EP20K200EFC484-1 - APEX 20KE FPGA 200K Gates 484-BGA | Altera
MPN: EP20K200EFC484-1 ⚠ Son Satın AlmaEP20K200EFC484-1 Genel Bakış
What is an FPGA? A Field Programmable Gate Array is a programmable logic device that combines the high integration of an ASIC with the flexibility of in-system reprogrammability. FPGAs contain configurable logic blocks (LEs), programmable interconnects, embedded memory (EAB/MegaLAB in the APEX 20K family), and I/O elements. APEX 20KE extends the APEX 20K architecture to 1.5 million system gates by adding LVDS, PLLs, and improved IOE performance, sitting in the hierarchy: APEX 20KE -> APEX 20K family -> FPGA -> programmable logic -> semiconductor IC.
Key features include 8320 logic elements, 106496 bits of embedded system memory, 376 maximum user I/O, 4 phase-locked loops (PLLs) for clock management, support for LVDS, PCI, and other high-speed I/O standards, and in-system programmability through the IEEE 1149.1 JTAG interface. The MegaLAB structure groups 16 Logic Elements plus a dual-port Embedded System Block (ESB), enabling efficient wide-function implementation.
The APEX 20KE architecture uses a MultiCore interconnect with continuous, predictable routing delays across the device. Each IOE contains registers for input, output, output-enable, and clock signals, supporting double-data-rate transfer, alignment, and series/parallel termination. The 4 PLLs provide clock multiplication, division, and phase shifting for high-speed serial protocols and memory interfaces.
Typical applications include telecommunications backplane glue logic, PCI/PCI-X bus interfaces, LVDS-based data transport, digital signal processing front-ends, and embedded control systems. The 484-FBGA package with 376 user I/Os is suited for high-pin-count designs in industrial and networking equipment.
Designers should note that APEX 20KE devices operate from a 1.8 V core supply but support multi-voltage I/O banks (1.5 V, 1.8 V, 2.5 V, 3.3 V) for mixed-voltage system integration. The Quartus II and MAX+PLUS II design tools are used for synthesis, place-and-route, and bitstream generation; legacy support is essential since the device is mature.
Drop-in alternatifler için EP20K200EFC484-1 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP20K200EFC484-1 (aynı form faktörü ve ayağa oturma) — farklı olan Package, Operating Temperature, System Gates, Speed Grade, Family.
EP20K200EFC484-1N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K200EFC484-2
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EP20K200EFC484-3
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EP20K200EFC484-2X
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K400EFC484-1X
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EP20K400EFC484-2X
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EP20K200EFC484-1 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | APEX 20KE |
| Logic Elements / Cells | 8320 |
| System Gates | 200000 |
| Embedded Memory (Bits) | 106496 |
| Maximum User I/O | 376 |
| Number of PLLs | 4 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| Paket | 484-BGA (FineLine BGA) |
| Package Ball Count | 484 |
| Montaj Türü | Surface Mount |
| İşletim Sıcaklığı | -40 °C to +85 °C (industrial, inferred from grade code) |
| I/O Standard Support | LVDS, PCI, LVTTL, LVCMOS, SSTL, HSTL |
| Programming Interface | IEEE 1149.1 JTAG, passive serial, passive parallel |
EP20K200EFC484-1 484 Pin Yapısı Kılavuzu
EP20K200EFC484-1 (484 paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP20K200EFC484-1.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP20K200EFC484-1 için uygundur 6 uygulamas: Telecommunications Backplane Glue Logic, PCI / PCI-X Bus Interface Bridge, LVDS High-Speed Data Transport, Industrial Control and Embedded Systems, Digital Signal Processing Front-End, Legacy System Maintenance and Field Replacement.
Telecommunications Backplane Glue Logic
The EP20K200EFC484-1's 8,320 logic elements and 376 user I/Os are well suited to telecom backplane glue logic, where it bridges busses, performs protocol conversion, and aggregates data between line cards. Its 1.8 V core with multi-voltage I/O bank support (1.5/1.8/2.5/3.3 V) interfaces directly to legacy 3.3 V bus devices while consuming minimal power, and the 4 PLLs synthesize the multiple clocks required by SONET/SDH and ATM interfaces. Used as the central fabric between TDM and packet domains, the device replaces multiple discrete PAL/GAL chips and reduces board area.
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PCI / PCI-X Bus Interface Bridge
The 376 user I/Os and embedded memory of the EP20K200EFC484-1 comfortably support 32-bit and 64-bit PCI and PCI-X bus bridging in industrial and embedded systems. The IOE supports 3.3 V PCI signaling with 5 V tolerance on inputs (per APEX 20KE datasheet IOE specs) and integrates on-chip series/parallel termination, eliminating external resistors. Designers implement target/initiator state machines, address decoding, and DMA channels in the MegaLAB structure, while the 106,496 embedded-memory bits buffer bursts efficiently.
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LVDS High-Speed Data Transport
The EP20K200EFC484-1 supports LVDS I/O through its IOE block, enabling high-speed point-to-point serial links between FPGAs or to external serializer/deserializer (SerDes) devices. Up to 376 user I/Os translate to roughly 80-90 LVDS differential pairs in a typical 4:1 data-to-clock ratio, sufficient for protocol bridging in telecom line cards and test equipment. The 4 on-chip PLLs generate the high-speed and low-skew clocks required by LVDS channels, while the 8320 logic elements implement channel encoding, framing, and link-layer state machines.
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Industrial Control and Embedded Systems
With industrial temperature operation inferred from the speed-grade code and 376 user I/Os, the EP20K200EFC484-1 serves as a flexible controller in factory-automation PLCs, motor-control boards, and test instruments. The device aggregates analog/digital converter data, drives display and key-panel interfaces, and runs custom control algorithms in its logic fabric. The 106,496 embedded-memory bits provide data buffering for sensor streams, while the LVDS and PCI I/O standards simplify integration with high-speed ADCs and host processors.
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Digital Signal Processing Front-End
The EP20K200EFC484-1's MegaLAB structure, 8,320 logic elements, and 4 PLLs make it suitable for DSP front-end tasks such as FIR filtering, FFT pre-processing, and channel equalization in software-defined radio and baseband designs. The dual-port Embedded System Block (ESB) memory at 106,496 bits stores coefficients and delay lines, while the high fanout routing fabric supports parallel multiplier trees. The 1.8 V core reduces dynamic power relative to 3.3 V FPGAs, important for fanless embedded enclosures.
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Legacy System Maintenance and Field Replacement
Because the EP20K200EFC484-1 is in last-time-buy status, much of its current demand comes from maintenance of installed telecom, industrial, and military systems where a board-level repair is required without full re-design. The device's JTAG-based in-system programmability allows field firmware updates, and the 484-BGA footprint is shared with the EP20K200EFC484-1N and speed-grade variants, so a single PCB accepts several end-of-life substitutes. Channel inventory remains available through brokers and authorized distributors.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: EP20K200EFC484-1 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP20K200EFC484-1N | EP20K200EFC484-2 | EP20K200EFC484-3 | EP20K400EFC484-1X | EP20K400EFC484-2X |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same |
| Logic Elements | 8320 | 8320 | 8320 | 8320 | 16640 (+100%) | 16640 (+100%) |
| System Gates | 200000 | 200000 | 200000 | 200000 | 400000 (+100%) | 400000 (+100%) |
| Embedded Memory (bits) | 106496 | 106496 | 106496 | 106496 | 212992 (+100%) | 212992 (+100%) |
| Maximum User I/O | 376 | 376 | 376 | 376 | 376 (same) | 376 (same) |
| Speed Grade | -1 (slowest) | -1 | -2 (faster) | -3 (fastest) | -1 | -2 |
| Ball Finish | SnPb (lead) | Lead-free (NiPdAu) | SnPb | SnPb | Lead-free | Lead-free |
Ana Farklılayıcılar
- Identical silicon and pinout as base part, with lead-free ball finish (karşılaştırma:EP20K200EFC484-1N)
- Faster static timing without changing the PCB (karşılaştırma:EP20K200EFC484-2)
- Doubled logic and memory in the same footprint (karşılaştırma:EP20K400EFC484-1X)
Tasarım Notları
The EP20K200EFC484-1 requires a 1.8 V VCCINT supply and separate VCCIO banks configurable to 1.5 V, 1.8 V, 2.5 V, or 3.3 V. According to the APEX 20KE datasheet, designers must provide bulk decoupling on each supply rail and place 0.1 µF high-frequency bypass capacitors within 0.25 inch of every power pin. Power sequencing (VCCINT before VCCIO) is recommended to avoid I/O latch-up during power-up; many designs add a power-good supervisor to enforce this order.
In a 484-BGA package, the EP20K200EFC484-1 dissipates heat primarily through the internal ground/power balls; PCB thermal design requires a 4-6 layer stack-up with continuous power and ground planes directly under the BGA. Without thermal vias to inner copper planes, junction temperature can exceed 100 °C at full logic utilization and 200 MHz internal clock. Estimated: with 16 thermal vias (0.3 mm drill, 1 oz plating) the package theta-JA drops to roughly 12-15 °C/W, adequate for most industrial environments.
The 484-BGA uses 1.00 mm ball pitch; PCB fabrication requires laser-drilled microvias or 0.4 mm-pitch via-in-pad technology, and solder paste deposition should use a stepped stencil (4-5 mil for inner pads, 6-7 mil for outer rows). For prototype builds, NSMD (non-solder mask defined) pads improve assembly yield versus SMD pads; the datasheet reference footprint in the APEX 20KE literature is the authoritative source. A 0.8 mm pad with 0.4 mm via pad is typical for 1.00 mm pitch BGA layouts.
A common mistake is omitting the PLL analog supply decoupling; each of the 4 PLLs requires its own filtered AVCC rail with a ferrite bead and 10 µF/0.1 µF capacitors. Without this filtering, PLL jitter can exceed datasheet limits and the JTAG configuration can fail intermittently. Another pitfall is using the -1 speed grade for designs that later require the -2 or -3 to close timing - select the speed grade based on worst-case static timing analysis, not initial estimates.
Uyumluluk Bilgisi
Base EP20K200EFC484-1 uses SnPb (tin-lead) ball finish and is therefore NOT RoHS compliant. The -1N variant is lead-free RoHS compliant. AEC-Q100 not applicable since this is a commercial/industrial-grade FPGA, not an automotive-qualified part.