EP3C25E144I7 - 24,624-LE Cyclone III FPGA | Intel
MPN: EP3C25E144I7 ✓ AktifEP3C25E144I7 Genel Bakış
A field-programmable gate array is a reconfigurable digital semiconductor whose logic, interconnect, and I/O resources can be programmed after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA permits design changes to be implemented through bitstream configuration. The EP3C25E144I7 combines programmable logic with embedded memory in a low-cost Cyclone III device intended for mid-range embedded processing, industrial control, communications, and embedded-system control applications.
The verified device data identifies 24,624 logic elements, 608,256 bits of embedded memory, 82 I/O, and a 144-LQFP exposed-pad package. These figures position the device between small fixed-logic implementations and larger FPGAs. The 82 available I/O support interfaces to external memory, converters, transceivers, displays, sensors, and control peripherals, while the embedded-memory resource allows buffering or data storage to be implemented inside the FPGA fabric. Detailed logic-element composition, multiplier resources, clock domains, and I/O standards require confirmation in the manufacturer datasheet.
The Cyclone III architecture provides programmable combinational and sequential logic together with embedded RAM resources. This makes the EP3C25E144I7 appropriate for control planes, protocol bridges, state machines, parallel data acquisition, and general-purpose embedded logic. Unlike a soft processor implementation on a smaller FPGA, the device offers a comparatively substantial logic capacity and I/O count in one package. That capacity can reduce system partitioning, but power, routing, timing closure, and configuration-memory requirements still determine the final implementation quality.
Typical uses include industrial automation controllers, communication interfaces, instrumentation, embedded video control, sensor-processing platforms, and general embedded control systems. In each case, the device can implement parallel state machines or data paths while external processors, converters, and communication components handle system-level tasks. A complete design also requires a suitable configuration interface or external configuration memory, a compliant power supply, decoupling, clocking, and careful I/O assignment.
The principal design consideration is that a Cyclone III FPGA is software-configurable rather than fixed-function. Designers should verify pin compatibility, supported I/O standards, timing constraints, and configuration requirements before committing a PCB layout. The exposed pad under the 144-LQFP package must be connected according to the manufacturer thermal and layout guidance, with adequate copper and low-impedance power distribution to support switching activity.
This page consolidates verified distributor inventory, package information, comparison data, and drop-in same-family alternatives into an engineering-focused guide. It distinguishes exact observed data from parameters requiring datasheet confirmation and focuses replacement analysis on same-footprint, pin-compatible Cyclone III options rather than merely functionally similar FPGAs from other vendors.
Drop-in alternatifler için EP3C25E144I7 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP3C25E144I7 (aynı form faktörü ve ayağa oturma) — farklı olan Package.
EP3C25E144I7N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3C25E144I8
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
EP3C25E144I8N
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
EP3C25E144C7N
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
EP3C25E144C8N
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
EP3C25E144I7 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 24,624 LE |
| Embedded Memory | 608,256 bits |
| User I/O Count | 82 I/O |
| Paket | 144-LQFP exposed-pad |
| Terminal Count | 144 terminals |
| Montaj Stili | Surface mount |
| Package Shape | Rectangular |
| Temperature Grade | Industrial |
| Product Family | Cyclone III |
| Device Technology | Programmable logic |
EP3C25E144I7 rectangular Pin Yapısı Kılavuzu
EP3C25E144I7 (rectangular paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP3C25E144I7.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP3C25E144I7 için uygundur 6 uygulamas: Industrial Automation Controller, Communication Interface Bridge, Data Acquisition and Signal Conditioning, Embedded Video Control, Sensor Processing Platform, General-Purpose Embedded Logic.
Industrial Automation Controller
The EP3C25E144I7 fits industrial automation control where parallel logic and numerous external interfaces are more valuable than the simplicity of a fixed-function controller. Its 24,624 logic elements can implement sequencing, state machines, interlocks, counters, and communication-format conversion, while 82 I/O provide connections to sensors, actuators, isolated digital inputs, and output modules. The 608,256 bits of embedded memory can support buffering, event histories, and local data handling. A practical implementation places the FPGA beside an MCU for higher-level control, using the FPGA for fast hardware-level sequencing. Design verification must cover I/O standards, isolation boundaries, clock jitter, and the 144-LQFP exposed-pad thermal path.
Önerilen
Communication Interface Bridge
The EP3C25E144I7 can implement a communication-interface bridge that converts framing, signaling, and protocol state across parallel and serial data paths. Its 24,624 logic elements are useful for wide datapaths, CRC generation, FIFOs, packet filters, and clock-domain crossing, while the 82 I/O allow direct attachment to transceivers and memory interfaces. A designer can partition the bridge so the FPGA handles deterministic framing and timing while an external processor manages configuration or higher-level protocol decisions. The 608,256 bits of embedded memory may be used for packet buffering. Before schematic capture, confirm supported I/O standards, PLL resources, configuration voltage, and timing margins in the manufacturer documentation.
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Data Acquisition and Signal Conditioning
The EP3C25E144I7 suits parallel data-acquisition systems that require deterministic digital conditioning between converters and a processor. The 82-I/O count permits wide parallel data capture, trigger distribution, digital filtering, and format conversion without relying only on a microcontroller's software path. The 608,256 bits of embedded memory can implement sample buffering or intermediate-stage storage, although sustained throughput must be balanced against routing and memory resources. In an instrumentation design, the FPGA may capture multiple converter outputs, align data according to trigger timing, and transfer processed blocks to an external processor. Critical checks include input thresholds, clocking, I/O voltage, timing closure, and exposed-pad grounding or voltage assignment.
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Embedded Video Control
The EP3C25E144I7 can serve as the control and timing element in an embedded video system, where programmable logic handles pixel timing, sync generation, blanking, and interface adaptation. Its 24,624 logic elements allow timing generators and control pipelines to operate deterministically, while 82 I/O provide connectivity to parallel LCD or image-sensor interfaces and external memory. The embedded memory can support line buffers, command queues, or intermediate pixel data where the selected mode does not exceed available memory bandwidth. In a camera-oriented design, the FPGA could synchronize a sensor and downstream display while an MCU performs higher-level processing. Final selection requires checking supported I/O standards, clock rates, video timing, power integrity, and the exposed-pad layout.
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Sensor Processing Platform
The EP3C25E144I7 is appropriate for sensor nodes that need local filtering, event detection, and data reduction before communicating results. Its 24,624 logic elements can execute parallel filters, threshold comparators, feature extraction, and packetization, while 608,256 bits of embedded memory provide limited on-chip buffering. The 82 I/O allow the FPGA to connect sensor outputs, digital interfaces, status indicators, and a host processor. This architecture can reduce host-processor interrupt traffic by moving repetitive processing into deterministic hardware. Power consumption remains design-dependent because utilization and switching activity affect dynamic power. Engineers should establish timing budgets, I/O levels, configuration retention strategy, and thermal performance before choosing this industrial-grade device for low-power deployment.
Önerilen
General-Purpose Embedded Logic
The EP3C25E144I7 provides a practical middle ground for general-purpose embedded logic requiring more parallel capability than a microcontroller but less complexity than a large FPGA. Designers can implement multiple finite-state machines, hardware peripherals, protocol adapters, arbitration logic, and data-format converters within the 24,624 logic elements. Its 82 I/O give substantial connectivity to external sensors, memory, converters, and displays, while the 608,256 bits of embedded memory can support modest buffering. The part is especially useful when deterministic behavior or hardware parallelism matters. A production design should still include a proper configuration source, defined reset behavior, verified pin constraints, and a timing plan. The exposed pad under the LQFP package requires the manufacturer's recommended PCB thermal implementation.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: EP3C25E144I7 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP3C25E144I7N | EP3C25E144I8 | EP3C25E144I8N | EP3C25E144C7N | EP3C25E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 144-LQFP exposed-pad | 144-LQFP exposed-pad - same | 144-LQFP exposed-pad - same | 144-LQFP exposed-pad - same | 144-LQFP exposed-pad - same | 144-LQFP exposed-pad - same |
| Product Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
Ana Farklılayıcılar
- Verified direct same-package ordering-code match (karşılaştırma:EP3C25E144I7N)
- Industrial-grade ordering option (karşılaştırma:EP3C25E144C7N)
- Speed-grade flexibility within the same footprint (karşılaştırma:EP3C25E144I8)
- Substantial parallel resource complement (karşılaştırma:Cross-brand Lattice ECP3 and Xilinx Spartan-6 alternatives)
Tasarım Notları
Implement the Cyclone III supply network from the exact manufacturer power-supply recommendations rather than the verified summary alone. Confirm core and I/O voltage ranges, supply sequencing, current limits, and permissible power-source combinations in the device datasheet. Place required bulk and high-frequency decoupling capacitors close to their associated supply pins, and provide a low-impedance ground reference through the exposed pad. Decoupling values and current estimates are not stated because the necessary electrical tables were not included in the supplied data.
Treat the exposed pad as both a thermal feature and a package-level connection that must follow the official land-pattern and assembly guidance. Use the recommended pad geometry, solder-mask and paste configuration, and copper treatment for the 144-LQFP package. Provide uninterrupted thermal copper where permitted, avoid placing keepouts directly beneath the device, and verify the pad's electrical net against the pin table. The verified excerpts confirm an exposed-pad package but do not provide the drawing required for exact dimensions.
Do not treat a same-family or same-package ordering code as automatically interchangeable. For EP3C25E144I7N and the I8, I8N, C7N, or C8N selections, compare the exact speed grade, temperature range, configuration interface, I/O assignments, exposed-pad net, and lifecycle status. Cross-brand Lattice ECP3 and Xilinx Spartan-6 devices mentioned by the cross-reference results are functional alternatives only; their different tools, packages, power systems, and pin arrangements require a PCB redesign rather than a drop-in substitution.
Assign clock, configuration, serial, and differential interfaces directly from the device-specific pin table before fixing the board outline. Keep configuration routing away from high-slew-rate or noisy analog-adjacent signals, use a controlled clock source, and reserve the same footprint for approved drop-in variants so an alternate ordering code can be fitted without layout changes. After each FPGA conversion, rerun timing analysis because utilization, routing, and speed-grade differences can alter achievable clock frequency even when the logic resources are unchanged.
Uyumluluk Bilgisi
The supplied verified excerpts do not provide explicit compliance declarations for EP3C25E144I7. The N suffix is referenced by a cross-relevance comparison, but its ordering-code meaning was not independently specified in the supplied text, so lead-free status is not inferred.
