Intel

EP3C55F780I8N - Cyclone III FPGA, 55K LEs, 780-FBGA | Intel

MPN: EP3C55F780I8N ✓ Aktif

1.15 V to 1.25 V (nominal 1.2 V) Vdss 780-ball FBGA (FineLine BGA), 1.0 mm pitch Package 20 Speed 234 Kbits total Memory

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EP3C55F780I8N Genel Bakış

The Intel EP3C55F780I8N is a high-density, low-cost Field Programmable Gate Array (FPGA) from the Cyclone III family, integrating 55,856 logic elements (LEs) and 3,491 logic array blocks (LABs) in a 780-ball FineLine BGA package with 1.0 mm ball pitch. It is fabricated on a low-power CMOS process and operates from a nominal 1.2 V core supply (range 1.15 V to 1.25 V), making it well-suited for cost-sensitive, power-aware designs.

An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), embedded memory, and programmable interconnect. FPGAs sit within the broader hierarchy: programmable logic device (PLD) -> FPGA -> semiconductor -> integrated circuit. Compared with fixed-function ASICs, FPGAs offer hardware-level parallelism, in-system reconfigurability, and fast time-to-market, which is why they dominate prototyping, DSP, video processing, and industrial control designs.

Key features include up to 234 Kbits of embedded RAM (M9K blocks), up to 156 hardware multipliers (18x18) for DSP operations, four phase-locked loops (PLLs) for clock management, and 20 global clock networks. The device supports industry-standard I/O standards (LVDS, LVCMOS, SSTL) and exposes up to 377 user I/Os depending on package selection. Configuration is via JTAG or active/passive serial/parallel modes using the built-in decompression and encryption circuitry.

The Cyclone III architecture balances logic density, DSP throughput, and low static power. Its 1.2 V core, on-chip termination, and dynamic power gating enable designs to consume less than 100 mW in many typical configurations. The fabric is supported by Quartus II design software, which provides synthesis, place-and-route, timing analysis, and on-chip debug via SignalTap II.

Typical applications include industrial motor control, video surveillance and image processing, software-defined radio, automotive infotainment, medical instrumentation, and embedded DSP. With its combination of logic capacity and embedded multipliers, the EP3C55 can absorb multiple parallel processing functions onto a single device, replacing discrete DSPs and glue logic.

When designing, allocate I/O banks carefully to avoid mixing incompatible voltage standards on the same bank, and verify that the Quartus II fitter can close timing before committing the PCB layout. A JTAG header must be brought out to allow in-system programming.

This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Altera Cyclone III family, and practical design notes not all found in the manufacturer datasheet.

Drop-in alternatifler için EP3C55F780I8N — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.

Bu Serideki Variantlar

Yedek parça uyumlu olan aynı serideki modeller EP3C55F780I8N (aynı form faktörü ve ayağa oturma) — farklı olan Package, Process Technology, Speed Grade, Family, Embedded 18x18 Multipliers.

EP3C120F780I7N

Intel

Package: 780-ball FBGA (F780), 1.0 mm pitch, 23 x 23 mm

Process Technology: 65 nm TSMC low-power

Speed Grade: I7 (industrial, fast)