EP2S15F672C3N - Stratix II 15K LEs FPGA 672-BGA | Intel / Altera
MPN: EP2S15F672C3N ⚠ Son Satın AlmaEP2S15F672C3N Genel Bakış
An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers configure after manufacture using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit in the broader semiconductor hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital IC -> semiconductor. The Stratix II family introduced an adaptive logic module (ALM) architecture that improved logic efficiency over prior generations, while retaining Stratix I/O and transceiver characteristics. The "F672" suffix indicates the FBGA-672 fine-pitch BGA package, "C3" indicates the commercial -3 speed grade, and the "N" suffix denotes lead-free / Pb-free termination.
Key features of the EP2S15F672C3N include 15,600 LEs, 419,328 total RAM bits, 48 embedded 18x18 multipliers (DSP blocks), up to 6 PLLs, 16 global clock networks, and 366 maximum user I/Os. The device supports LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X I/O standards, and integrates dedicated DDR/DDR2 SDRAM memory interfaces with on-chip termination. Architectural blocks include 780 LABs (each built from 10 ALMs), M512 (32x18 bit), M4K (128x36 bit), and M-RAM (4 Kbit) memory blocks.
Typical applications include high-speed digital signal processing (DSP), telecom baseband processing, video and image processing pipelines, ASIC prototyping, and high-speed serial protocol bridging (e.g., SPI4.2, SFI-4, RapidIO). Its 672-BGA footprint suits board designs that route dense differential-pair channels to external memory and backplane connectors.
When designing with the EP2S15F672C3N, ensure proper decoupling with 100 nF and 10 µF capacitors near each power pin and follow Altera's Stratix II PCB layout guidelines for BGA breakout. The -3 speed grade is the slowest commercial grade; -4 and -5 grades offer higher Fmax at increased cost. Configure the device with Quartus II (legacy) or Quartus Prime (current Intel FPGA toolchain).
The EP2S15F672C3N is widely available on the secondary market because Stratix II is in its mature end-of-life (EOL) phase. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers plan a refresh path to Cyclone IV/V or MAX 10 devices for new designs.
Drop-in alternatifler için EP2S15F672C3N — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP2S15F672C3N (aynı form faktörü ve ayağa oturma) — farklı olan Package, Speed Grade, Operating Temperature, RoHS Status, PLLs.
EP2S15F672C4N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2S15F672C5N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2S15F672C3
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2S130F780C4N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2S30F672C3N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2S60F672C3N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2S15F672C3N Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | Stratix II |
| Logic Elements (LE) | 15,600 |
| Adaptive Logic Modules (ALM) | 6240 |
| Logic Array Blocks (LAB) | 780 |
| Total RAM Bits | 419,328 |
| Embedded 18x18 Multipliers | 48 |
| Maximum User I/O | 366 |
| PLLs | 6 |
| Global Clock Networks | 16 |
| Paket | 672-ball FBGA (FineLine BGA) |
| Speed Grade | -3 (commercial) |
| İşletim Sıcaklığı | 0C to +85C (commercial) |
| Lead-Free / RoHS | Yes (Pb-free) |
| Montaj Türü | Surface Mount |
| Configuration Method | Serial/Parallel/PS via Quartus II |
EP2S15F672C3N 672-ball fbga (fineline bga) Pin Yapısı Kılavuzu
EP2S15F672C3N (672-ball fbga (fineline bga) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP2S15F672C3N.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP2S15F672C3N için uygundur 6 uygulamas: High-Speed Digital Signal Processing (DSP), Telecom Baseband and Protocol Bridging, Video and Image Processing Pipelines, ASIC Prototyping and Emulation, Industrial Control and Motor Drive, Test and Measurement Instrumentation.
High-Speed Digital Signal Processing (DSP)
The EP2S15F672C3N's 48 embedded 18x18 multipliers and 419,328 bits of embedded RAM make it well suited for high-speed DSP applications such as FIR filters, FFT pipelines, and baseband signal processing. With 15,600 logic elements and 6 PLLs, the device can sustain parallel DSP datapaths while maintaining deterministic throughput up to 250 MHz in the -3 speed grade. The 366 user I/Os provide sufficient bandwidth to interface with high-speed ADCs and DACs.
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Telecom Baseband and Protocol Bridging
The Stratix II architecture supports high-speed differential I/O standards (LVDS, LVPECL, HSTL, SSTL) and dedicated DDR/DDR2 memory interfaces, making the EP2S15F672C3N suitable for telecom protocol-bridging designs such as SPI4.2, SFI-4, and RapidIO. Its 672-ball FBGA package supports the dense differential-pair routing required for backplane interconnect at multi-gigabit rates. The on-chip PLLs and 16 global clock networks simplify timing closure in multi-channel TDM applications.
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Video and Image Processing Pipelines
The EP2S15F672C3N's embedded multipliers and dual-port M4K memory blocks are well matched to video-processing kernels such as 2D filters, motion estimation, and color-space conversion. With 366 user I/Os, the device can interface directly to parallel video ADCs and DVI/HDMI bridge chips without external bus multiplexing. The 419,328 RAM bits provide sufficient line buffering for HD-resolution real-time processing at modest frame rates.
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ASIC Prototyping and Emulation
The Stratix II family is widely used for ASIC prototyping because the ALM architecture maps efficiently to customer ASIC netlists. The EP2S15F672C3N's 15,600 LEs are sufficient for prototyping sub-modules or partitioned ASIC blocks at modest gate counts. For larger ASICs, multiple EP2S15 devices can be cascaded via LVDS channels on the 366 user I/Os. Quartus II's incremental compilation and LogicLock features simplify multi-FPGA partitioning.
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Industrial Control and Motor Drive
The EP2S15F672C3N's high I/O count (366) and wide I/O standard support (LVDS, 3.3V/2.5V/1.8V LVTTL/LVCMOS) make it suitable for industrial control boards interfacing to many sensors and actuators. The 6 PLLs allow deterministic multi-axis motor-control loops (PWM generation, encoder feedback, current sensing) at sub-microsecond jitter. The 672-BGA package's thermal pad supports continuous operation in enclosed industrial enclosures.
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Test and Measurement Instrumentation
The Stratix II's high I/O density and embedded multiplier resources fit custom test-and-measurement instruments where off-the-shelf ASICs are unavailable. The EP2S15F672C3N can implement arbitrary waveform generation, protocol-aware pattern generation, and high-speed data acquisition back-ends. With 16 global clock networks and 6 PLLs, the device supports multi-channel time-interleaved sampling at hundreds of MSPS in the -3 speed grade.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: EP2S15F672C3N — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP2S15F672C4N | EP2S15F672C5N | EP2S15F672C3 | EP2S30F672C3N |
|---|---|---|---|---|---|
| Package | FBGA-672 | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix II | Stratix II | Stratix II | Stratix II | Stratix II |
| Speed Grade | -3 | -4 (faster Fmax) | -5 (fastest Fmax) | -3 (same speed) | -3 (same speed) |
| Logic Elements | 15,600 | 15,600 | 15,600 | 15,600 | 33,880 |
| RAM Bits | 419,328 | 419,328 | 419,328 | 419,328 | 1,369,728 |
| Embedded 18x18 Multipliers | 48 | 48 | 48 | 48 | 64 |
| Maximum User I/O | 366 | 366 | 366 | 366 | 366 |
| RoHS / Pb-Free | Yes (N suffix) | Yes | Yes | No (leaded) | Yes |
Ana Farklılayıcılar
- Smallest-density Stratix II in FBGA-672 (karşılaştırma:EP2S30F672C3N)
- Fastest speed grade option in same footprint (karşılaştırma:EP2S15F672C4N)
- Lead-free (N suffix) RoHS compliance (karşılaştırma:EP2S15F672C3)
Tasarım Notları
The EP2S15F672C3N uses a 672-ball FineLine BGA with 1.0 mm pitch. Place 100 nF decoupling capacitors adjacent to every VCCINT, VCCIO, and VCCA power pin, plus 10 µF bulk capacitors on each supply rail. Use a 4- or 6-layer PCB stackup with continuous power and ground planes under the BGA. BGA fanout should follow Intel's Stratix II BGA breakout guidelines to avoid via-in-pad or dog-bone congestion. Estimated: typical Stratix II board uses 4 layers with 100 nF per 4-5 power pins plus 6-10 µF bulk.
The Stratix II EP2S15 dissipates roughly 2-5 W depending on logic utilization, clock rate, and toggle activity. Estimate: at 80% utilization and 250 MHz, typical core power is ~3 W. The 672-FBGA has a thermal resistance of approximately 12 C/W with proper PCB thermal via array. Place a 4x4 thermal via array (0.3 mm vias, 1.0 mm pitch) under the package center exposed pad to maintain junction temperature below 100C in commercial (0-85C) operation.
Stratix II is in its end-of-life (EOL) phase. Do not start new production designs with this part without an obsolescence mitigation plan (e.g., migration to Cyclone IV/V). When using configuration modes, do not tie MSEL pins to incompatible values - check Quartus II documentation for the desired AS/PS/JTAG mode. The EP2S15F672C3N requires a 1.2V core supply with tight tolerance (+/- 5%); verify regulator stability under dynamic load steps.
For LVDS channels above 500 Mbps, follow Altera's Stratix II LVDS layout guidelines: 100 ohm differential impedance, 8 mil trace width with 7 mil spacing (on FR-4 with 4-mil dielectric). Match intra-pair skew to under 5 ps and pair-to-pair skew to under 50 ps. Use IBIS simulation in Quartus II to validate signal integrity before PCB fabrication, especially for DDR/DDR2 memory interfaces at 200+ MHz.
Uyumluluk Bilgisi
Pb-free per N suffix in MPN. RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable - FPGAs not typically AEC-Q100 qualified. Halogen-free status not stated in provided data.