MPC8379VRALG - PowerPC e300c4s MPU 667MHz 689-TEPBGA II | NXP
MPN: MPC8379VRALG ✓ AktifMPC8379VRALG Genel Bakış
A microprocessor (MPU) is a system-on-chip that integrates one or more CPU cores, memory controllers, I/O peripherals, and often security engines onto a single die, enabling compact embedded platforms. The MPC83xx family sits in NXP's communications-processor hierarchy between the lower-integration MPC83xx SIMPLE and the higher-integration PowerQUICC III MPC85xx line, sharing the e300 core ISA with later PowerQUICC devices. The 8379 specifically adds hardware acceleration for networking and a DDR memory controller suited to line-card and router-style designs.
Key device features highlighted by the verified NXP and DigiKey product pages include a 32-bit PowerPC e300c4s CPU core running at 667 MHz, an integrated DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet MACs, a PCI Express interface, USB 2.0, and a flexible local bus. The 689-TEPBGA II package exposes the full peripheral set while supporting commercial-grade thermal envelopes via the 31x31 mm thermally-enhanced plastic BGA.
Designers should treat the 31x31 mm BGA as a multi-layer PCB-only solution with controlled-impedance routing required for DDR2 memory and the SERDES-based Ethernet and PCI Express links. According to the NXP product page, the part is qualified for the standard 0 to 105 C junction range typical of MPC83xx industrial parts. Decoupling follows the reference design in the MPC8379E hardware specification and typically requires dozens of bulk ceramic and one polymer bulk cap near the BGA core rails.
Typical applications include wired router and gateway platforms, network attached storage controllers, industrial automation and machine-to-machine (M2M) gateways, and secure line-card processors. Drop-in alternatives within the MPC83xx family are described in the alternatives section below, with parametric proximity and package compatibility noted for each. Pricing observed as of 2026-10-17 via LCSC and DigiKey distributor listings is approximately $71.47 unit price for qty 1, with significant qty breaks available from authorized NXP distributors. This page synthesizes distributor pricing, family-level drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatifler için MPC8379VRALG — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller MPC8379VRALG (aynı form faktörü ve ayağa oturma) — farklı olan Local Bus, Memory Controller, Series, USB, Core Architecture.
MPC8377VRALG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →MPC8377EVRALG
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →MPC8378ECVRAJFA
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
MPC8379VRALG Maksimum Değerlendirmeler & Elektriksel Özellikler
| Manufacturer | NXP Semiconductors |
| Series | MPC83xx |
| Core Architecture | PowerPC e300c4s |
| Number of Cores | 1 |
| Veri Bus Genişliği | 32-bit |
| Maximum Core Frequency | 667 MHz |
| İşletim Besleme Gerilimi | 1.8 V / 2.5 V / 3.3 V |
| Package Type | 689-TEPBGA II |
| Package Size | 31 mm x 31 mm |
| Montaj Türü | Surface Mount (BGA) |
| Memory Controller | DDR1/DDR2 |
| Ethernet | Dual 10/100/1000 MAC |
| PCI Express | Yes (SERDES) |
| USB | USB 2.0 |
| Local Bus | 16/32-bit local bus |
| Encryption Enabled | No (W/O ENCR) |
| İşletim Sıcaklığı | 0 C to +105 C |
MPC8379VRALG 31 mm x 31 mm Pin Yapısı Kılavuzu
MPC8379VRALG (31 mm x 31 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: MPC8379VRALG.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
MPC8379VRALG için uygundur 6 uygulamas: Industrial Router & Gateway Platform, Network Attached Storage (NAS) Controller, Industrial Automation & M2M Gateway, Firewall / VPN Appliance, Line-Card / Router Control Processor, Secure Print & Imaging Controller.
Industrial Router & Gateway Platform
The MPC8379VRALG fits industrial router and gateway designs because it integrates dual Gigabit Ethernet MACs, a PCI Express interface for Wi-Fi or 4G modem peripherals, and a hardware-protocol acceleration engine (QUICC Engine subsystem). With a 667 MHz e300c4s core, it can sustain line-rate packet processing for NAT/firewall/VPN workloads while the DDR2 memory controller supplies the high-bandwidth packet buffer space. The 0 to +105 C operating temperature range and the 689-TEPBGA II thermally-enhanced package support fanless chassis designs deployed in factory floors or outdoor cabinets. Power sequencing uses the 1.8 V/2.5 V/3.3 V multi-rail supplies typical of MPC83xx hardware spec reference designs.
Önerilen
Network Attached Storage (NAS) Controller
The MPC8379VRALG is suitable for NAS controller boards where local-bus-attached SATA controllers or PCI Express RAID cards must be orchestrated by a deterministic 32-bit PowerPC core. Its 667 MHz core plus DDR2 controller provides sustained throughput for file-system metadata operations, while the dual GbE MACs support link aggregation. The 689-TEPBGA II footprint offers a stable PCB reference from the NXP MPC83xx hardware spec, allowing reuse of existing NAS reference designs and validated DDR2 routing rules. Encryption-disabled SKU ('W/O ENCR') is appropriate when filesystem encryption is handled in the host CPU.
Önerilen
Industrial Automation & M2M Gateway
For industrial automation and M2M gateways, the MPC8379VRALG combines a deterministic PowerPC core with industrial-grade peripherals: dual GbE for upstream Ethernet, USB 2.0 for cellular modems, and the flexible local bus for legacy parallel ADC/DAC or FPGA interconnect. The 0 to +105 C junction range and the rugged TEBGA II package enable deployment in PLC-adjacent environments. The PCI Express interface supports Wi-Fi or fieldbus expansion cards, while the DDR2 memory controller allows fat frame buffers for protocol translation stacks. MPC83xx family software ecosystems (Linux SDK) accelerate M2M stack integration.
Önerilen
Firewall / VPN Appliance
The MPC8379VRALG is a long-standing platform choice for entry- to mid-range firewall and VPN appliances, where its QUICC Engine, dual GbE MACs, and 667 MHz e300c4s core deliver sustained IPsec throughput. The DDR2 controller provides the state-table memory for millions of concurrent flows, while the encryption-disabled 'W/O ENCR' SKU reduces cost for designs that rely on host-side crypto. For designs that require on-chip security, migrate to the MPC8377EVRALG or MPC8378E encryption-enabled variants, which preserve the 689-TEPBGA II footprint. Operating temperature and reliability targets align with enterprise branch-office appliance deployment profiles.
Önerilen
Line-Card / Router Control Processor
In chassis-based routers and switches, the MPC8379VRALG serves as a control-plane or line-card processor, where the PowerPC e300c4s core runs routing protocols, the local bus attaches to switch fabrics, and the PCI Express / GbE MACs handle uplinks. Its 689-TEPBGA II package matches NXP's broader MPC8379 reference designs, allowing reuse of validated DDR2 and SERDES routing layouts. The 1.8 V/2.5 V/3.3 V multi-rail power scheme supports split digital/analog domains typical of carrier-grade chassis. Hardware-validated Linux and VxWorks BSPs from NXP accelerate porting.
Önerilen
Secure Print & Imaging Controller
The MPC8379VRALG suits secure print and imaging controllers that demand deterministic page-rendering performance, USB 2.0 host for peripherals, and Gigabit Ethernet for network printing. The 667 MHz core plus DDR2 memory subsystem can handle RIP and PDL rasterization, while the local bus connects to ASIC image pipelines. The 689-TEPBGA II thermally-enhanced BGA supports enclosed chassis designs with limited airflow. When on-chip encryption is required for secure print job handling, migrate to the MPC8377EVRALG or MPC8378E variants which share the same 689-TEPBGA II footprint for seamless PCB reuse.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: MPC8379VRALG — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | MPC8377VRALG | MPC8377EVRALG | MPC8378ECVRAJFA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) |
| Core | PowerPC e300c4s | PowerPC e300c4s | PowerPC e300c4s | PowerPC e300c4s |
| Encryption Engine | Disabled (W/O ENCR) | Disabled | Enabled | Enabled |
| Memory Controller | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Ethernet | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC |
| Operating Voltage | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V |
Ana Farklılayıcılar
- Highest-frequency encryption-disabled option in MPC8379 family (karşılaştırma:MPC8377VRALG)
- Drop-in for designs that do not require crypto acceleration (karşılaştırma:MPC8377EVRALG)
- Stable, long-lifecycle NXP roadmap (karşılaştırma:Generic ARM SoC alternatives)
Tasarım Notları
The 689-TEPBGA II package at 31x31 mm requires a controlled-impedance multi-layer PCB (typically 8 to 12 layers) with via-in-pad and microvia stackups for BGA escape routing. DDR2 traces must be length-matched to within +/- 25 mils per the NXP MPC8379E hardware specification reference design. Solid GND/power planes on layers 2 and N-1 minimize SSO noise on the 1.8 V/2.5 V/3.3 V rails. Refer to the official NXP reference designators for capacitor placement near each BGA core power ball.
Estimated: at the maximum 667 MHz core load with all peripherals enabled, total power dissipation typically falls in the 3 W to 5 W range based on NXP's MPC83xx family power budgets. The 689-TEPBGA II thermal pad must be soldered to the PCB copper pour (>= 25 cm^2) with thermal vias (0.3 mm pitch, filled) to spread heat into the inner ground plane. For fanless designs, ensure the chassis thermal solution keeps junction temperature below 105 C at worst-case ambient. Always validate with a thermocouple on the package top during EVT.
Common pitfalls in MPC8379VRALG designs: (1) failing to sequence the 1.8 V/2.5 V/3.3 V rails in the order specified by the hardware spec, which can latch up the DDR2 I/O; (2) omitting the 32 kHz RTC crystal reference and then losing wall-clock accuracy in production; (3) mixing the encryption-disabled (W/O ENCR) and encryption-enabled variants in firmware without verifying the boot ROM signature chain; (4) under-budgeting the bulk capacitor count on the DDR2 VTT rail, which causes intermittent memory errors at high temperature. Validate against the NXP errata list for the specific silicon revision.
Uyumluluk Bilgisi
Compliance status not present in the provided Verified Web Data snippets; the RoHS status spec is marked [DATA_NEEDED]. Cross-reference RoHS/REACH via the official NXP product page or by requesting the PCN from DigiKey/Mouser customer service.
