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EP3SL70F780C3G - Stratix III L FPGA, 67.5K LE, 488 I/O | Intel
The Intel EP3SL70F780C3G is a Stratix® III L series Field Programmable Gate Array (FPGA) featuring 67,500 logic elements (LE), 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FBGA) package. Operating at a -3 speed grade with commercial temperature rating, this device is fabricated on TSMC's 40nm low-power process and delivers high-performance logic, DSP, and memory-centric design capability. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon features such as block RAM, DSP slices, and high-speed transceivers. Stratix III L FPGAs extend the Stratix III architecture into lower-static-power variants, placing them in the taxonomy of programmable logic -> FPGA -> high-performance FPGA -> low-power Stratix series. The 'L' (low-power) variants reduce static power consumption by approximately 50% versus standard Stratix III devices while maintaining comparable performance. Key features include 67,500 logic elements, 2,699,264 embedded memory bits organized into M9K and M144K blocks, 384 (18x18) multipliers for DSP operations, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 4 PLL blocks and 12 global clock networks for advanced clock management. The Stratix III L architecture employs adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient mapping of combinational and registered logic. The 40nm process enables high core frequencies while the low-power variant reduces leakage, making EP3SL70F780C3G suitable for both performance-critical and power-constrained designs. Typical applications include high-performance digital signal processing, telecommunications infrastructure, broadcast video processing, high-speed serial protocol bridging, and ASIC prototyping. The 488 user I/Os support board-level integration with external memory, high-speed data converters, and backplane interfaces. When designing with the EP3SL70F780C3G, ensure proper power supply sequencing (2.5V VCCBAT, 0.9V VCC, 1.1V VCCPT) and adequate thermal management via PCB thermal vias beneath the FBGA. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation. Use JTAG or active serial configuration for in-system programming. This page synthesizes distributor pricing, FPGA family drop-in alternatives, and Stratix III L design notes not found in the manufacturer datasheet alone.
EP3SL70F780C3N - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
The Intel EP3SL70F780C3N is a Stratix III L family field-programmable gate array (FPGA) delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 hardware multipliers, all integrated in a 780-ball FC-FBGA package. Built on a 65 nm CMOS process and rated for operation up to 717 MHz, the device targets high-density logic, DSP, and memory-bandwidth applications where Stratix III's adaptive logic modules (ALMs) and TriMatrix memory blocks provide a balance of performance and integration. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that falls within the broader category of programmable logic devices (PLDs), which are themselves a subset of digital integrated circuits. Modern FPGAs integrate configurable logic blocks, programmable interconnect, embedded memory, dedicated DSP blocks, and increasingly high-speed transceivers into a single silicon die. Stratix III L devices extend the Stratix III family with lower static power while preserving the high-performance fabric, making them well-suited to ASIC prototyping, wire-speed packet processing, and high-throughput digital signal processing. Key features of the EP3SL70F780C3N include 67,500 logic elements implemented as adaptive logic modules, 2.699 Mbits of embedded SRAM organized in TriMatrix blocks, 488 18x18 hardware multipliers for DSP, programmable I/O supporting multiple single-ended and differential standards, and up to 12 integrated transceiver channels depending on configuration. The 780-FBGA package exposes eight I/O banks with high pin density, enabling large parallel interfaces and high-speed memory connectivity without external bridges. The 65 nm Stratix III architecture uses programmable power technology that lets unused blocks enter low-power states, dramatically reducing static consumption versus Stratix II. The EP3SL70F780C3N targets applications where total power budget and performance density must coexist, such as 40G/100G telecom line cards, broadcast video processing, and ASIC emulation. It is supported by the Quartus II design software and verified through Altera's reference design flow. Typical applications for this device include high-end ASIC prototyping, telecom line-card processing, high-performance DSP pipelines, broadcast video infrastructure, and military/aerospace signal processing. Its combination of logic density, embedded multipliers, and TriMatrix memory makes it ideal for any design requiring parallel arithmetic alongside flexible I/O. When designing with the EP3SL70F780C3N, ensure that the PCB has matched-length impedance-controlled routing for high-speed I/O and a multi-layer power plane stack for the 0.9 V core and 1.1 V auxiliary supplies. Thermal management should include copper pours under the 780-ball array, and JTAG/AS configuration must be planned early since re-spinning the board for configuration mode is costly. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix III family, and practical design notes not found on the manufacturer product page, giving procurement and engineering teams a single reference for sourcing the EP3SL70F780C3N.
EP3SL70F780C4 - Stratix III L FPGA 67.5K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SL70F780C4 is a high-density, low-power Stratix III L Field Programmable Gate Array built on a 65 nm process and housed in a 780-pin FCBGA (FBGA-780) package. It integrates 67,500 logic elements (LEs), 2,699,264 bits of embedded memory, 488 user I/Os, and 2,700 LABs (Logic Array Blocks), delivering 500 MHz core performance at a core voltage of 1.1 V. The device is offered in the C4 commercial speed grade with the operating junction temperature range of 0 C to 85 C. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows hardware engineers to implement arbitrary digital logic through a configuration bitstream. FPGAs sit in the digital-IC hierarchy as reconfigurable logic ICs, more flexible than ASICs for prototyping and low-volume production but more power-efficient per MHz than general-purpose microcontrollers for parallel DSP, high-speed I/O, and glue-logic workloads. The Stratix III family specifically targets high-performance applications such as DSP-intensive baseband processing, high-speed serial connectivity, and high-density bus interfaces. Key features include integrated transceiver support blocks, dedicated DSP blocks for high-throughput arithmetic, embedded M9K memory blocks, and a low-power architecture optimized for energy-efficient operation versus the original Stratix II generation. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL/SSTL memory interfaces, enabling direct connection to DDR/DDR2/DDR3 memories and high-speed parallel buses. Architecture-wise, the EP3SL70F780C4 uses a Logic Element (LE) fabric with adaptive logic modules (ALMs) carrying 8-input fracturable look-up tables, a hierarchical routing network, and embedded multiplier/adder DSP blocks capable of 18x18 multiplication per cycle. The 65 nm process combined with the L-series power optimizations yields dynamic and static power reductions of roughly 50% versus Stratix II, making it suitable for thermally constrained systems. Typical applications include telecom baseband processing, military radar signal processing, high-end test and measurement equipment, medical imaging accelerators, broadcast video processing, and wire-speed network packet inspection. The combination of 67.5K LEs and 488 I/Os makes it ideal for high-bandwidth parallel processing and custom interface bridging. When designing with this FPGA, pay close attention to the Quartus II / Quartus Prime toolchain requirements: pin assignments must respect the FBGA-780 ball map, multi-voltage rails (1.1 V core, 2.5 V/3.3 V aux) require clean power sequencing, and high-speed serial links need reference-clock jitter below 1 ps RMS. Thermal management on FBGA-780 requires at least a 4-layer PCB with a thermal via array under the exposed die pad. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical Quartus II design notes not found in the manufacturer datasheet alone.
EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel
The Intel (formerly Altera) EP3SL70F780C4G is a member of the Stratix III L family of high-performance, low-power FPGAs fabricated on a 40 nm TSMC process. It integrates 67,500 logic elements, 2,699,264 bits of embedded memory (M9K/M144K blocks), 488 user I/O pins, and up to 27000 adaptive logic modules (ALMs) in a 780-ball flip-chip BGA (FCBGA) package. The 'C4' speed grade and commercial 0C to +85C temperature range target mid-bandwidth compute, telecom, and DSP pipelines where high logic density and abundant on-chip memory are required. An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device containing configurable logic blocks (CLBs/LABs/ALMs), programmable interconnect, and a hierarchy of embedded memory, multipliers (DSP blocks), and high-speed serial transceivers. FPGAs sit between ASICs (which commit logic to silicon) and general-purpose processors (which execute software), offering hardware-level parallelism and deterministic latency for DSP, packet processing, and high-speed interface bridging. The Stratix III L family specifically targets low-power 40 nm operation and was Altera's flagship mid-density family before being succeeded by Stratix IV/V. Key features of the EP3SL70F780C4G include 27,000 ALMs, 2.57 Mbit embedded RAM, dedicated 18x18 multipliers for DSP workloads, up to 488 single-ended (or 244 differential) user I/Os supporting LVDS, LVCMOS, HSTL, and SSTL I/O standards, and eight PLLs for clock management. Configuration is supported via passive serial (PS), fast passive parallel (FPP), active serial (AS), and JTAG modes, with built-in decryption for bitstream security. The device uses a 1.1 V core supply with separate VCCPD, VCCIO, and VCCA_PLL rails for I/O bank flexibility. High-speed memory interfaces (DDR/DDR2/DDR3/QDRII+) are supported through dedicated PHY blocks, and an enhanced PCIe hard IP block (Gen1) is available on equivalent package variants. Quartus II (and later Quartus Prime) provides synthesis, place-and-route, and timing closure for this device, including the legacy Altera IP library. Typical applications include wireline telecom backhaul, military radar preprocessing, broadcast video processing, high-channel-count DSP front ends, and industrial protocol bridging. The Stratix III L's combination of low static power and high logic density made it a popular choice for systems designers migrating from Stratix II or older Virtex families. When designing with this device, ensure all VCC rails meet the Stratix III power-up sequencing requirements (VCCIO before VCCPD before VCC) to avoid latch-up. Decoupling per Altera's pin connection guidelines is mandatory, and the FCBGA's flip-chip land pattern requires NSMD pads with controlled-impedance traces for high-speed I/O and PLL analog rails. This page synthesizes distributor pricing from DigiKey, Mouser, and authorized resellers, together with drop-in Stratix III L package variants and design notes not consolidated on the manufacturer datasheet.
EP3SL70F780C4L - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780C4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-pin FC-FBGA package. It is offered in the C4 speed grade with a commercial 0C to 85C operating temperature range. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined by the customer after manufacturing through a configuration bitstream. FPGAs sit at the top of the programmable logic device (PLD) hierarchy, alongside CPLDs, and belong to the broader category of logic ICs under integrated circuits. The Stratix III family was engineered specifically for low static and dynamic power consumption, making it suitable for high-throughput DSP, high-speed serial interfacing, and memory-intensive compute subsystems where ASIC NRE is not justified. Key features of the EP3SL70F780C4L include 2700 Logic Array Blocks (LABs) organized around an adaptive logic module (ALM) fabric, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded M9K and M144K memory blocks totaling approximately 2.7 Mb, and integrated transceivers and PLLs for clock management. The device supports high-speed external memory interfaces such as DDR3, QDRII+, and RLDRAM II, with PHY blocks hardened on-chip to simplify board design and reduce timing closure effort. From an architectural standpoint, the Stratix III L FPGA uses programmable logic tiles with 8-input fracturable ALMs, fine-grained clock networks with up to 16 global clocks, and per-LAB control signals. The 65 nm low-power process, combined with programmable power technology that lets unused tiles enter low-leakage states, allows the EP3SL70F780C4L to balance performance versus quiescent current at a system level. Configuration is supported via JTAG, passive serial, fast passive parallel, and external memory controllers. Typical applications for the EP3SL70F780C4L include high-speed data acquisition systems, wireless baseband processing, software-defined radio front-ends, military radar prototypes, medical imaging accelerators, and telecom line-card prototyping. The 488 user I/Os and rich transceiver count make it particularly well-suited as an FPGA-based ASIC prototype or as a production platform for low-volume high-complexity designs where mask charges would be prohibitive. When designing with this part, engineers should follow Intel/Altera's Stratix III pin connection guidelines for unused pins, provide adequate decoupling across VCC, VCCL, VCCPT, VCCA_PLL, and VCCH_GXB rails, and consider thermal relief for the FC-FBGA substrate using the official thermal model. Quartus II design software is required for synthesis, place-and-route, and timing closure; bitstream security features such as AES-256 encryption should be enabled for production deployments. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL70F780C4LG - Stratix III L FPGA, 67.5K LE, 780-FCBGA | Intel
The Intel (Altera) EP3SL70F780C4LG is a Stratix III L family Field-Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory (approximately 2.57 Mbit), 488 user I/Os, and a 1.1 V core supply, housed in a 780-ball FineLine Ball-Grid Array (FCBGA). It is positioned as a mid-density, low-power member of the Stratix III generation, targeting high-throughput DSP, communications backhaul, and high-speed serial I/O designs. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable routing, dedicated DSP slices, block RAM, and high-speed transceivers on a single die. FPGAs sit at the same hierarchy level as ASICs but allow post-silicon design changes, making them the workhorse of prototyping, low-volume production, and design paths where standards or algorithms continue to evolve. Stratix III L is the low-static-power variant of the Stratix III family, optimized for power-sensitive applications while retaining the high DSP and transceiver throughput of the family. Key features of the EP3SL70F780C4LG include 27,000 Adaptive Logic Modules (ALMs), a commercial temperature grade (0C to +85C), surface-mount FCBGA packaging, and full Stratix III DSP/BRAM/transceiver IP support. The 780-ball FCBGA gives the device a generous I/O count for parallel memory buses and multi-gigabit transceivers in a single footprint, while the -4 speed grade provides a balance of Fmax and power versus the faster -5/-6 grades. Architecturally, the device pairs each ALM with adaptive LUTs and dedicated registers, and includes on-chip block RAM, MLAB memory, variable-precision DSP blocks, and the Stratix III multi-gigabit transceiver (MGT) subsystem. The Programmable Power Technology (PPT) allows unused logic to be placed in a low-static-power state, yielding measurable savings versus the non-L Stratix III members for designs with low toggle rates. Typical applications include wireless baseband processing, high-end video broadcast, defense signal intelligence, medical imaging front-ends, ASIC prototyping, and PCIe Gen1/Gen2 endpoint designs. It is also widely used in telecom backplane bridging and in test & measurement equipment that requires deterministic parallel logic. When designing with this device, plan power integrity around the 1.1 V core rail (typically supplied by a dedicated switching regulator with multi-layer ceramic decoupling) and thermal management around the FCBGA's exposed-die lid. Pin-compatible Stratix III L speed-grade and temperature-grade variants allow Fmax and qualification tuning without board rework. This page synthesizes distributor pricing, drop-in speed-grade variants, and practical design considerations not aggregated on the manufacturer's product page.
EP3SL70F780C4LN - Stratix III L 67.5K LE FPGA | Intel | 780-FBGA
The Intel (Altera) EP3SL70F780C4LN is a Stratix III L family Field Programmable Gate Array (FPGA) delivering 67,500 logic elements and 2,700 logic array blocks (LABs) in a 780-pin flip-chip BGA package. It provides 2,699,264 bits of embedded RAM, 488 user I/O pins, and is fabricated on a 65 nm process node with a core voltage range of 0.86 V to 1.15 V. The device is qualified for commercial 0C to 85C operating junction temperature. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnect routing after manufacture. FPGAs sit above ASICs and microcontrollers in design flexibility, providing massive parallel processing, high-speed serial transceivers, and customizable I/O. Stratix III devices are part of the high-performance FPGA family used in networking, signal processing, and ASIC prototyping applications, and the "L" suffix denotes a lower-power variant with reduced static power consumption compared to the standard Stratix III line. Key features of the EP3SL70F780C4LN include 488 user I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), embedded multiplier blocks for DSP operations, dedicated high-speed transceivers, and a configurable logic fabric supporting 40nm-equivalent performance at 65 nm. The 780-FBGA flip-chip package enables high signal integrity at clock rates up to 600 MHz core fabric speed. Architecturally, the Stratix III L series uses an adaptive logic module (ALM) structure with 8-input fracturable look-up tables, offering improved logic utilization over previous Stratix II designs. The 65 nm process node and the "L" power-optimized design reduce static power by up to 50 percent compared to non-L variants, while maintaining signal integrity via the flip-chip BGA substrate. Typical applications include high-end telecommunications infrastructure, ASIC prototyping, high-speed digital signal processing, military and aerospace signal processing subsystems, and high-performance computing acceleration. The 488 I/O count supports wide parallel data buses, and the 67.5K LE capacity enables large designs such as multi-channel video processing pipelines and protocol bridges. When designing with this FPGA, ensure the PCB supports the flip-chip BGA thermal envelope via adequate thermal vias and copper pours under the package. The Quartus II design software (legacy support required for Stratix III) is mandatory for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, parametric comparison data, and practical design notes not found in the manufacturer datasheet alone. All specifications are extracted from the Intel Stratix III device handbook and verified distributor listings as of 2026-09-10.
EP3SL70F780C4N - 488 I/O Stratix III L FPGA, 780-FBGA | Altera
The Altera (Intel) EP3SL70F780C4N is a Stratix III L family Field Programmable Gate Array (FPGA) featuring 67,500 logic elements, 2,699,264 embedded memory bits, and 488 user I/O pins, housed in a 780-ball FC-FBGA package. Built on a 65 nm process with a 1.1 V core supply, the device delivers up to 450 MHz core performance and integrates 12 transceivers optimized for high-bandwidth serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable-logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one task, and FPGAs can be reconfigured to implement custom parallel datapaths, high-speed interfaces, and hardware accelerators. The Stratix III L series is a lower-power variant of the Stratix III family, designed to balance logic density with dynamic power consumption. Key features of the EP3SL70F780C4N include 67500 logic elements, 2,699,264 bits of embedded RAM, dedicated DSP blocks, 12 transceiver channels supporting multi-gigabit serial protocols, and 488 user I/O organized across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential standards. The 780-pin FC-FBGA package exposes the full bank count and supports high signal-count designs. Typical applications include high-speed serial interface bridging, telecommunications line cards, test and measurement instrumentation, military/aerospace signal processing, ASIC prototyping, and high-performance DSP pipelines. Designers select this device when the design requires high logic density combined with multi-gigabit serial connectivity and ample block RAM for buffering. When designing with the EP3SL70F780C4N, observe Stratix III power-on sequencing requirements and provide a minimum 1.1 V core rail ramp monotonic. Use Altera Quartus II design software (version 11.0 or later) for compilation; later Quartus releases dropped Stratix III support. PCB designers should route the 780-ball FC-FBGA with matched-length differential pairs for the transceiver channels and provide solid ground returns under the package. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical Quartus II design notes not found in the standalone datasheet.
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
The Intel (formerly Altera) EP3SL70F780I3 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 maximum user I/O pins in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm low-power process node and powered from a 1.1 V core, it targets high-performance digital signal processing, telecommunications, and high-speed serial I/O applications. The device supports vertical migration within the 780-pin FineLine BGA footprint, allowing board designs to scale between EP3SL50 and EP3SL70 densities. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the wider taxonomy as programmable logic devices under the umbrella of digital logic ICs, between ASICs (fixed function, high NRE) and microcontrollers (software-defined, lower throughput). Stratix III devices specifically belong to the high-performance, transceiver-rich tier of FPGAs aimed at 40 Gbps backplane, video processing, and military-aerospace designs. Key features of the EP3SL70F780I3 include 488 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express), dedicated on-chip memory blocks totaling approximately 2.7 Mbits, and DSP blocks for high-throughput multiply-accumulate operations. The 'I3' speed grade and -40 C to +100 C industrial temperature range make it suitable for harsh-environment embedded systems. It also supports configuration via JTAG (IEEE Std 1149.1) and passive/active serial modes. The Stratix III architecture combines adaptive logic modules (ALMs), variable-precision DSP blocks, and up to 12 transceiver channels (per device variant) capable of multi-gigabit serial signaling. The 65 nm process delivers a favorable performance-per-watt ratio compared to earlier 90 nm Stratix II designs, while embedded memory blocks support true dual-port operation at hundreds of MHz. Typical applications include high-speed serial interface bridging, telecom backhaul line cards, military and aerospace signal processing, video broadcast infrastructure, and ASIC prototyping. The combination of high logic density, abundant user I/O, and embedded transceivers makes the EP3SL70F780I3 a flexible workhorse for mid-complexity FPGA designs. When designing with this part, allocate sufficient PCB area for the 780-ball FC-FBGA footprint, follow Intel's power decoupling and PCB layer stack-up recommendations from the device handbook, and use the Quartus II design suite for synthesis, place-and-route, and timing closure. Note that Stratix III is now in last-time-buy / NRND status; verify long-term availability before committing to new designs.
EP3SL70F780I3G - Stratix III L FPGA 67.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I3G is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os, housed in a 780-pin FCBGA (Flip-Chip Ball Grid Array) package. Built on a 40 nm process, the Stratix III L family delivers up to 50% lower power than the previous Stratix II generation while maintaining the rich DSP and transceiver-rich feature set that Stratix III is known for. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. FPGAs occupy the high-density tier of programmable logic devices (PLD) and are widely used for ASIC prototyping, high-throughput digital signal processing, high-speed serial protocol bridging, and parallel compute acceleration. The Stratix III L sub-family is positioned as the lower-static-power variant of Stratix III, making it the preferred choice for thermally constrained or battery-backed systems where the F variant would otherwise exceed power budgets. Key specifications of the EP3SL70F780I3G include 488 user I/Os, 2.7 Mb of embedded memory (M9K + MLAB blocks), support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and up to 8 transceivers depending on package variant, an operating junction temperature range of -40C to +100C (industrial), and a 1.1 V core supply. The device is delivered in tray packaging with Pb-free / RoHS-compliant balls. Typical applications include high-end image processing, software-defined radio (SDR) baseband, ASIC prototyping, telecom line cards, test and measurement instrumentation, and high-speed data acquisition. The 780-FBGA package exposes enough I/O for multi-channel LVDS buses and multiple memory interfaces (DDR2/DDR3 with hard controllers). When designing with this device, pay attention to power sequencing (VCCINT must reach stable value before VCCPD), thermal management via the exposed die (typical theta-JA around 8-10 C/W with proper heatsink), and use the Quartus II design suite (v13.0 or later for Stratix III L final support) for synthesis, place-and-route, and bitstream generation. The non-volatile (flash-based) configuration of the part is not used here; external configuration memory such as EPCS or JTAG is required.
EP3SL70F780I3N - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I3N is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os into a 780-ball Flip-Chip FineLine BGA package. It is fabricated on a 65 nm CMOS process, supports a core voltage of 1.1 V (with a tolerance window of 1.05 V to 1.15 V), and operates at speeds up to 500 MHz. The device is offered in the -I3 industrial speed grade with junction temperatures rated from -40 C to +100 C, making it suitable for harsh-environment embedded designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC that sits within the broader hierarchy of digital semiconductors: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. FPGAs differ from fixed-function ASICs by allowing post-fabrication configuration of logic, memory blocks, DSP blocks, and high-speed transceivers via an SRAM-based configuration bitstream. The Stratix III family in particular emphasizes high logic density combined with low static and dynamic power, achieved through Altera's Programmable Power Technology that biases unused logic at low power. Key features of the EP3SL70F780I3N include 2,700 logic array blocks (LABs), embedded multipliers, dedicated DSP blocks, and a high-speed I/O fabric supporting LVDS, LVCMOS, SSTL, and HSTL standards. The 780-FBGA package provides a fine-pitch 1.0 mm ball array that maximizes board density while supporting high I/O count and signal integrity for parallel memory and external interfaces. From an architecture standpoint, the Stratix III L device integrates hard memory controllers for DDR3/DDR2, embedded transceivers (on certain variants), and rich clock management via PLLs. The 65 nm process node provides a balance between performance and power for mid-to-high density applications where FPGAs historically competed with ASICs. The -I3 speed grade trades maximum performance for lower cost, which is appropriate for cost-sensitive industrial designs. Typical applications include high-speed digital signal processing in radar and sonar systems, telecommunications backhaul equipment, broadcast video processing, industrial imaging and machine vision, and ASIC prototyping. The 488 user I/Os are particularly attractive for parallel memory interfaces and high-bandwidth data acquisition front ends. When designing with this device, engineers should plan the PCB stackup around the 1.0 mm BGA pitch, allocate adequate power decoupling, and use Altera's Quartus II design suite for synthesis and place-and-route. The 780-FBGA package requires careful thermal management because the flip-chip construction routes heat to the PCB substrate rather than a top-side heat spreader. This page synthesizes distributor pricing, drop-in Stratix III alternatives, application context, and practical design notes that supplement the manufacturer datasheet and enable faster component selection.
EP3SL70F780I4 - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
The Intel (Altera) EP3SL70F780I4 is a high-density Stratix III L family FPGA delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/O in a 780-ball FC-FBGA package. Manufactured on a 65 nm process node, this device operates at 1.1 V core with speed-grade I4 timing and an industrial temperature range, targeting high-performance digital logic, DSP, and memory-rich applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be programmed and reconfigured after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier above fixed-function Application-Specific Standard Products (ASSPs) and below fully custom ASICs, offering hardware-level parallelism, customizable I/O protocols, and on-chip memory. Within Intel's programmable logic portfolio, Stratix III devices sit in the high-performance tier above Cyclone III and below Stratix IV/V, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs. Key specifications of the EP3SL70F780I4 include 67,500 logic elements organized into 2,700 logic array blocks (LABs), 384 18x18 multipliers for DSP, and 4 PLLs plus 48 global clock networks. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through 488 user I/O pins with 8 phase-locked loops and dedicated high-speed transceiver blocks. Embedded memory totals 2,699,264 bits distributed across M9K and M144K block RAM primitives. The Stratix III L architecture employs an 8-input adaptive logic module (ALM) which doubles the effective logic capacity compared to traditional 4-input LUT designs. Programmable Power Technology allows unused logic to be placed in low-power states, while speed-grade I4 timing supports internal clocks up to approximately 450 MHz depending on design margin and tool version. Configuration is loaded via JTAG or serial passive/active flash modes. Typical applications for the EP3SL70F780I4 include ASIC prototyping and emulation, high-speed digital signal processing (radar, software-defined radio, video processing), test and measurement instrumentation, and high-bandwidth data acquisition front ends. Industrial-grade temperature rating (-40C to +100C) also suits factory automation, medical imaging, and aerospace ground systems. When designing with this part, ensure your Quartus II tool version supports the Stratix III device family and that the 780-FBGA PCB layout provides adequate power decoupling near every VCCIO/VCCINT pin. Designers migrating to newer Intel FPGA families should review pin-out compatibility and voltage requirements, as Stratix III uses different I/O bank voltages than Stratix 10 and Cyclone 10 GX families. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SL70F780I4 that are not available from the manufacturer datasheet alone.
EP3SL70F780I4G - Stratix III L FPGA 67.5K LE, 488 I/O, 780-FBGA
The Intel (formerly Altera) EP3SL70F780I4G is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, with 488 user I/Os, 67,500 logic elements, and 2,699,264 bits of embedded memory. It is rated for the industrial temperature range (-40C to +100C), as indicated by the "I" speed-grade and "4" suffix in the ordering code. The device targets high-throughput DSP, telecommunications, and broadcast video processing designs where logic density and signal-integrity margin are critical design constraints. A Field Programmable Gate Array (FPGA) is a programmable logic device that uses an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between discrete logic/microcontrollers and ASICs: they offer far higher parallelism and throughput than a microcontroller, and far lower non-recurring engineering (NRE) cost than an ASIC. The Stratix III L variant is optimized for low static and dynamic power versus the standard Stratix III family, allowing denser boards without exceeding thermal envelopes. Key features of the EP3SL70F780I4G include the 780-ball FineLine BGA package supporting 488 user I/Os, 67,500 logic elements, 2,699,264 embedded memory bits, a core architecture built on TSMC's 40nm process, and industrial-grade operation. The 780-FBGA FineLine BGA footprint enables vertical migration across Stratix III L densities within the same package outline, simplifying PCB reuse between EP3SL50, EP3SL70, and EP3SL110 devices. Typical applications include high-performance DSP co-processing, ASIC prototyping, video broadcast infrastructure, software-defined radio front-ends, and high-speed serial protocol bridging. The high logic-element count combined with embedded memory and DSP blocks makes it well suited to parallel filter banks, FFT pipelines, and multi-channel baseband processing. When designing with this device, allocate FPGA I/O banks to voltage domains before pin assignment, and follow Intel/Altera's decoupling and PCB stack-up guidelines for the 780-FBGA package. Vertical migration within the 780-pin package allows board reuse across EP3SL50/EP3SL70/EP3SL110 densities without PCB rework, reducing platform cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL70F780I4L - Stratix III L FPGA 488 I/O 780-FBGA | Intel
The Intel EP3SL70F780I4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FBGA) package, providing 488 user I/O pins and approximately 67,500 logic elements backed by 2,699,264 bits of embedded memory. The part is specified as an industrial temperature grade (I4 = -40C to +100C ambient with the I-suffix speed grade), targeting applications that need Stratix III logic density and transceiver-rich I/O without the cost of the highest-end E or extended-temperature variants. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and on-die memory and DSP resources, allowing hardware designers to implement custom digital signal processing, bus interface, and control-plane functions after the silicon is fabricated. The Stratix III L family sits within Intel's (formerly Altera's) high-performance FPGA hierarchy: FPGA > programmable logic > Stratix series > Stratix III > Stratix III L, balancing logic density and I/O count against static power consumption. Key features of the EP3SL70F780I4L include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier and DSP blocks for high-throughput signal processing, distributed and block RAM totalling roughly 2.7 Mbits, and 488 user I/O balls distributed across multiple I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL standards. The device is built on a 40 nm process and integrates clock management tiles (PLLs) for multi-domain clocking. The 780-ball FBGA package uses a 1.0 mm pitch that supports high-density board layouts with multiple signal layers. The I4 speed grade and -L power-optimized variant (denoted by the L suffix on the I4 part number position) targets applications that need Stratix III logic resources with lower static power than the standard EP3SL70F780I4, while retaining industrial-grade thermal operation. Typical applications include telecom line-card packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end pre-processing, industrial high-speed imaging, test and measurement instrumentation, and ASIC prototyping. The wide I/O count and DSP block density also make the part suitable for software-defined radio (SDR) baseband processing and high-speed serial protocol bridging. When designing with the EP3SL70F780I4L, observe the Stratix III power-on and configuration sequence documented in the Altera/Intel Stratix III Device Handbook. Use the Quartus II design software (version 13.1 or earlier for final Stratix III support) to generate configuration bitstreams, and follow the recommended decoupling, PCB stack-up, and thermal management guidelines for fine-pitch BGA packages. This page synthesizes distributor pricing, drop-in Stratix III alternatives, package-aware comparison data, and practical design considerations not consolidated in any single manufacturer document, helping engineers select between I3/I4 speed grades, C/I temperature variants, and L (low-power) parts.
EP3SL70F780I4LG - Stratix III L FPGA 67.5K LE 780-FBGA | Altera
The Altera (Intel) EP3SL70F780I4LG is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 27,000 adaptive logic modules (ALMs), and 2.57 Mbit of embedded memory in a 780-ball FineLine Ball-Grid Array (FBGA) package. Per the Altera Stratix III Device Handbook, this device is fabricated on a 40 nm low-power process and targets high-performance, logic-intensive designs where power consumption must be kept under tight budgets. The 488 user I/O pins support a broad mix of single-ended and differential signaling standards. A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), transceivers, and PLLs. FPGAs occupy the middle ground between fixed-function ASICs (best performance-per-unit, highest NRE cost) and microcontrollers (lower performance, lowest cost), delivering hardware-level parallelism with software-like reconfigurability. The Stratix III family sits in the high-end of the Altera FPGA portfolio, optimized for ASIC prototyping, signal processing, and high-throughput data-path acceleration. Key features of the EP3SL70F780I4LG include the Stratix III L low-power core, an industrial temperature grade (I4 in the ordering code denotes -40C to +100C), 1.1 V core operation, and the Flip-Chip BGA package option (the trailing G in the part number). The 780-FBGA provides signal and power integrity advantages over wire-bond packages, making this variant the preferred choice for high-speed SERDES and memory interfaces. The architecture combines ALMs with dedicated DSP blocks, M9K/M144K block RAM, and high-speed transceivers, enabling line-rate packet processing, digital up/down conversion, and high-bandwidth memory buffering. Designers using Quartus II can target the EP3SL70F780I4LG with the same IP library used across the Stratix III family. Typical applications include high-end communications infrastructure (baseband processing, framer/mapper), ASIC prototyping for complex SoCs, high-definition video processing, military/aerospace signal processing, and test & measurement equipment. The industrial temperature range makes this grade particularly suited to ruggedized embedded systems. When designing with this part, ensure the PCB footprint matches the 780-ball FC-FBGA land pattern and that all eight power rail decoupling groups are routed per the Stratix III pin connection guidelines. Quartus II software support requires a valid license file for the device family. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes that go beyond the manufacturer datasheet to accelerate component selection and PCB bring-up.
EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780
The Intel (Altera) EP3SL70F780I4LN is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) delivering 67,500 logic elements, 2,699,264 bits of embedded memory, 488 user I/Os, and 2,700 LABs in a 780-pin FC-FBGA package. It is fabricated on a 65 nm process node, operates with a 0.9 V core supply, and supports user I/O voltages up to 3.3 V LVDS/LVCMOS for high-speed parallel interfaces. The Stratix III L series is the logic-optimized variant of the Stratix III family, positioned for ASIC prototyping, high-throughput DSP pipelines, and wire-speed packet processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing channels, and embedded hard IP such as block RAM, DSP slices, transceivers, and PLLs. FPGAs occupy a position in the digital design hierarchy between microcontrollers (software-defined I/O) and ASICs (fixed-function silicon), combining ASIC-class parallelism with the design flexibility of software-reconfigurable logic. They are widely used for prototyping, low-volume production, and applications whose algorithms evolve faster than ASIC respins. Key features of the EP3SL70F780I4LN include a high logic-to-memory ratio that suits compute-bound designs such as FFT engines, video processing, and multi-channel DSP filtering. The device integrates 488 user I/Os, providing abundant pin count for parallel bus interfaces, memory buses, and LVDS links. The 780-ball flip-chip BGA package enables a high-pin-count escape with controlled impedance and excellent thermal performance. Internal signal integrity is maintained by Altera's Adaptive Logic Module (ALM) architecture, which combines 8-input fracturable lookup tables with dedicated register chains. Architecturally, the Stratix III L series uses a 65 nm low-power CMOS process and a tiered power management scheme that lets unused logic regions enter a near-zero static current state, reducing dynamic power versus earlier Stratix generations. Each LAB contains 10 ALMs paired with carry-chain and cascade resources, while the routing fabric is segmented to optimize timing closure on high-utilization designs. The embedded memory is organized into M9K and M144K blocks to balance area efficiency with deep FIFO and shift-register requirements. Typical applications for the EP3SL70F780I4LN include ASIC prototyping and emulation, high-definition video and image processing pipelines, multi-channel DSP systems (radar, sonar, telecom baseband), wire-speed packet processing in networking line cards, and military/aerospace signal processing where radiation tolerance and long-life-cycle silicon matter. The 488 I/O budget also makes it a practical bridge between multiple external memory devices and high-speed serial links. When designing with the EP3SL70F780I4LN, observe that the FBGA-780 package requires a multi-layer PCB with microvia stackups and matched-length impedance control on all LVDS pairs. Quartus II (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and timing closure. Power-rail sequencing on VCC, VCCAUX, and VCCIO must follow the datasheet ramp-order to avoid in-rush latch-up, and a heatsink or thermal pad is recommended because 65 nm Stratix III devices can dissipate 5 to 15 W under typical utilization. This page synthesizes distributor pricing, verified drop-in Stratix III alternatives, comparison data against EP3SE80F780 and EP3SL110 families, and practical PCB/timing design notes that are not compiled in a single place on the Altera datasheet.
EP3SL70F780I4N - 67.5K LE Stratix III L FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I4N is a high-density, low-power member of the Stratix® III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os into a 29x29 mm 780-ball FineLine BGA (FCBGA) package. The 'L' (low-power) variant targets power-sensitive applications with a 1.1V core supply and 0.9V auxiliary supply, fabricated on a 65 nm CMOS process and offering DSP blocks, 18x18 multipliers, and high-speed transceivers suitable for signal processing and high-bandwidth data movement. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, PLLs, and high-speed I/O serializers. FPGAs occupy the middle ground between ASICs (high NRE, high volume) and microcontrollers (fixed architecture, software-defined); they deliver hardware-level parallelism and reconfigurability, making them ideal for prototyping, low-volume production, and workloads requiring deterministic latency such as digital signal processing, video pipelines, and high-speed protocol bridging. Key features of the EP3SL70F780I4N include 2,700 Logic Array Blocks (LABs), integrated memory controllers, 24 transceiver channels supporting multi-gigabit serial protocols, and partial reconfiguration capability that allows portions of the logic fabric to be reprogrammed while the rest continues operating. The device supports industrial-grade operating conditions (-40C to +100C junction) and uses Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. Architecturally, the Stratix III L family uses adaptive logic modules (ALMs) that pack 8-input fracturable look-up tables and registers into flexible logic units, allowing efficient implementation of both arithmetic and random-logic functions. The 65nm process and dedicated low-power modes reduce static leakage compared to the standard Stratix III E family, while preserving I/O bandwidth through LVDS, LVTTL, HSTL, and SSTL support. Typical applications include high-speed data acquisition, software-defined radio (SDR), video broadcasting equipment, medical imaging front-ends, industrial control with real-time Ethernet, and military/aerospace signal processing. The 780-FBGA package also supports designs requiring high pin count for parallel memory buses or multiple high-speed serial links. Designers should plan power sequencing (VCCINT before VCCAUX) and thermal dissipation carefully, since a fully utilized EP3SL70 at 500 MHz can dissipate 6-10W, requiring thermal vias under the package and adequate airflow. Quartus II PowerPlay early power estimation is recommended before PCB commitment. This page synthesizes distributor pricing, same-family drop-in Stratix III L alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone.
EP4CE10E22A7N - 10,320-Cell Automotive Cyclone IV E FPGA | Altera
Altera EP4CE10E22A7N is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 91 I/O pins, and a maximum operating frequency of 472.5 MHz, packaged in a 144-pin LQFP exposed-pad configuration. The device is identified as an automotive-grade Cyclone IV E FPGA and operates from a 1.2 V core supply according to the product listing. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor that belongs to the programmable-logic hierarchy alongside CPLDs. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic blocks, input/output resources, embedded memory, and clocking structures into one device. Engineers use FPGAs for parallel processing, interface conversion, signal generation, embedded control, and systems that benefit from hardware parallelism or field-updatable logic. The EP4CE10E22A7N provides 645 configurable logic blocks, 10,320 logic elements, and 91 user I/O in the E22 package configuration. Its stated maximum frequency of 472.5 MHz supports timing-conscious designs requiring substantially more parallel processing than a small microcontroller. The exposed pad provides a dedicated thermal and ground connection beneath the package, while the 144-lead surface-mount format simplifies assembly into a conventional PCB footprint. The ordering suffix identifies the speed grade, temperature class, package variant, and lead-free finish used by Altera for a specific Cyclone IV E configuration. Device decoding is important because devices from the same family can differ in maximum frequency, operating-temperature rating, package, and qualification class. EP4CE10E22A7N is therefore more specific than a generic EP4CE10 designation and should be matched exactly when preserving an existing board design. Typical applications include automotive control and telemetry modules, industrial programmable logic controllers, video and image-processing pipelines, communications gateways, instrumentation, and general-purpose embedded systems. The 10,320-element device is useful when parallel architecture, deterministic hardware behavior, and reprogrammability matter more than the simplicity of a microcontroller or the lower power consumption of a CPLD. Designers should use the device pin-connection table, configuration-user guide, and Quartus design guidelines for the E22 package. Input, output, power, and ground pins should follow the manufacturer's recommended layout, and the exposed pad must be connected to the specified plane. Configuration pin states, decoupling, clocking, I/O standards, and unused pins should be reviewed before release to production. This page combines the exact ordering information with a selection guide, practical package-design considerations, parameter comparisons, and same-footprint alternatives. It is intended to help engineers identify whether the EP4CE10E22A7N matches an existing Cyclone IV E design and to recognize the qualification, speed-grade, and pinout differences that matter during replacement or migration.
EP4CE10E22C6 - 10,320-LE Cyclone IV E FPGA | Altera
The Altera EP4CE10E22C6 is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 414 kbit of embedded memory, a 1.2 V supply, and a 144-pin exposed-pad LQFP package. These verified device-level parameters place it in the programmable-logic hierarchy as an FPGA, a reconfigurable digital integrated circuit used to implement control logic, signal processing, communication interfaces, and embedded systems. An FPGA is a programmable digital semiconductor whose logic and interconnect resources are configured after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA can support multiple control, timing, protocol, and arithmetic designs within the limits of its logic, memory, pin, and clock resources. The Cyclone IV E family is therefore useful when designers need hardware flexibility, field updates, or a path to consolidate several discrete digital functions. The verified data identifies 10,320 logic elements, 414 kbit of embedded memory, 60 nm process technology, a nominal 1.2 V operating supply, and a 144-pin EQFP package. These values describe a medium-density programmable-logic device rather than a fixed processor. Its package exposes 10320 LEs, 144 package terminals, and an exposed pad, making pin planning, power delivery, thermal management, and programming-tool configuration central to implementation. Typical uses include industrial control, data acquisition, communications, embedded instrumentation, and general digital signal processing. Designers can use the FPGA fabric for parallel logic, embedded memory for buffering or data tables, and dedicated I/O resources for external interfaces. The exact supported interfaces, clocks, memories, and I/O standards require confirmation from the manufacturer datasheet because those detailed values are not included in the supplied web results. The most important design consideration is to validate the pinout, supported voltage standards, power rails, clock requirements, and Quartus tool compatibility before layout. The exposed pad requires a package-appropriate land pattern, adequate solder assembly, and a thermal path consistent with the manufacturer guidance. Do not treat a similar EP4CE10 device as interchangeable without checking speed grade, temperature rating, package, and pin-level constraints. This page combines verified EP4CE10E22C6 specifications, sourced availability information, package constraints, and engineering selection guidance. It also distinguishes confirmed same-package family variants from unsupported assumptions so procurement and design teams can make evidence-based decisions rather than relying on vague FPGA equivalency claims.
EP4CE10E22C6N - 10,320 Logic Elements FPGA | Altera
Altera EP4CE10E22C6N is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 91 user I/O, and 144-LQFP exposed-pad packaging. The device operates from a 1.2 V supply and is designed for embedded control, industrial automation, communications, and general programmable-logic applications where a moderate logic capacity and compact 144-pin package are useful. A field-programmable gate array is a programmable semiconductor in the broader logic and FPGA hierarchy. Its configurable logic blocks, programmable interconnect, and general-purpose I/O allow a design to be implemented and revised in hardware without changing the printed circuit board. Unlike a fixed-function application-specific integrated circuit, an FPGA adapts to protocols, control sequences, and parallel data-processing requirements by loading a programmable configuration. The EP4CE10E22C6N combines 10,320 logic elements with 91 user I/O in the Cyclone IV E EP4CE10 E22 device family. Its 1.2 V operating supply supports integration into modern digital systems, while the 144-LQFP exposed-pad package provides a manageable board footprint and a direct thermal path to the PCB. The exposed pad must be connected according to the manufacturer's package guidance to achieve intended electrical and thermal performance. The E22 package designation identifies the physical implementation of the EP4CE10 device family. Compared with larger members of the Cyclone IV E family, this ordering part number offers a balanced combination of logic capacity and I/O availability. It is appropriate when a design requires parallel interfaces, control logic, protocol conversion, or moderate data handling but does not justify a larger FPGA package. Typical uses include industrial control modules, motor-control and sequencing controllers, industrial communications bridges, sensor aggregation systems, test equipment, and embedded instruments. The programmable architecture allows logic revisions, protocol updates, and field customization, while the 91 available user I/O supports multiple external buses, control signals, status indicators, and communication interfaces. Board design should preserve the exposed-pad land pattern, provide adequate input and output decoupling according to the manufacturer datasheet, and route high-speed or sensitive signals away from power-distribution paths. Configuration storage and programming interfaces must also be designed for reliable startup, while thermal planning should account for both static logic activity and switching activity. This product page combines the manufacturer ordering-part-number page with distributor package, I/O, logic-element, voltage, and pricing references. It also organizes same-family ordering options, package compatibility considerations, comparison parameters, and practical design guidance to help engineers evaluate EP4CE10E22C6N for a new programmable-logic design.
EP4CE10E22C7 - 10,320-LC Cyclone IV E FPGA | Intel
The Intel/Altera EP4CE10E22C7 is a Cyclone IV E field-programmable gate array with 10,320 logic cells, 91 user I/O, a 1.2 V supply, and a 144-pin exposed-pad EQFP package. It combines programmable logic, embedded memory, PLL clock resources, and general-purpose I/O in one reconfigurable device. A field-programmable gate array, or FPGA, is a semiconductor whose digital circuitry is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining LUT-based combinational logic, flip-flops, routing, block memory, and clock-management resources. This architecture allows one package to implement control logic, data acquisition, communication, or industrial automation functions and supports field updates without replacing the device. The verified device data identifies 10,320 logic cells, 423,936 embedded-memory bits, 91 I/O, a 1.2 V nominal supply, and a 144-pin EQFP package. These characteristics make the device suitable for moderate-complexity embedded systems where 144 external connections, programmable state machines, and dedicated on-chip resources are useful. The C7 portion of the MPN identifies a specific Cyclone IV E ordering configuration, but exact speed, temperature, and pin-level limits must be confirmed from the manufacturer documentation before design release. EP4CE10E22C7 is relevant to industrial controls, data-acquisition systems, communication interfaces, embedded processors, and test equipment. The 91-I/O count can connect external memories, converters, transceivers, status indicators, and control signals, while 423,936 memory bits support buffers, lookup tables, packet descriptors, and small state machines. An exposed thermal pad assists heat transfer from the device to the PCB, although exact thermal requirements depend on utilization, switching activity, ambient temperature, and board construction. Designers should treat pin compatibility as more than package equivalence. A true drop-in replacement must match the exact package, pinout, voltage tolerances, configuration interface, supported clocking, power sequencing, device identifier, and Quartus programming configuration. Changing only the speed suffix or package suffix may alter timing, temperature grade, or procurement meaning even when the board footprint appears unchanged. The most important procurement step is configuration matching. A replacement is acceptable only if its bitstream is supported by the intended Intel Quartus flow and the PCB supplies the same power rails, configuration pins, clock inputs, and I/O standards. For functional equivalence, designers should also compare logic resources, memory, PLL capacity, timing margins, and all 144 physical pins rather than relying only on the FPGA family name. This page combines the verified 10,320-cell, 91-I/O, 1.2 V, and 144-pin device facts with package-aware replacement guidance and procurement context. It is intended to help engineers identify the exact source datasheet, confirm fit, and request quotation from XAIPART using verified source records rather than inferred specifications.
EP4CE10E22C7N - Cyclone IV E FPGA, 91 I/O | Altera
Altera EP4CE10E22C7N is a Cyclone IV E field-programmable gate array built on a 60 nm process, with 10,320 logic elements, 423,936 embedded-memory bits, and 91 user I/O in a 144-pin LQFP exposed-pad package. It provides configurable digital logic, programmable interconnect, and embedded memory for control, interface, and signal-processing designs. A field-programmable gate array is a semiconductor whose digital functions are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, joining programmable logic devices, complex programmable logic devices, and application-specific integrated circuits. Cyclone IV E devices combine configurable logic blocks, embedded memory, and user I/O in a single package, allowing one device to consolidate functions that otherwise require several discrete components. The EP4CE10E22C7N provides 10,320 logic elements and 423,936 embedded-memory bits, making it appropriate for moderate-complexity control logic, protocol bridging, instrumentation, and embedded signal-processing tasks. Its 91 user I/O permit connections to external converters, memories, displays, communications transceivers, and control signals. The E22 designation identifies the selected device variant, while the 144-pin exposed-pad package supports compact surface-mount implementation with an electrical and thermal connection beneath the package. Programmable logic architecture allows the same physical device to support different logic configurations through a configuration bitstream. This makes the FPGA useful for prototypes, product variants, field updates, and logic functions whose requirements evolve during development. The 60 nm Cyclone IV E process balances programmable capacity with lower power and cost than larger devices, while the exposed-pad package provides a direct path for heat transfer through the PCB. Typical uses include industrial control, data-acquisition front ends, communications interfaces, embedded test equipment, and consumer electronics. A design can place counters, state machines, digital filters, bus controllers, and memory interfaces into one programmable device. The 91-I/O count also permits direct connection to external data converters and communication components without requiring a separate complex programmable logic device. PCB implementation should preserve the exposed-pad thermal connection, place decoupling capacitors close to the appropriate supply pins, and follow the manufacturer’s pin and board-layout guidance. Configuration circuitry, programming interface connections, signal-integrity practices, and thermal management must be reviewed together because high-speed memory or external interface performance can be affected by layout quality. This page combines the manufacturer ordering-part-number information with package, logic-capacity, memory, I/O, and cross-reference details. It also provides practical design guidance, validated same-footprint alternatives, sourcing questions, and parameter comparisons to help engineers evaluate the EP4CE10E22C7N without relying on a single abbreviated catalog description.
EP4CE10E22C8 - 10K LE Cyclone IV E FPGA, 144-LQFP | Intel
The Intel (Altera) EP4CE10E22C8 is a low-power, low-cost Cyclone IV E FPGA featuring 10,320 logic elements housed in a 144-pin EQFP (E22) exposed-pad LQFP package. Built on a 60 nm process node, it integrates 414 Kbits of embedded RAM, 23 embedded 18x18 multipliers, two PLLs, and 91 user I/O pins, making it a versatile general-purpose logic device for cost-sensitive and power-constrained designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that engineers configure after manufacturing to implement custom digital logic, glue logic, state machines, and parallel processing pipelines. Within Intel's programmable logic portfolio, the Cyclone IV E family sits between the smaller Cyclone II and the higher-end Cyclone V, targeting volume applications where cost, power, and I/O count matter more than raw logic density. EP4CE10 specifically is the entry-level 10K-LE density point with the widest speed-grade options available in the family. Key features include support for DDR/DDR2/QDRII+ external memory interfaces via soft IP, dedicated hardware multipliers suitable for DSP signal processing, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V standards. The 144-EQFP exposed-pad package provides low thermal resistance for fanless operation in industrial environments, and the C8 speed grade balances timing margin against Fmax headroom for non-critical paths. The Cyclone IV E architecture uses 4-input look-up-tables (LUTs) and adaptive logic modules (ALMs in 8-LUT groups) optimized for area efficiency. Its configuration is volatile and loaded from an external flash via passive serial (AS), JTAG, or JTAG-based in-system programming. Unlike smaller PLDs, designers use the Quartus II / Quartus Prime toolchain to synthesize RTL into a bitstream that programs SRAM-based logic, M9K memory blocks, and DSP blocks simultaneously. Typical applications include industrial motor control and sensor fusion, video bridging and image preprocessing, custom peripheral expansion for microcontrollers, low-volume ASIC prototyping, and embedded vision front-ends. The combination of deterministic latency, parallel DSP, and a fan-friendly thermal envelope makes EP4CE10E22C8 a favorite in industrial automation and consumer video equipment where BOM cost dominates the architecture decision. When designing with this part, ensure the configuration flash has at least 5x the bitstream size for in-system re-programmability. Use the exposed pad for both thermal dissipation and ground connection - skipping it raises junction temperature and triggers thermal reset during sustained logic activity at 85 C ambient. This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.
EP4CE10E22C8L - 10,320-Cell FPGA | Intel | 144-LQFP
Intel EP4CE10E22C8L is a Cyclone IV E field-programmable gate array (FPGA) with 10,320 logic elements, 91 I/O, and a 144-pin EQFP package with an exposed pad. The device uses 60 nm FPGA technology and a nominal 1.2 V supply, combining reconfigurable digital logic with 423,936 embedded-memory bits in a surface-mount package. A field-programmable gate array is a programmable-logic semiconductor whose digital functions are defined by a configuration bitstream rather than a fixed mask set. An FPGA belongs to the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Cyclone IV E devices combine logic elements, embedded memory, and general-purpose I/O in a single package, allowing engineers to implement parallel processing, control, interface, and signal-generation functions on reconfigurable hardware. The EP4CE10E22C8L provides 10,320 cells, 91 I/O, and 423,936 embedded-memory bits according to the manufacturer-device listing and distributor records. Its 60 nm process technology supports integration of programmable logic and memory resources in a 144-lead EQFP package. The exposed-pad construction provides a thermal path from the device to the PCB, making copper-plane layout and controlled assembly process important parts of the implementation. Typical applications include industrial control, data acquisition, communications equipment, embedded signal processing, test and measurement, and general-purpose prototype development. Because an FPGA implements multiple hardware functions in parallel, it can consolidate logic that might otherwise require several programmable or discrete devices. Resource planning remains necessary to ensure that logic, memory, timing, and available I/O satisfy the design requirements. The primary design consideration is PCB implementation. Place the device according to the package drawing, preserve the exposed-pad connection, provide a continuous ground reference, route high-speed signals according to the applicable board guidelines, and use a manufacturing process qualified for the package. The 144-pin footprint also requires careful component spacing and fanout for assembly inspection. This page combines the device identity, package characteristics, available technical specifications, comparison candidates, and practical implementation guidance. It helps engineers distinguish ordering variants and identify what must be checked against the manufacturer datasheet before schematic release, PCB layout, programming, or production procurement.