | 10M40DAF672I7G | 10M40DCF672C8G | 10M25DAF672C7G |
|---|---|---|---|---|---|
| Package | 672-FBGA (F672) | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 |
| Maximum User I/O | 500 | 500 | 500 | 500 | 500 |
| Embedded SRAM (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 845,000 |
| User Flash (bits) | 5,888,000 | 5,888,000 | 5,888,000 | 5,888,000 | 4,608,000 |
| Speed Grade | C7 | C8 | C7 | C8 | C7 |
| Temperature Grade | Commercial (0 C to +85 C) | Commercial | Industrial (-40 C to +100 C) | Commercial | Commercial |
| Integrated ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS | 12-bit, 1 MSPS |
Ana Farklılayıcılar
- Largest logic density in the MAX 10 family at the 672-FBGA level (karşılaştırma:10M25DAF672C7G)
- Industrial temperature grade option on the same 672-FBGA footprint (karşılaştırma:10M40DAF672I7G)
- Faster C8 speed grade on the same 672-FBGA footprint (karşılaştırma:10M40DAF672C8G)
Tasarım Notları
The 672-FBGA FineLine BGA with 1.0 mm pitch requires a 6/6 mil (line/space) PCB stack-up with laser-drilled microvias for inner-row balls. Use a minimum 4-layer board with two inner solid-ground planes directly below the BGA, and stitch the GND balls with 0402 decoupling (100 nF X7R) placed within 1 mm of each supply ball. Estimated: with 200+ signal breakouts, route fanout needs a 1-2-3 stack-up; refer to the Intel MAX 10 hardware design guide for the exact breakout template.
The 1.2 V VCC core draws up to 600 mA during configuration flash programming; supply sequencing must hold the core rail within +/- 5 % during in-field updates or the flash may corrupt. Use the Intel MAX 10 power tree reference: a 3.3 V or 2.5 V intermediate rail feeding the on-die LDO regulators, plus a 10 uF bulk + 100 nF + 10 nF decoupling ladder on every VCC pin. Estimated quiescent current in user mode is ~120 mA with 5 % IO toggling.
Always instantiate the dual-boot image logic when designing for in-field firmware updates: the CFM0/CFM1 split allows failsafe rollback if a remote update is interrupted. Do not enable the JTAG pull-ups in the dual-purpose pin configuration - they conflict with shared user I/O when JTAG is not in use. Also respect the CONF_DONE pull-up timing window; if the line is held low beyond 50 ms after configuration, the device re-enters configuration mode unexpectedly.
LVDS pairs on MAX 10 require 100 ohm differential routing with intra-pair skew <20 ps; route on a single internal stripline layer and reference a continuous GND plane. For SDR DDR memory interfaces, place series-damping resistors close to the driver and match the trace impedance within 10 % - the on-die PLL output jitter is typically 80 ps peak-to-peak, leaving minimal margin for poorly terminated boards.
Uyumluluk Bilgisi
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this part is intended for industrial/consumer commercial environments; AEC-Q100 variants would require custom qualification.