Intel

EP2A70B652C7 - 67200 LEs FPGA BGA-652 | Intel (Altera)

MPN: EP2A70B652C7 ✗ Son Kullanım Zamanı

1.8 V Vdss BGA-652 (FineLine BGA) Package 7 Speed Embedded SRAM blocks (ESBs) Memory

Teklif İsteyin

MOQ: 1 |

Veri Sayfasını Görüntüle (PDF) Alternatifleri Görüntüle

Miktar

EP2A70B652C7 Genel Bakış

The Intel (formerly Altera) EP2A70B652C7 is a high-density Field-Programmable Gate Array (FPGA) from the APEX II family, integrating approximately 67200 logic elements (LEs) and 1140000 typical gates into a 652-ball FineLine BGA (BGA-652) package. It supports embedded system-on-chip (SoC) designs with on-chip memory blocks and supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS through dedicated I/O banks. The device operates from a 1.8V core supply with separate VCCIO rails for I/O bank configuration.

An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that contains an array of programmable logic blocks, configurable interconnects, and embedded resources such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the programmable-logic segment of the digital IC hierarchy (FPGA -> programmable logic -> ASIC alternative -> digital integrated circuit -> semiconductor). Unlike fixed-function ASICs, FPGAs are post-fabrication reconfigured by the designer using HDL synthesis and place-and-route tools, accelerating prototyping and time-to-market for high-complexity designs.

Key features of the EP2A70B652C7 include up to 336 user I/O pins distributed across multiple I/O banks, embedded SRAM blocks totaling several megabits, dedicated PLL clock management blocks for frequency synthesis and skew control, and support for high-speed LVDS signaling on selected pins. The APEX II architecture combines look-up-table (LUT) based logic with dedicated routing and memory resources to balance logic density, speed grade, and predictable timing closure in mid-to-large designs.

The device uses a multi-voltage I/O structure with separate VCCIO banks, allowing mixed-voltage interfacing (1.5V, 1.8V, 2.5V, 3.3V) on the same die. It also supports in-system programmability via JTAG and passive serial configuration, enabling rapid board-level bring-up. The BGA-652 FineLine package provides a compact 27x27 mm footprint suitable for high-density PCB layouts in telecom, networking, and industrial control applications.

Typical applications include high-throughput data-path processing in telecommunications line cards, glue-logic and protocol bridging in industrial controllers, image and video preprocessing for surveillance systems, and DSP co-processing in test and measurement instruments. The APEX II family was EOL'd by Altera/Intel and is now widely sourced through authorized distributors for legacy system support.

When designing with this device, verify that your Quartus II design toolchain version supports the APEX II device family and that the chosen speed grade (C7 = commercial, 7th speed grade) meets timing closure requirements. Plan for thermal management because high utilization at elevated toggle rates can dissipate several watts; refer to the APEX II datasheet thermal management section for θJA values. Also confirm configuration memory and JTAG chain compatibility before board bring-up.

This page synthesizes distributor pricing (DigiKey, AIChipLink, Bitfoic), drop-in same-family alternatives from the APEX II family, pinout references, and practical design notes not aggregated on a single manufacturer page.

Drop-in alternatifler için EP2A70B652C7 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.

Bu Serideki Variantlar

Yedek parça uyumlu olan aynı serideki modeller EP2A70B652C7 (aynı form faktörü ve ayağa oturma) — farklı olan Package, Operating Temperature, Speed Grade, Logic Elements, Family.

EP20K600CB652I7

Intel

Package: 652-ball FineLine BGA (LBGA, 1.27 mm pitch)

Operating Temperature: -40 °C to +85 °C (industrial, 'I' suffix)

Speed Grade: -7