EP20K400EBI652-2X - APEX 20K 400K Gates FPGA 652-BGA | Intel
MPN: EP20K400EBI652-2X ✗ Son Kullanım ZamanıEP20K400EBI652-2X Genel Bakış
An FPGA (Field Programmable Gate Array) is a programmable logic device that integrates configurable logic blocks, interconnect, and I/O cells onto a single silicon die. Within the broader taxonomy, the APEX 20K family is classified as a PLD (Programmable Logic Device) -> CPLD/FPGA hybrid -> high-density FPGA -> SRAM-based FPGA -> logic IC. FPGAs are widely used for ASIC prototyping, glue logic, parallel processing pipelines, and interface bridging where fixed-function silicon cannot meet time-to-market or volume economics.
Key differentiating features of the EP20K400EBI652-2X include a four-level hierarchical FastTrack interconnect structure for predictable timing closure, embedded system blocks providing distributed dual-port RAM, built-in LVDS support and multi-standard I/O, plus in-system configuration via passive serial, passive parallel, and JTAG modes. The thermally enhanced 652-ball BGA enables higher dissipation headroom than the standard BGA variant, suiting industrial workloads.
The APEX 20K architecture combines look-up table (LUT) logic with embedded array blocks (EABs), allowing designers to implement both random logic and on-chip memory in a single device. The high logic-to-pin ratio (488 I/O on 16,640 cells) makes the part efficient for parallel buses, telecommunications backplanes, and high-speed instrumentation front-ends.
Typical applications include telecommunications line-card processing, high-speed DSP pre-processing, industrial motion control, video/imaging pipelines, and ASIC prototyping where 400K gates provide adequate headroom for moderately complex designs.
Designers should review the Altera Device Package Information Data Sheet for the taller thermally enhanced BGA mechanical outline before committing PCB footprints, and consult Quartus / MAX+PLUS II configuration notes to plan the JTAG or passive serial programming chain.
This page synthesizes distributor pricing, drop-in alternatives within the APEX 20K family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatifler için EP20K400EBI652-2X — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP20K400EBI652-2X (aynı form faktörü ve ayağa oturma) — farklı olan Operating Temperature, Family, Series, Package, Speed Grade.
EP20K400EBC652-2X
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K400EBI652-2
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EP20K400EBC652-3
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K400EBC652-3N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K400EBC652-1X
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K400EBC652-1
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP20K400EBI652-2X Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | APEX 20K |
| Logic Elements (Macros) | 1664 |
| Maximum Logic Gates | 400,000 |
| Logic Cells | 16,640 |
| User I/O Pins | 488 |
| Maximum Operating Frequency | 223 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Paket | 652-ball FineLine BGA (thermally enhanced) |
| Package Body Size | 45 mm x 45 mm |
| On-chip Memory | Embedded Array Blocks (EAB) |
| Interconnect Structure | Four-level hierarchical FastTrack |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
EP20K400EBI652-2X 45 mm x 45 mm Pin Yapısı Kılavuzu
EP20K400EBI652-2X (45 mm x 45 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP20K400EBI652-2X.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP20K400EBI652-2X için uygundur 6 uygulamas: Telecommunications Line-Card Processing, High-Speed DSP Pre-Processing, Industrial Motion Control, Video and Imaging Pipelines, ASIC Prototyping and Emulation, Test and Measurement Instrumentation.
Telecommunications Line-Card Processing
The EP20K400EBI652-2X fits telecom line-card applications because its 400K system gates and 488 user I/O pins provide ample headroom for TDM bus multiplexing, framer interfacing, and ATM/Packet processing pipelines. The 223 MHz internal speed and four-level FastTrack interconnect deliver predictable timing closure for serial-to-parallel conversions, while embedded array blocks (EABs) implement on-chip FIFOs and lookup tables. Designers typically use JTAG configuration for in-system firmware updates across thousands of deployed line cards.
Önerilen
High-Speed DSP Pre-Processing
The EP20K400EBI652-2X is well-suited for DSP pre-processing because the APEX 20K architecture provides dedicated multiplier support via EABs and ample LUT logic for FIR/IIR datapaths. Its 652-ball BGA footprint supports the LVDS and high-speed I/O required to interface with external ADC/DAC front-ends, while the 1.8 V core keeps power dissipation manageable at 223 MHz operation. Designers commonly use this FPGA to implement decimation, channelization, and FFT pre-processing stages feeding downstream DSP ASICs.
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Industrial Motion Control
The EP20K400EBI652-2X works in industrial motion control because its industrial temperature grade (-40C to +100C) and 488 I/O pins accommodate multi-axis encoder feedback, PWM generation, and EtherCAT/CAN bus bridging in a single device. The 400K gates support custom PID loops and trajectory planners while leaving headroom for safety logic. The thermally enhanced BGA package provides the dissipation margin needed for enclosed factory-floor cabinets with limited airflow.
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Video and Imaging Pipelines
The EP20K400EBI652-2X fits video pipeline designs because 16,640 logic cells and 488 I/O pins can drive parallel RGB or Camera Link interfaces at 60-85 fps while leaving room for color-space conversion and sharpening filters. The four-level FastTrack interconnect keeps pixel-data fan-out timing predictable, and the embedded array blocks implement line buffers without external SRAM. Industrial temperature tolerance supports outdoor broadcast and surveillance deployments.
Önerilen
ASIC Prototyping and Emulation
The EP20K400EBI652-2X is widely used as an ASIC prototyping vehicle because 400K system gates approximate mid-complexity ASIC designs, and 488 I/O pins allow multiple FPGAs to be wired together via board-level JTAG or proprietary emulation buses. Designers can map RTL into APEX 20K LUTs, run real-time verification, and then re-target to silicon. Quartus II provides the synthesis, place-and-route, and timing analysis flow needed for production prototype cycles.
Önerilen
Test and Measurement Instrumentation
The EP20K400EBI652-2X fits test and measurement because its 223 MHz performance and 1.8 V core support high-sample-rate logic analyzer capture, pattern generation, and protocol decoding for buses like I2C, SPI, and parallel LVDS. The 652-ball BGA provides the routing density needed for wide acquisition memory buses, while embedded array blocks implement deep capture FIFOs. Industrial temperature range ensures operation in lab and field environments.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: EP20K400EBI652-2X — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP20K400EBC652-2X | EP20K400EBI652-2 | EP20K400EBC652-3 | EP20K400EBC652-3N | EP20K400EBC652-1X | EP20K400EBC652-1 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-ball BGA (thermally enhanced) | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Logic Elements (Macros) | 1664 | 1664 | 1664 | 1664 | 1664 | 1664 | 1664 |
| Maximum Logic Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Maximum Frequency | 223 MHz | 223 MHz | 223 MHz | up to 250 MHz (faster) | up to 250 MHz (faster) | up to 180 MHz (slower) | up to 180 MHz (slower) |
| Temperature Grade | Industrial | Commercial | Industrial | Commercial | Commercial | Commercial | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ana Farklılayıcılar
- Industrial temperature grade support within the APEX 20K 400K family (karşılaştırma:EP20K400EBC652-2X)
- Higher speed-grade -2 timing margin vs -1 commercial variants (karşılaştırma:EP20K400EBC652-1X)
- Same 652-ball BGA footprint and silicon as commercial-temp siblings (karşılaştırma:EP20K400EBC652-2)
Tasarım Notları
The 652-ball BGA uses a thermally enhanced package that is taller than the standard BGA variant; consult the Altera Device Package Information Data Sheet before PCB layout. Provide a continuous ground plane under the BGA and use 0.5 mm or 0.8 mm pitch escape routing with microvia stackups. Keep decoupling capacitors within 5 mm of each power ball, and ensure a minimum 4-layer stackup to manage simultaneous-switching noise on the 488 I/O pins.
Pull-up resistors must be present on all user I/O pins before and during configuration; missing pull-ups can cause the device to enter undefined states at power-up. Configure the device via JTAG for in-system reprogrammability, or use a dedicated EPC configuration PROM for standalone boot. Failure to follow the APEX 20K power-up sequencing can trigger latch-up or partial configuration errors that are difficult to debug on production boards.
At maximum toggle rate across all 488 I/O pins, the EP20K400EBI652-2X can dissipate more than 4-5 W. The thermally enhanced 652-ball BGA reduces theta_JA versus the standard variant, but the board must still provide copper flood thermal relief on the BGA footprint. Estimate: with 2 oz copper flood on top and bottom layers and no airflow, expect theta_JA around 15-18 C/W; verify with a thermal probe in production to ensure junction stays below 125 C.
The four-level hierarchical FastTrack interconnect provides predictable timing closure, but high-fanout nets (clock trees, global enables) still benefit from manual placement and replication. Use Quartus II timing analyzer to verify hold-time slack across LVDS and SSTL interfaces. For multi-FPGA emulation boards, isolate each FPGA's I/O banks and provide separate reference clocks to minimize crosstalk on shared backplanes.
Uyumluluk Bilgisi
Compliance status not confirmed in the verified web data; contact Intel/Altera documentation archive for the latest RoHS/REACH declarations. AEC-Q100 is not applicable to commercial/industrial FPGAs.
