EP3SE110F780I4 - 107500 LEs Stratix III E FPGA, 780-FCBGA | Altera
MPN: EP3SE110F780I4 ✗ Son Kullanım ZamanıEP3SE110F780I4 Genel Bakış
A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and transceivers. FPGAs sit between microcontrollers and ASICs in the design hierarchy - they offer ASIC-class performance and parallelism while remaining fully re-programmable, which makes them ideal for prototyping, low-volume production, and designs that require post-deployment logic updates.
Key features of the EP3SE110F780I4 include 4,300 LABs, 8,936,448 total RAM bits distributed across M9K/M144K block memory tiles, 488 user I/Os supporting multiple single-ended and differential I/O standards, and support for high-speed external memory interfaces including DDR3. The Stratix III E family fabric also embeds variable-precision DSP blocks suitable for 18x18 and 12x12 signed multiplications and IEEE 754 single-precision floating-point arithmetic when combined with the Quartus II development toolchain.
Typical applications span high-end communication infrastructure (wireless baseband, radar signal processing), test and measurement equipment, high-performance computing accelerators, ASIC prototyping, video broadcast systems, and aerospace/defense signal processing payloads. The 780-FCBGA package exposes the maximum I/O count of the family, making the -F780 variants the right choice when high signal fan-out is required.
When designing with this device, pay close attention to power-rail sequencing (Stratix III requires controlled ramp on VCC, VCCAUX, and VCCPD), thermal management (use the exposed-die BGA thermal pad), and pin assignment for high-speed transceivers and external memory - all of which are documented in the Stratix III device handbook.
Drop-in alternatifler için EP3SE110F780I4 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP3SE110F780I4 (aynı form faktörü ve ayağa oturma) — farklı olan Package, Process Technology, Operating Temperature, Family, Mounting Type.
EP3SE110F780I3N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SE110F780I3
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SE110F780I2N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SE110F780C4N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SE110F780C4LN
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SL150F780I4N
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EP3SE110F780I4 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Series | Stratix III E |
| Family | Stratix III |
| Logic Elements (LE) | 107,500 |
| LABs / CLBs | 4,300 |
| Total RAM Bits | 8,936,448 |
| Number of I/O | 488 |
| Voltage - Supply | 0.86 V to 1.1 V core (family-typical) |
| Montaj Türü | Surface Mount |
| Paket | 780-BBGA, FCBGA |
| İşletim Sıcaklığı | -40C to +100C (Industrial, I4 suffix) |
| Speed Grade | 4 |
| Process Technology | 40 nm TSMC low-power |
| RoHS Durumu | Compliant (per distributor listing) |
| Lead-Free | Yes (per BGA terminal finish datasheet record) |
EP3SE110F780I4 780-bbga, fcbga Pin Yapısı Kılavuzu
EP3SE110F780I4 (780-bbga, fcbga paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP3SE110F780I4.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP3SE110F780I4 için uygundur 6 uygulamas: Wireless Baseband Signal Processing, Radar and EW Signal Processing, High-Speed Test & Measurement Instrumentation, ASIC Prototyping Platform, Video Broadcast and Image Processing, Industrial Control and Factory Automation.
Wireless Baseband Signal Processing
The EP3SE110F780I4's 107,500 logic elements, integrated variable-precision DSP blocks, and 8.9 Mbit of on-chip memory make it well suited for wireless baseband processing where multiple antennas and FFT engines run in parallel. The device sustains multi-hundred-MHz DSP throughput required by LTE and 5G NR base stations. With 488 user I/Os the F780 package cleanly fans out to external DDR3 sample stores and CPRI/JESD204B serial links, while the 40 nm low-power process reduces the per-channel power budget versus larger FPGA families.
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Radar and EW Signal Processing
Defense radar and electronic-warfare systems rely on FPGA-level parallelism to process ADC data streams in real time. The EP3SE110F780I4's combination of 4,300 LABs, large embedded memory, and 488 LVDS-capable I/Os suits phase-array radar beamformers and pulse-compression receivers. The industrial -40C to +100C temperature range satisfies MIL-STD-810 environment requirements at board level. Designers typically pair the EP3SE110F780I4 with external ADC/DAC companion parts and a Stratix IV EP4SE230 for higher-density back-end processing.
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High-Speed Test & Measurement Instrumentation
Test instruments such as digital storage oscilloscopes, protocol analyzers, and bit-error-rate testers require both deep acquisition memory and real-time DSP. The EP3SE110F780I4 integrates 8,936,448 RAM bits for deep trace buffers and 107,500 LEs for pattern generation, real-time eye-diagram extraction, and PCIe protocol decoding. The F780 package's 488 I/Os handle multiple parallel ADC lanes at up to 250 MHz DDR, while the Stratix III E DSP blocks accelerate FFT and PRBS pattern detection - significantly outperforming CPU-based implementations at lower latency.
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ASIC Prototyping Platform
ASIC prototyping platforms need multiple FPGAs working together via high-speed LVDS bridges. The EP3SE110F780I4 in F780 is well suited because its 488 I/Os expose the maximum tile-to-tile interconnect bandwidth of the Stratix III E family. Designers partition their ASIC netlist across two or four EP3SE110 devices using the Quartus II LogicLock feature, then validate RTL pre-tapeout at near-ASIC clock frequencies. The F780 industrial temperature grade supports operation in accelerated thermal-stress verification chambers.
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Video Broadcast and Image Processing
Studio-grade video switchers, image processors, and 4K broadcast encoders need multi-channel real-time video pipelines at pixel rates of 300 MHz and beyond. The EP3SE110F780I4 supplies the logic density and embedded memory for color-space conversion, scaling, and overlay composition. Its 488 I/Os in F780 easily fan out to HDMI/SDI interface PHYs and external DDR3 frame buffers. Industrial temperature operation lets the same part serve both fixed indoor broadcast gear and outdoor ENG truck applications without re-spinning the BOM.
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Industrial Control and Factory Automation
Factory automation controllers and machine-vision systems need deterministic real-time response with high I/O count. The EP3SE110F780I4's industrial -40C to +100C range, large logic capacity, and 488 I/Os in the F780 FCBGA fit multi-axis motion control, EtherCAT/CAN interface bridging, and high-frame-rate machine-vision inspection in a single device. The 8.9 Mbit on-chip memory reduces external RAM traffic in deterministic control loops, and the Quartus II toolchain integrates Qsys for fast development of complex industrial peripherals.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: EP3SE110F780I4 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP3SE110F780I3N | EP3SE110F780C4N | EP3SL150F780I4N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 780-FCBGA (F780) | 780-FCBGA (F780) - same | 780-FCBGA (F780) - same | 780-FCBGA (F780) - same |
| Logic Elements | 107,500 | 107,500 (same die) | 107,500 (same die) | 150,000 |
| LABs | 4,300 | 4,300 (same die) | 4,300 (same die) | 5,700 |
| Embedded RAM Bits | 8,936,448 | 8,936,448 (same die) | 8,936,448 (same die) | 8,126,976 |
| User I/Os | 488 | 488 (same package) | 488 (same package) | 488 (same package) |
| Speed Grade | 4 | 3 (faster) | 4 (same) | 4 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Family Sub-Series | Stratix III E (memory+DSP) | Stratix III E | Stratix III E | Stratix III L (logic) |
| Process Technology | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC |
Ana Farklılayıcılar
- Stratix III E sub-family adds variable-precision DSP and larger M9K memory blocks (karşılaştırma:EP3SL150F780I4N (Stratix III L))
- Speed grade 4 allows drop-in upgrade to faster -I3N or -I2N variants (karşılaştırma:EP3SE110F780I3N (speed grade 3))
- 488 user I/Os in the F780 package vs the smaller F484 footprint (karşılaştırma:EP3SE110F484I4N (F484 BGA))
Tasarım Notları
Stratix III FPGAs require controlled power-on sequencing of VCC (core, 0.86-1.1 V), VCCAUX (2.5 V), and VCCPD (3.0 V) rails. Per the Stratix III Device Handbook, VCCPD must ramp before or simultaneously with VCC; VCCAUX must be present before or with VCC. Designers typically use a sequencer such as the LTC2923 or TI UCD90120A to avoid device latch-up. Decoupling requires 200+ low-ESR ceramic capacitors distributed across the package underside.
Estimated: at full 107,500-LE utilization with high toggle rates, the EP3SE110F780I4 may dissipate 8-15 W. The 780-FCBGA package exposes a thermal pad; use a minimum 6-layer PCB with a copper-filled thermal via array directly under the BGA and a heatsink plus 100 LFM airflow. Verify with junction-temperature estimation using the Quartus II PowerPlay analyzer before sign-off.
The 780-FCBGA ball pitch is 1.0 mm; the PCB must use laser-drilled microvias (0.1 mm) and via-in-pad technology to fan out the inner balls. Use a 12-layer stack-up with continuous GND and PWR planes adjacent to the BGA signal layers. Maintain 100 ohm differential impedance for LVDS and 50 ohm single-ended for general-purpose I/O. Per Altera's AN 532 (Stratix III PCB design guidelines), keep all high-speed traces length-matched within 10 ps.
Do not confuse the Stratix III E (EP3SE) family with the Stratix III L (EP3SL) family - the E variant has more memory and DSP but fewer LEs per die area. Per Intel's device handbook, configuration via JTAG must use 3.3 V tolerant TCK/TMS/TDO; mixing in 1.8 V JTAG will fail to configure. Also verify that the EPCS or EPCQ configuration device chosen matches the Stratix III 1.8 V VCCPD requirement.
Place the 25 MHz or 100 MHz configuration clock oscillator within 50 mm of the CLKUSR pin, with ground isolation from switching signals. Keep the active-low nCONFIG and nSTATUS signals away from LVDS and DDR3 data lines. Route all global clock networks (CLK0..CLK15) using the dedicated clock input pins with matched 50 ohm terminations to avoid duty-cycle distortion.
Uyumluluk Bilgisi
RoHS compliance per distributor listing (DigiKey product page). Lead-free terminal finish per Partstack BGA record. REACH, halogen-free, and AEC-Q100 status not stated in verified data - set to 'unknown' / 'not_applicable'. AEC-Q100 not applicable: this is an industrial FPGA, not an automotive-grade qualified part.