STM32F103R8H6TR - 72MHz Cortex-M3 64KB Flash MCU, 64-TFBGA | STMicroelectronics (Tape & Reel)
MPN: STM32F103R8H6TR ✓ AktifSTM32F103R8H6TR Genel Bakış
A microcontroller is a complete single-chip computer: an ARM Cortex-M3 CPU core, on-chip Flash program memory, SRAM data memory, and a rich set of peripherals - timers, ADCs, communication interfaces - integrated on one die. In the power management and embedded hierarchy, an MCU such as this sits above a bare CPU core and below a system-on-chip: the developer writes firmware in C, flashes it into the internal memory, and the silicon handles real-time acquisition, control and communications without external support chips.
The STM32F103R8H6TR's headline features are a 72 MHz Cortex-M3 core with single-cycle multiplication and a Harvard-style three-cycle pipeline, plus a peripheral set that includes USB full-speed device support, a CAN bus controller, seven 16-bit timers, two 10-bit ADCs, and nine communication interfaces (USART, UART, SPI, I2C). Two 12-bit ADCs with a 1 Msps sample rate, four 16-bit timers with dead-time generation, and a full set of GPIO make it a compact but capable control node.
Operationally the device runs from 2.5 V or 3.3 V supply rails, making it a natural fit for 3.3 V industrial and consumer boards as well as 5 V systems with local regulation. The 'H6' suffix identifies the 64-pin TFBGA package with industrial-grade temperature qualification, while the 64 KB of Flash supports bootloader plus application code in a single image.
Typical deployments include industrial monitoring and metering nodes, USB-connected data acquisition and programming fixtures, CAN-based motor and HVAC control boards, smart-home sensor gateways, and IoT edge nodes that need a small, low-cost MCU with more compute than an 8-bit part. ST's STM32F1 ecosystem - HAL drivers, CubeMX code generation, and the STM32Cube programmer/debug toolchain - shortens bring-up time considerably.
Designers should note that the 5x5 mm TFBGA-64 footprint is fine-pitch and requires an HDI-style PCB stack-up with laser-via fanout to route to a fine-pitch BGA escape layer; the alternative LQFP-64 members of the same family are easier to hand-assemble. Decoupling should place 100 nF ceramic capacitors at each supply pin plus bulk capacitance close to the device, and SWD/JTAG debug access must be brought out for production programming.
This page consolidates distributor pricing, verified pin-compatible drop-in alternatives, and hands-on layout and firmware-migration guidance that the manufacturer datasheet alone does not present in one place, giving design-in teams a faster path from part selection to working prototype.
Drop-in alternatifler için STM32F103R8H6TR — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller STM32F103R8H6TR (aynı form faktörü ve ayağa oturma) — farklı olan Communication Interfaces, Package, Series.
STM32F103RBH6
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →STM32F103RCH6
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
STM32F103RDH6
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
STM32F103REH6
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
GD32F103
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
STM32F103R8H6TR Maksimum Değerlendirmeler & Elektriksel Özellikler
| Core Processor | ARM Cortex-M3, 32-bit RISC, single-core |
| Maximum CPU Frequency | 72 MHz |
| Performance | 90 DMIPS (1.25 DMIPS/MHz) |
| Flash Memory Size | 64 KB (64K x 8) |
| Paket | 64-TFBGA, 5x5 mm |
| Besleme Gerilimi | 2.5 V / 3.3 V |
| ADCs | 2 x 10-bit ADC |
| Timers | 7 x 16-bit timer |
| Communication Interfaces | 9 (USB, CAN, USART/UART, SPI, I2C) |
| USB Support | Yes, full-speed device |
| CAN Support | Yes |
| Series | STM32F103 medium-density performance line |
| Temperature Grade | -40C to +85C (industrial, '6' suffix) |
| Montaj Türü | Surface Mount |
| RoHS Durumu | Compliant (per ST product documentation conventions) |
| Unit Price (LCSC) | From $1.6870 as of 2026-10-28 |
STM32F103R8H6TR 64-tfbga, 5x5 mm Pin Yapısı Kılavuzu
STM32F103R8H6TR (64-tfbga, 5x5 mm paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: STM32F103R8H6TR.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
STM32F103R8H6TR için uygundur 6 uygulamas: Industrial Monitoring and Metering Node, USB Data Acquisition and Programmer Fixture, CAN-Based Motor Control and HVAC Controller, Smart Home Sensor Gateway, USB-C and RS-485 Protocol Bridge, IoT Edge Node and Security Token.
Industrial Monitoring and Metering Node
The STM32F103R8H6TR fits metering and condition-monitoring nodes because it combines two 10-bit ADCs, seven 16-bit timers, and nine communication interfaces on a 72 MHz Cortex-M3 core delivering 90 DMIPS. Its 64 KB of Flash is ample for a bootloader plus a sensor-acquisition and thresholding application, while SWD and JTAG access lets production programmers flash each unit over a two-wire interface. The 64-TFBGA 5x5 mm body frees board area for the sensor front end, and the 2.5 V / 3.3 V supply options allow the MCU to sit next to low-energy analog rails without a separate regulator stage. Typical designs sample thermocouples or bridge sensors on a timer-triggered schedule, then push results over RS-485, CAN, or Modbus-style UART to a supervisory gateway.
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USB Data Acquisition and Programmer Fixture
A USB-enabled acquisition front end is a natural fit for the STM32F103R8H6TR because the medium-density line includes a full-speed USB device peripheral alongside the 72 MHz Cortex-M3 core. The core's single-cycle multiply and 90 DMIPS throughput are enough to sample two ADC channels at kilohertz-to-MHz rates and stream buffered data over USB without host intervention. With 64 KB of Flash there is room for a DFU-capable bootloader plus the acquisition firmware, and the industrial-grade -40C to +85C qualification suits bench and test environments. Designers commonly pair this MCU with a USB-to-serial bridge for legacy instrumentation or a dedicated transceiver, and use the on-board SWD header for firmware updates in the field.
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CAN-Based Motor Control and HVAC Controller
The STM32F103R8H6TR targets compact three-phase motor drives and HVAC control boards because the timer block provides advanced timers with complementary outputs and dead-time insertion, and the two 10-bit ADCs close the current and rotor-position feedback loops. Its 72 MHz Cortex-M3 core leaves roughly 30 percent headroom for a supervisory CAN node, so one device can run the control loop and report status over the same bus. ST markets the STM32F103 medium-density line explicitly for motor control and embedded automation. The compact 64-TFBGA land pattern is advantageous in space-constrained inverter boards, while the industrial temperature grade supports equipment operating in unheated enclosures.
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Smart Home Sensor Gateway
Smart-home sensor gateways benefit from the STM32F103R8H6TR's combination of nine communication interfaces - USB, CAN, USART, UART, SPI and I2C - which lets one microcontroller consolidate a radio module, an SPI sensor array, and an I2C environmental sensor behind a single host UART. Running at 72 MHz with 90 DMIPS, it can handle protocol translation and local filtering without a separate host processor. Its 64 KB of Flash is sufficient for a compact firmware image, and the 64-TFBGA 5x5 mm package keeps the PCB small enough for a wall-switch or sensor-hub enclosure. The 3.3 V rail operation aligns with common low-power wireless modules, and the industrial grade covers indoor commercial deployments.
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USB-C and RS-485 Protocol Bridge
Building a USB-to-RS-485 or USB-to-UART bridge is one of the shortest firmware paths for the STM32F103R8H6TR, since the device provides USB full-speed device support alongside multiple UARTs with hardware flow control. The 72 MHz core can run the bridge protocol, manage framing and CRC, and service a second UART for logging without CPU strain. For industrial gateways, the STM32F103R8H6TR can also drive a CAN interface alongside RS-485, turning a single board into a multi-protocol converter. The 64-TFBGA package's small footprint suits compact DIN-rail modules, and 2.5 V / 3.3 V flexibility simplifies level-shifting to legacy 5 V RS-485 transceivers.
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IoT Edge Node and Security Token
The STM32F103R8H6TR works well as an IoT edge node or hardware security token because the STM32F1 series integrates a hardware CRC unit, a unique 96-bit device ID, and flash-based option bytes that can lock debug access - basic building blocks for secure boot and device identity. At 72 MHz the core can sign or hash firmware blocks while simultaneously managing sensor acquisition and an encrypted link. The 64 KB of Flash is workable for a compact agent, and the small 5x5 mm TFBGA footprint fits credential-card and gateway form factors. For deployments needing more code headroom, the same-footprint STM32F103RBH6 raises Flash to 128 KB without any PCB change.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: STM32F103R8H6TR — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | STM32F103RBH6 | STM32F103RCH6 | STM32F103RDH6 | STM32F103REH6 | GD32F103 |
|---|---|---|---|---|---|---|
| Package | 64-TFBGA (5x5) | 64-TFBGA (5x5) - same | 64-TFBGA (5x5) - same | 64-TFBGA (5x5) - same | 64-TFBGA (5x5) - same | TFBGA-64 (5x5) - pin-compatible second source |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | GigaDevice |
| Core | ARM Cortex-M3, 32-bit RISC | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 compatible core |
| Maximum Clock Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 108 MHz |
| Communication Interfaces | 9 (USB, CAN, USART/UART, SPI, I2C) | 9 (USB, CAN, USART/UART, SPI, I2C) | 9 (USB, CAN, USART/UART, SPI, I2C) | 9 (USB, CAN, USART/UART, SPI, I2C) | 9 (USB, CAN, USART/UART, SPI, I2C) | USB, CAN, USART, SPI, I2C |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.7 V / 3.6 V (typical GD32F103 range) |
Ana Farklılayıcılar
- Smallest footprint in the STM32F103 64-pin family while retaining full medium-density peripherals (karşılaştırma:STM32F103R8T6)
- Industry-standard 72 MHz Cortex-M3 with 90 DMIPS versus a faster generic Cortex-M3 (karşılaştırma:GD32F103)
- Same-footprint memory upgrades without PCB respin (karşılaştırma:STM32F103RBH6)
- Industrial-grade temperature rating in a small footprint (karşılaştırma:STM32F103R8T6)
Tasarım Notları
The 64-TFBGA 5x5 mm package uses a 0.5 mm ball pitch, so a two-layer board cannot be routed directly to the device. Design a 0.4 mm or finer escape layer that fans the 64 balls out to a 0.5 mm or 0.65 mm via field, then present a QFP-style 0.5 mm-pitch land pattern to the assembler. Keep the fanout ring as short as possible to limit stub-induced signal integrity problems on fast edges, and follow the ST footprint recommendation for solder mask and paste apertures (nominal 0.25 mm paste per 0.3 mm ball).
Decouple aggressively: place a 100 nF X7R ceramic within 2 mm of every VDD pin and a separate 100 nF plus 1 uF or 4.7 uF bulk capacitor on the VDDA pin, because the ADC reference shares that domain. Estimated: with 72 MHz operation and typical peripheral activity, budget roughly 25-40 mA of active supply current, so a 100 mA 3.3 V regulator with 1 uF of output capacitance gives comfortable transient margin. Note that the MCU does not include an internal LDO for VDDA, so analog supply must be filtered externally.
Estimated junction behaviour at 72 MHz in a 3.3 V/25C ambient: with a typical core and IO activity of roughly 20 mA at 3.3 V, total dissipation is about 66 mW. The TFBGA-64 thermal pad routes this into the board copper, so provide a solid ground-pour region under the device with thermal vias on roughly a 1 mm grid to keep the local rise negligible. The industrial -40C to +85C grade leaves margin for enclosure temperature rise, but check the worst case with the pad area actually available in your stack-up.
Three recurring errors break STM32F103R8H6TR designs. First, omitting the 100 nF decoupling on a VDD ball - a 5x5 mm BGA makes this easy to overlook. Second, assuming the STM32F103R8T6 LQFP-64 footprint is interchangeable - it is not, despite identical silicon. Third, forgetting to bring out SWDIO, SWCLK, and ground for programming; a TFBGA-64 board with no accessible debug header often requires a dedicated programming jig. Also verify that flash wait states and the 72 MHz PLL settings match your supply voltage before locking option bytes.
Keep the USB D+/D- pair as a short, symmetric, tightly coupled pair with a continuous ground reference beneath it, and route the CAN TX/RX pair away from the SWD clock and the ADC input traces. Place the 16 MHz or 8 MHz crystal within 10 mm of the OSC_IN/OSC_OUT pins with its load capacitors on the same side of the board and no ground plane void under the crystal loop. For analog inputs, use a separate quiet ground pour connected at a single point near the VDDA capacitor to prevent converter return currents from injecting noise into conversion results.
Uyumluluk Bilgisi
STMicroelectronics markets the STM32F103 family as RoHS-compliant; no REACH, halogen-free or conflict-minerals statement was present in the verified distributor data. The '6' suffix denotes the industrial-grade -40C to +85C option, which is not AEC-Q100 qualified for automotive applications.
