M2GL010-1VF256 - 12K LEs, 138 I/O IGLOO2 FPGA | Microchip
MPN: M2GL010-1VF256 ✓ AktifM2GL010-1VF256 Genel Bakış
An FPGA is a programmable semiconductor in which the logic, interconnect, and I/O behavior are configured after fabrication. In the product hierarchy, an FPGA belongs to the programmable-logic and programmable-logic-device family, rather than a fixed-function application-specific integrated circuit. The M2GL010 series combines reconfigurable digital logic with a relatively low pin count for designs requiring moderate logic density and extensive I/O in a compact package.
The M2GL010-1VF256 provides 12,084 logic elements and 138 I/O in a 256-LFBGA package. Its 1.2 V core operating voltage is accompanied by a listed 3.3 V supply characteristic for the device family. The “-1” ordering suffix identifies the particular speed or temperature version associated with this MPN, while “VF256” identifies the 256-ball package. Microchip lists the M2GL010 series as in production.
The device uses 65 nm FPGA technology and is positioned within the low-density IGLOO2 portfolio. Its 138 available I/O make it relevant to systems that need parallel data collection, protocol conversion, bridging, control logic, and peripheral expansion. Because its configuration is programmable, one FPGA design can support multiple board-level functions and allow field updates when the stored configuration is changed.
Typical implementations include industrial bridge and conversion modules, communications interface adapters, system-management controllers, embedded control logic, and secure-connectivity equipment. These applications benefit from parallel I/O, configurable logic blocks, and a package capable of supporting more connections than a small low-density programmable device. Board designers must still account for the BGA assembly process, bank-specific I/O requirements, configuration storage, decoupling, and the pin constraints of the selected design.
A key design consideration is that M2GL010-1VF256 is a 256-ball BGA package rather than a leaded or coarse-pitch surface-mount package. Its exposed assembly process requires appropriate PCB pad geometry, thermal management, inspection, and soldering capability. Signal-integrity and bank-voltage decisions must also follow the manufacturer’s pin-description guide and device datasheet rather than assuming that every neighboring ball supports the same I/O standard.
This page consolidates verified manufacturer and distributor information for the M2GL010-1VF256, including package and logic-density details, commercial availability information, same-package alternatives, and practical selection guidance that are not consolidated in a single manufacturer summary.
Drop-in alternatifler için M2GL010-1VF256 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller M2GL010-1VF256 (aynı form faktörü ve ayağa oturma) — farklı olan Device Type, Logic Elements, Package, Mounting Type, REACH Status.
M2GL010-VF256
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →M2GL010-1VFG256
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
M2GL010-VFG256
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
M2GL010-VFG256I
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
M2GL010-VF256I
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →M2GL010-1VF256 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Device Type | Low-density IGLOO2 field-programmable gate array |
| Logic Elements | 12,084 LE |
| User I/O Count | 138 I/O |
| Core Operating Supply Voltage | 1.2 V |
| Listed Device Supply Voltage | 3.3 V |
| FPGA Process Technology | 65 nm |
| Paket | 256-LFBGA, also identified as 256-VFPBGA |
| Package Pin Count | 256 pins |
| Montaj Türü | SMD/SMT |
| Minimum Operating Temperature | 0 °C |
| Maximum Operating Temperature | +85 °C |
| Shipping Package | Tray |
| Product Series | IGLOO2 |
| Yaşam Döngüsü Durumu | In production |
M2GL010-1VF256 tray Pin Yapısı Kılavuzu
M2GL010-1VF256 (tray paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: M2GL010-1VF256.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
M2GL010-1VF256 için uygundur 6 uygulamas: Industrial Protocol Bridge, Data Acquisition and I/O Expansion, System Management Controller, Secure Connectivity and Authentication, Communication Line Interface, Programmable Logic Controller.
Industrial Protocol Bridge
The M2GL010-1VF256 fits industrial protocol-bridge designs that translate between parallel digital interfaces, serial links, and discrete control signals. Its 12,084 logic elements provide enough programmable logic for state machines, buffering, timing, and protocol conversion, while 138 user I/O offer substantial board-level connectivity for sensors, actuators, and legacy peripherals. The 0 °C to +85 °C operating range supports commercial-temperature industrial equipment when the enclosure controls ambient conditions. Designers should use the manufacturer pin-description guide to assign compatible I/O banks and verify voltage tolerances against the external devices. Because the package is a 256-LFBGA, the PCB must also support fine-pitch BGA assembly, adequate power distribution, and controlled configuration access.
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Data Acquisition and I/O Expansion
M2GL010-1VF256 is appropriate for parallel data-acquisition modules that must gather multiple digital channels, perform control sequencing, and forward information to a processor or communications interface. The device provides 12,084 logic elements for acquisition timing, buffering, threshold logic, and status reporting, together with 138 user I/O for counters, selectors, enables, and external sensors. Its 1.2 V core operation is matched by the device family's listed 3.3 V interface environment, allowing consolidation of multiple signals in one compact programmable device. Engineers must confirm each bank's supported voltage and I/O standard from the pin-description guide. PCB layout should provide short routes for high-speed or noisy acquisition nodes, while configuration storage must remain accessible according to the Microchip programming design.
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System Management Controller
The M2GL010-1VF256 can implement centralized system-management logic for boards requiring power sequencing, reset generation, fault aggregation, watchdog behavior, or health monitoring. Its 12,084 logic elements permit concurrent management tasks and programmable state machines, while 138 user I/O provide access to numerous status, fault, and control signals. The 0 °C to +85 °C rating fits controlled commercial or industrial electronics, although outdoor equipment needs an appropriately temperature-rated ordering option. A practical design should isolate sensitive monitoring paths from noisy power stages, use deterministic reset and clocking, and follow the datasheet guidance for configuration pins. The fine-pitch 256-LFBGA also requires assembly-process planning and adequate inspection coverage to prevent hidden solder defects.
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Secure Connectivity and Authentication
M2GL010-1VF256 can support secure-connectivity equipment that combines protocol handling, authentication logic, key-transfer control, and status monitoring in one reprogrammable device. The 12,084 logic elements provide capacity for finite-state machines, packet checks, counters, and glue logic, while 138 user I/O allow communication with external secure elements, network interfaces, and control signals. Its commercial 0 °C to +85 °C range is suitable for indoor communications, industrial, and embedded networking equipment with controlled thermal conditions. Designers should protect configuration access, separate sensitive and noisy interfaces, and verify I/O-bank voltages before connecting external circuitry. Because security behavior ultimately depends on the programmed bitstream, implementation verification should include programming access controls and a repeatable manufacturing configuration process.
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Communication Line Interface
M2GL010-1VF256 is useful in communication equipment requiring programmable framing, bit manipulation, channel control, test loops, and interface isolation between parallel logic and external transceivers. Its 12,084 logic elements can implement multiple protocol engines or supporting control functions, while 138 user I/O provide flexible channel density for baseband logic and diagnostics. The 1.2 V core supply helps support compact, power-conscious designs, and the listed 0 °C to +85 °C range covers controlled communications environments. Signal integrity must be evaluated for every high-speed external path, and clock, reset, and configuration routing should avoid switching-noise coupling. The 256-LFBGA package requires a qualified PCB footprint and assembly process, making careful ball assignment and controlled impedance essential before high-volume production.
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Programmable Logic Controller
M2GL010-1VF256 can serve as the programmable control core of an embedded controller, combining sequential logic, interlocks, counters, alarm handling, and peripheral control in one device. Its 12,084 logic elements provide substantial capacity for small industrial or equipment-control systems, while 138 user I/O support digital inputs, outputs, and communication ports. The documented 0 °C to +85 °C range suits controlled commercial-temperature machinery and indoor industrial cabinets. Engineers should partition critical timing from less critical logic, validate fail-safe states, and define configuration behavior for power-loss and restart events. The 256-LFBGA package adds manufacturing complexity, so prototype assembly, X-ray inspection, and thermal validation should be included in the design schedule before production release.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: M2GL010-1VF256 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | M2GL010-VF256 | M2GL010-1VFG256 | M2GL010-VFG256 | M2GL010-VFG256I | M2GL010-VF256I |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA |
| FPGA Family | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
| Logic Elements | 12,084 LE | 12,084 LE | 12,084 LE | 12,084 LE | 12,084 LE | 12,084 LE |
Ana Farklılayıcılar
- Exact commercial-temperature ordering code (karşılaştırma:M2GL010-VFG256)
- Identical logic capacity with package reuse (karşılaştırma:M2GL010-VF256)
- Substantial external I/O capacity (karşılaştırma:M2GL010-1VFG256)
- Current production family positioning (karşılaştırma:M2GL010-VFG256I)
Tasarım Notları
Treat the 256-LFBGA footprint as a qualified manufacturing deliverable, not as a generic via pattern. Use the package drawing and land-pattern information in the Microchip packaging guide, preserve the specified ball pitch and solder-mask conditions, and validate the PCB stack-up with the assembly house. Allow for X-ray inspection after reflow because hidden BGA solder joints are not visually inspectable. Route configuration, clock, reset, and sensitive interface signals away from noisy power stages before assigning the remaining balls to user I/O.
Implement the 1.2 V core rail and the device family's listed 3.3 V environment according to the Microchip electrical datasheet. Place the required bypass capacitors at the corresponding supply pins with the shortest possible current path, and provide a low-impedance ground-plane network for every ground ball. Confirm the exact core, I/O, and auxiliary voltage requirements from the pin-description guide because the available search excerpts do not provide the complete power-tree table. Validate startup sequencing and configuration behavior before enabling downstream circuitry.
Assign external signals to banks only after checking the supported voltage, input thresholds, output behavior, and configuration restrictions in the pin guide. Keep clocks and high-speed interfaces away from switching nodes and noisy return paths, use controlled-impedance routing where required, and provide clean reference planes under high-speed nets. The 138 user I/O count does not mean all 138 balls are freely assignable; dedicated configuration, power, ground, and reserved balls must be excluded before finalizing an I/O map.
Do not substitute M2GL010 ordering codes based only on the 256-ball package. The -1, G, and I suffixes can encode different speed or temperature characteristics, and the supplied excerpts do not quantify every difference. Before substitution, compare the complete ordering table, operating-temperature range, speed grade, supported I/O standards, configuration method, and package revision. Also avoid treating M2GL010-VFG256's visible $56.2273 listing as the target price; it belongs to a different MPN.
Uyumluluk Bilgisi
The supplied verified sources do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for M2GL010-1VF256. Microchip lists the M2GL010 series as in production.
