APA150-FG256I - 150K Gate Flash FPGA | Microchip | 256-LBGA
MPN: APA150-FG256I ✓ AktifAPA150-FG256I Genel Bakış
An FPGA is a reprogrammable semiconductor containing configurable logic blocks, programmable interconnect, and input/output blocks. A ProASICPLUS device belongs to the FPGA and CPLD hierarchy while also providing ASIC-like design flow characteristics. Its embedded nonvolatile flash retains the programmed configuration without a separate configuration PROM and supports live reprogramming through the ProASICPLUS development environment. These characteristics make it useful where a design must be revised after fabrication or field-updated without replacing the device.
The principal feature of the APA150-FG256I is its 150,000-system-gate logic capacity combined with 186 I/O in a single 256-LBGA package. The 36,864 RAM bits provide on-chip storage for data-path buffering, control logic, and lookup functions. Its 0.22 µm flash-based implementation also allows the device to operate from its stored configuration at power-up, eliminating the serial configuration sequence required by SRAM-based FPGAs.
The ProASICPLUS architecture supports an ASIC-style design flow with synthesis, place-and-route, timing analysis, programming, and verification tools. The APA150 family combines nonvolatile flash configuration, reprogrammability, and deterministic power-up behavior. Designers therefore gain the flexibility of programmable logic while retaining the stability and predictability expected from a fixed-function implementation after the design is finalized.
Typical implementations include industrial control and data acquisition, networking and communications equipment, instrumentation, embedded video processing, test and measurement systems, and general-purpose hardware prototyping. The 186 available I/O support high pin-count designs in a compact 17 x 17 mm footprint, while the 180 MHz maximum frequency is suitable for control logic, protocol handling, and moderately parallel data-processing functions.
The principal design consideration is that a 256-ball BGA requires careful PCB layout, X-ray inspection, and process-capable assembly. Designers must follow the manufacturer's package, power-supply, decoupling, and programming recommendations. Because this legacy flash FPGA is normally specified by system architecture rather than modern high-speed prototyping needs, confirm timing closure, tool availability, and programming support before committing a new production design.
Drop-in alternatifler için APA150-FG256I — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller APA150-FG256I (aynı form faktörü ve ayağa oturma) — farklı olan Core Supply Voltage.
APA150-FG256
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →APA150-FG256IX79
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
APA150-FG256X79
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
APA150-FGG256
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
APA150-FGG256I
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
APA150-FG256I Maksimum Değerlendirmeler & Elektriksel Özellikler
| Product Type | ProASICPLUS field-programmable gate array (FPGA) |
| System Gates | 150,000 gates |
| User I/O Count | 186 I/O |
| Total RAM Bits | 36,864 bits |
| Azami Saat Hızı | 180 MHz |
| Process Technology | 0.22 µm |
| Core Supply Voltage | 2.5 V |
| Configuration Technology | Nonvolatile flash |
| İşletim Sıcaklığı Aralığı | -40 °C to +85 °C |
| Temperature Grade | Industrial |
| Manufacturer Package | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17 x 17 mm) |
| Package Dimensions | 17 x 17 mm |
| Terminal Count | 256 terminals |
| Terminal Form | Ball |
| Montaj Stili | Surface mount |
| Packaging Type | Tray |
| RoHS Durumu | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
APA150-FG256I 17 x 17 mm Pin Yapısı Kılavuzu
APA150-FG256I (17 x 17 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: APA150-FG256I.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
APA150-FG256I için uygundur 6 uygulamas: Industrial Control and Automation, Data Acquisition and Test Instrumentation, Communications and Protocol Bridging, Embedded Video and Image Preprocessing, Networking and Traffic Control, Hardware Prototyping and ASIC Emulation.
Industrial Control and Automation
The APA150-FG256I fits industrial controllers that combine parallel sensor interfaces, machine-state logic, and communications handling in one programmable device. Its 186 I/O provide ample connections for digital inputs, outputs, encoders, and discrete actuators, while 150,000 system gates provide capacity for protocol engines and supervisory control. Nonvolatile flash configuration supports immediate operation from stored logic after power restoration, which is useful in machinery where deterministic startup behavior is important. The -40 °C to +85 °C rating supports industrial environments, although the completed system must also satisfy its own thermal and EMC requirements. The 256-ball package permits dense routing, but it requires BGA-qualified assembly and careful power distribution.
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Data Acquisition and Test Instrumentation
The APA150-FG256I is well suited to modular data-acquisition equipment where multiple digital channels, control logic, and data buffering must share a compact programmable platform. Its 36,864 RAM bits can support state machines, sample buffering, and protocol formatting, while the 180 MHz maximum stated frequency provides margin for parallel datapath work. The 186 I/O simplify backplane routing without requiring multiple complex programmable devices. Because the configuration is stored in nonvolatile flash, the instrument can retain its control firmware and startup sequence across power cycles. Engineers should use the manufacturer's timing reports to verify that the selected clock target and I/O paths meet the acquisition specification, and should reserve board area for BGA inspection and rework.
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Communications and Protocol Bridging
The APA150-FG256I can implement protocol conversion, frame filtering, and interface bridging when a fixed design would require excessive logic duplication. Its 150,000 system gates allow parallel transmit and receive paths to coexist, and 186 I/O accommodate multiple byte-wide data interfaces alongside control signals. Flash-based configuration makes the device appropriate for field-updateable communication equipment because the logic image can be reprogrammed without replacing a separate configuration memory. The 180 MHz maximum clock supports moderate-rate processing, but system timing must be evaluated for the selected I/O standard and fabric path. External transceivers, isolation, and impedance-controlled board routing remain necessary when the design connects to physical communication lines.
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Embedded Video and Image Preprocessing
The APA150-FG256I can serve as a programmable front end for pixel routing, thresholding, timing generation, and sensor-interface control in embedded imaging systems. Its 186 I/O are useful for parallel camera-data capture, while 36,864 RAM bits allow line buffers or compact frame-processing state. The device's flash configuration enables a stable image-processing pipeline to be retained at power-up, and its maximum stated 180 MHz frequency is appropriate for modest parallel pipelines rather than high-definition streaming cores. Designers should constrain timing to the selected speed grade and verify the exact I/O timing in the manufacturer datasheet. External memory and high-speed video serializers may be required when bandwidth exceeds the internal fabric resources.
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Networking and Traffic Control
The APA150-FG256I is applicable to network-interface controllers, packet filters, and line-card functions where parallel datapath logic and moderate I/O density are required. Its 150,000 system gates can host multiple finite-state machines for header inspection, queue control, or protocol conversion, while the 186 I/O allow dedicated byte-wide interfaces and status signaling. Nonvolatile flash lets the device resume a stored configuration immediately after power restoration, supporting stable packet-processing startup. The 180 MHz maximum stated frequency gives adequate margin for many control-plane tasks but is not intended for high-speed packet switching. Designers should define timing constraints in the ProASICPLUS tools and validate signal integrity on high-speed external interfaces.
Önerilen
Hardware Prototyping and ASIC Emulation
The APA150-FG256I provides a practical platform for prototyping logic that will later be converted to an ASIC. The ProASICPLUS family supports an ASIC-style design flow, and nonvolatile flash makes it possible to iterate programmed logic without continually reconfiguring an SRAM device at every power cycle. A 150,000-gate capacity and 186 I/O support medium-complexity control, interface, and glue-logic prototypes. Engineers can preserve the programmed configuration for repeatable bench testing and production fixture setup. Migration readiness depends on following the manufacturer's supported design-entry and synthesis constraints. The 256-BGA footprint should be prototyped with assembly techniques capable of handling fine-pitch balls and inspected for hidden solder-joint defects.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: APA150-FG256I — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | APA150-FG256 | APA150-FG256IX79 | APA150-FG256X79 | APA150-FGG256 | APA150-FGG256I |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA, 17 x 17 mm | 256-LBGA, 17 x 17 mm | 256-LBGA, 17 x 17 mm | 256-LBGA, 17 x 17 mm | 256-LBGA, 17 x 17 mm | 256-LBGA, 17 x 17 mm |
| System Gates | 150,000 gates | 150,000 gates | 150,000 gates | 150,000 gates | 150,000 gates | 150,000 gates |
| User I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O |
| RAM Capacity | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits |
| Configuration Memory | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
| Temperature Designation | Industrial (I suffix) | Base designation | Industrial (I suffix) | Grade details require ordering-guide verification | Base designation | Industrial (I suffix) |
Ana Farklılayıcılar
- Industrial-temperature ordering option within the ProASICPLUS family (karşılaştırma:APA150-FG256)
- Nonvolatile live power-up configuration (karşılaştırma:APA150-FGG256)
- High I/O density in a compact BGA (karşılaştırma:APA150-FG256X79)
Tasarım Notları
Treat the 256-FPBGA as a fine-pitch BGA design rather than a conventional leaded package. Use the manufacturer's ball map and land-pattern drawing to define the escape routing, keep power and ground planes continuous beneath the device where the package guidance permits, and route sensitive fabric or clock inputs away from high-swing digital nets. Because the package is 17 x 17 mm with 256 balls, the escape region can be routing-limited, so complete fan-out and via-in-pad strategy before releasing the layout.
The APA150-FG256I uses a 2.5 V core supply. Follow the manufacturer's recommended supply topology, decoupling values, and power-up sequencing instead of copying a generic FPGA layout. Place high-frequency decoupling close to the device supply balls and keep the return path short to the ground plane. Estimate worst-case current from the selected speed grade and utilization report, then verify that the regulator, power-plane width, and external component temperature ratings cover that condition.
A matching package name does not by itself prove that an alternative MPN is an interchangeable production part. For APA150-FG256, APA150-FG256IX79, APA150-FG256X79, APA150-FGG256, and APA150-FGG256I, confirm the exact device identifier, speed grade, temperature range, silicon revision, and programming-file compatibility in the manufacturer ordering guide. Also verify that the replacement's pinout, I/O standards, and power requirements are identical before treating it as a drop-in substitution.
Clock and high-speed I/O timing must be evaluated for the exact APA150-FG256I speed grade rather than inferred from the family's 180 MHz maximum value. Apply synchronous design constraints, analyze the selected clock distribution, and leave margin for board skew and loading. External interfaces should use source-terminated or series-damped schemes where recommended, and unused inputs should be tied to a defined level to prevent floating behavior in the programmable logic.
Uyumluluk Bilgisi
The industrial temperature range is confirmed, but no RoHS, REACH, halogen-free, or conflict-minerals declarations were identified in the available product records. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified discrete semiconductor.
