ATSAME53J18A-MU-EFP - 120MHz Cortex-M4F MCU, 256KB Flash | Microchip
MPN: ATSAME53J18A-MU-EFP ✓ فعالATSAME53J18A-MU-EFP جائزہ
A microcontroller (MCU) is an integrated circuit combining a CPU core, program and data memory, plus peripheral interfaces on a single silicon die. The Cortex-M4F is a Thumb-2 instruction set core with single-precision IEEE 754 floating point, DSP extensions, and a deterministic interrupt controller (NVIC), positioning it between Cortex-M3 general-purpose parts and Cortex-M7 high-performance parts. The SAME53 sits in the upper-mid tier of the Microchip SAM family, integrating Ethernet, USB, CAN-FD, and crypto accelerators.
Key features include the 120 MHz Cortex-M4F core with FPU, 256 KB Flash with ECC, 128 KB SRAM, 10/100 Ethernet MAC with IEEE 1588 PTP timestamping, USB 2.0 Full-Speed and Hi-Speed capable host/device, dual CAN-FD controllers, and a 12-bit 1 MSPS ADC with up to 24 channels. Hardware crypto accelerators support AES-256, SHA-2, and True Random Number Generation, while the SERCOM peripheral framework provides configurable I2C/SPI/UART on most pins.
The ATSAME53 architecture uses a multi-layer AHB bus matrix that allows simultaneous DMA-driven peripheral transfers while the core executes from tightly-coupled SRAM, sustaining deterministic real-time response. The 1.2V internal core regulator is paired with a brown-out detector and an integrated 8 MHz/48 MHz dual-FRC system that trims against a 32.768 kHz crystal for low-jitter Ethernet and USB clocks.
Typical applications include industrial Ethernet gateways, building automation controllers, smart energy and metering nodes, USB-to-CAN bridges, and IEC 60730 Class B safety appliance controllers. The integrated Ethernet MAC with hardware PTP makes the part well-suited for substation and process automation where precise time synchronization is required.
When designing with this MCU, allocate a 4-layer PCB with a continuous ground pour beneath the 64-pin QFN thermal pad to keep theta_JA manageable; the exposed pad must be soldered for both thermal and electrical ground reference. Decouple VDDIO and VDDIN with 100 nF plus 4.7 uF ceramics placed within 3 mm of each pin group.
This page synthesizes distributor pricing, drop-in alternatives from the SAME53/SAME51 family, and practical design notes not consolidated in the manufacturer datasheet, including PCB layout guidance for the Ethernet PHY interface.
کے لیے ڈراپ اِن متبادل ATSAME53J18A-MU-EFP — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں ATSAME53J18A-MU-EFP (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف ADC, SRAM, Operating Temperature, USB, Core Architecture.
ATSAME53J18A-MF
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →ATSAME53J18A-MFT
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →ATSAME53J18A-MU-EFP زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Core Architecture | ARM Cortex-M4F with FPU |
| Maximum CPU Clock | 120 MHz |
| Instruction Set | Thumb-2 with DSP extensions |
| Program Flash | 256 KB (dual-panel, ECC) |
| SRAM | 128 KB (ECC) |
| Operating Voltage | 2.7 V to 3.6 V |
| پیکیج | 64-pin VQFN with exposed pad (7x7 mm) |
| آپریٹنگ درجہ حرارت | -40 C to +85 C (EFP grade) |
| Ethernet MAC | 10/100 Mbps with IEEE 1588 PTP |
| USB | USB 2.0 FS + Hi-Speed host/device |
| CAN Controllers | 2 x CAN-FD |
| ADC | 12-bit, 1 MSPS, up to 24 channels |
| Hardware Crypto | AES-256, SHA-256, TRNG |
| SERCOM Peripherals | Configurable I2C/SPI/UART |
| ماؤنٹنگ ٹائپ | Surface Mount |
| MSL لیول | 3 (168 hours) |
| RoHS اسٹیٹس | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
ATSAME53J18A-MU-EFP پن کنفیگریشن
| پن 1 | PD00 — GPIO PD00 / SERCOM6 |
| پن 2 | PD01 — GPIO PD01 / SERCOM6 |
| پن 3 | PD02 — GPIO PD02 / SERCOM6 |
| پن 4 | PD03 — GPIO PD03 / SERCOM6 |
| پن 5 | VDDIO — I/O supply voltage |
| پن 6 | GND — Ground |
| پن 7 | VDDIN — Main supply input |
| پن 8 | PA00 — GPIO PA00 / SERCOM1 |
| پن 9 | PA01 — GPIO PA01 / SERCOM1 |
| پن 10 | PA02 — GPIO PA02 / SERCOM2 / ADC0 |
| پن 11 | PA03 — GPIO PA03 / SERCOM2 / ADC0 |
| پن 12 | VDDIO — I/O supply voltage |
| پن 13 | GND — Ground |
| پن 14 | PA04 — GPIO PA04 / SERCOM0 / ADC0 |
| پن 15 | PA05 — GPIO PA05 / SERCOM0 / ADC0 |
| پن 16 | PA06 — GPIO PA06 / SERCOM0 / ADC1 |
| پن 17 | PA07 — GPIO PA07 / SERCOM0 / ADC1 |
| پن 18 | PA08 — GPIO PA08 / SERCOM2 / I2S |
| پن 19 | PA09 — GPIO PA09 / SERCOM2 / I2S |
| پن 20 | PA10 — GPIO PA10 / SERCOM2 |
| پن 21 | PA11 — GPIO PA11 / SERCOM2 / CAN0 RX |
| پن 22 | PA12 — GPIO PA12 / SERCOM2 / CAN0 TX |
| پن 23 | GND — Ground |
| پن 24 | VDDIO — I/O supply voltage |
| پن 25 | VDDIN — Main supply input |
| پن 26 | VDDIO — I/O supply voltage |
| پن 27 | PA13 — GPIO PA13 / SERCOM4 |
| پن 28 | PA14 — GPIO PA14 / SERCOM4 |
| پن 29 | PA15 — GPIO PA15 / SERCOM4 |
| پن 30 | PA16 — GPIO PA16 / SERCOM1 |
| پن 31 | PA17 — GPIO PA17 / SERCOM1 |
| پن 32 | PA18 — GPIO PA18 / SERCOM3 |
| پن 33 | PA19 — GPIO PA19 / SERCOM3 |
| پن 34 | PA20 — GPIO PA20 / SERCOM3 |
| پن 35 | PA21 — GPIO PA21 / SERCOM3 |
| پن 36 | PB00 — GPIO PB00 / SERCOM5 / ADC0 |
| پن 37 | PB01 — GPIO PB01 / SERCOM5 / ADC0 |
| پن 38 | PB02 — GPIO PB02 / SERCOM5 / ADC0 |
| پن 39 | VDDIO — I/O supply voltage |
| پن 40 | GND — Ground |
| پن 41 | PB03 — GPIO PB03 / SERCOM5 / ADC0 |
| پن 42 | PB04 — GPIO PB04 / SERCOM7 |
| پن 43 | PB05 — GPIO PB05 / SERCOM7 |
| پن 44 | VDDIN — Main supply input |
| پن 45 | PB06 — GPIO PB06 / SERCOM7 |
| پن 46 | PB07 — GPIO PB07 / SERCOM7 |
| پن 47 | PB08 — GPIO PB08 / SERCOM4 |
| پن 48 | PB09 — GPIO PB09 / SERCOM4 |
| پن 49 | PB10 — GPIO PB10 / SERCOM4 |
| پن 50 | PB11 — GPIO PB11 / SERCOM4 |
| پن 51 | PB12 — GPIO PB12 / SERCOM4 |
| پن 52 | PB13 — GPIO PB13 / SERCOM4 |
| پن 53 | VDDIO — I/O supply voltage |
| پن 54 | PB14 — GPIO PB14 / SERCOM4 |
| پن 55 | PB15 — GPIO PB15 / SERCOM4 |
| پن 56 | PC00 — GPIO PC00 / SERCOM6 |
| پن 57 | PC01 — GPIO PC01 / SERCOM6 |
| پن 58 | PC02 — GPIO PC02 / SERCOM6 |
| پن 59 | PC03 — GPIO PC03 / SERCOM6 |
| پن 60 | PC04 — GPIO PC04 / SERCOM7 |
| پن 61 | PC05 — GPIO PC05 / SERCOM7 |
| پن 62 | PC06 — GPIO PC06 / SERCOM6 |
| پن 63 | PC07 — GPIO PC07 / SERCOM6 |
| پن 64 | RESETN — Active-low reset input |
عام استعمالات
ATSAME53J18A-MU-EFP کے لیے موزوں ہے 6 ایپلیکیشنs: Industrial Ethernet Gateway, Building Automation Controller, Smart Energy Metering, USB-to-CAN-FD Bridge, IEC 60730 Class B Safety Appliance Controller, IoT Edge Sensor Hub.
Industrial Ethernet Gateway
The ATSAME53J18A-MU-EFP integrates a 10/100 Ethernet MAC with hardware IEEE 1588 PTP timestamping, making it well-suited for industrial protocol gateways bridging Modbus TCP, EtherNet/IP, and PROFINET networks. The 120 MHz Cortex-M4F with FPU can sustain wire-speed TCP/IP stack execution with TLS 1.2 handshakes accelerated by the hardware AES-256 engine, while the dual CAN-FD controllers handle local sensor/actuator networks. Engineers typically pair this MCU with a Microchip KSZ8081 or LAN8742A PHY via RMII, placing 49.9 ohm 1% termination resistors within 5 mm of the PHY TX/RX lines to meet IEEE 802.3 return-loss. The EFP flash-performance grade supports >100K P/E cycles, suiting field firmware-update lifecycles common in substation and process-automation installations.
تجویز کردہ
Building Automation Controller
The ATSAME53J18A-MU-EFP serves as the main controller in BACnet/IP, KNX-IP, and DALI-2 gateway nodes. Its 256 KB dual-bank Flash with ECC and 128 KB SRAM with ECC provide headroom for a full TCP/IP+TLS stack plus BACnet object libraries. The 12-bit 1 MSPS ADC handles up to 24 analog sensor channels (temperature, light, humidity transducers), while the six SERCOM peripherals drive RS-485 field buses, I2C sensor breakouts, and SPI-driven HMI displays. Hardware AES-256 secures BACnet/SC and KNXnet/IP TLS sessions without burdening the CPU, and the Cortex-M4F FPU accelerates control-loop math for HVAC damper and valve actuators at 1 kHz update rates.
تجویز کردہ
Smart Energy Metering
The ATSAME53J18A-MU-EFP targets single-phase and three-phase smart energy meters with its 120 MHz Cortex-M4F core and 12-bit 1 MSPS ADC. The dual-panel Flash with ECC supports Over-The-Air firmware upgrades mandated by IEC 62056 / DLMS, while the integrated TRNG seeds the hardware AES-256 accelerator for secure key exchange with utility head-ends. Engineers pair the SAME53 with external current-sensing AFE chips (e.g., ATM90E26) via SPI and route the Ethernet MAC to a HomePlug GreenPHY/Powerline modem. The EFP flash-performance grade ensures >20-year retention at 85C, satisfying meter lifecycle requirements in EU and Asian utility deployments.
تجویز کردہ
USB-to-CAN-FD Bridge
The ATSAME53J18A-MU-EFP doubles as a USB-CDC to CAN-FD bridge for automotive diagnostic tools, industrial PC-based configuration utilities, and EV-charging station controllers. Its USB 2.0 Full-Speed and Hi-Speed capable port operates in either host or device mode, while the dual CAN-FD controllers run at up to 5 Mbps with ISO 11898-1:2015 frame format. The Cortex-M4F FPU accelerates CANopen and J1939 protocol parsing at 1 ms cycle times. Hardware AES-256 secures OEM diagnostic authentication, and the 128 KB SRAM buffers multiple CAN-FD frames to absorb bus-burst events without USB backpressure.
تجویز کردہ
IEC 60730 Class B Safety Appliance Controller
The ATSAME53J18A-MU-EFP supports IEC 60730 Class B safety requirements for household appliances (washing machines, ovens, induction cooktops) thanks to ECC-protected Flash and SRAM, hardware CRC, and dual-window watchdog timers. The 120 MHz core runs the main motor-control loop while the Cortex-M4F DSP extensions implement Field-Oriented Control (FOC) for 3-phase BLDC motors. Engineers typically add an external Class-B self-test library (Microchip Class B libraries) and pair the MCU with isolated gate drivers for IGBT/MOSFET power stages. The EFP grade provides the long Flash retention needed for 100K-cycle firmware updates over a 15-year appliance lifetime.
تجویز کردہ
IoT Edge Sensor Hub
The ATSAME53J18A-MU-EFP functions as an edge-computing hub aggregating multiple sensor buses (I2C, SPI, UART, RS-485) into a single Ethernet or Wi-Fi backhaul. The 120 MHz Cortex-M4F with FPU executes edge-ML inference (e.g., CMSIS-NN anomaly detection) on sensor data before forwarding to the cloud. Six SERCOM peripherals address 12+ sensors concurrently via DMA without CPU intervention. The hardware SHA-256/TRNG block supports TLS 1.3 handshakes, while the 256 KB dual-bank Flash supports signed firmware-update mechanisms. EFP temperature grade suits outdoor enclosures (-40 C to +85 C) in industrial IoT installations.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا ATSAME53J18A-MU-EFP — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | ATSAME53J18A-MF | ATSAME53J18A-MFT | ATSAME53J18A-AU-EFP |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (7x7 mm) | VQFN-64 (7x7 mm) - same | VQFN-64 (7x7 mm) - same | TQFP-64 (10x10 mm) - different |
| CPU Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F |
| Max CPU Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| Ethernet MAC | Yes (10/100 + IEEE 1588 PTP) | Yes (10/100 + IEEE 1588 PTP) | Yes (10/100 + IEEE 1588 PTP) | Yes (10/100 + IEEE 1588 PTP) |
| Operating Temperature | -40 C to +85 C (EFP) | -40 C to +85 C (non-EFP) | -40 C to +85 C (non-EFP) | -40 C to +85 C (EFP) |
| Flash Endurance (EFP grade) | Extended (>100K P/E) | Standard (~10K P/E) | Standard (~10K P/E) | Extended (>100K P/E) |
اہم امتیازی خصوصیات
- Integrated 10/100 Ethernet MAC with hardware IEEE 1588 PTP (بمقابلہATSAME51N20A-AU-EFP (no Ethernet MAC))
- EFP Extended Flash Performance grade (بمقابلہATSAME53J18A-MF (standard grade))
- Hardware AES-256 / SHA-256 / TRNG crypto accelerator (بمقابلہATSAMD51J19A-MU (no crypto hardware))
ڈیزائن نوٹس
The 64-pin VQFN exposed thermal pad MUST be soldered to a continuous ground plane for both thermal dissipation and electrical reference. Use a 4-layer PCB with the inner layer 2 dedicated to ground; the thermal pad land should have 5x5 thermal vias (0.3 mm drill, 0.6 mm pad) connecting to inner ground pours. Place 100 nF plus 4.7 uF X7R 0402/0603 ceramic decoupling capacitors within 3 mm of each VDDIN and VDDIO pin group to suppress switching transients from the internal 1.2V core regulator.
Route the Ethernet RMII signals (ERX0, ERX1, ETX0, ETX1, EREF_CLK, EMDC, EMDIO) on the top layer with 50 ohm controlled impedance; keep traces under 25 mm and away from switching regulator or motor-drive traces. Place the 49.9 ohm 1% termination resistors within 5 mm of the PHY TX+/- and RX+/- pins, with the PHY placed close to the RJ45 jack to minimize stub lengths. Crosstalk between adjacent RMII pairs must stay below -30 dB to meet IEEE 802.3 return-loss specifications.
Do not leave unused SERCOM pins floating when configured as inputs. Set unused SERCOM pins as outputs driven low, or enable the internal pull-up to avoid parasitic current paths through the I/O ring. The SAME53 VDDIN and VDDIO pins have specific power-up sequencing - VDDIN must reach 2.7 V before VDDIO is applied if VDDIO > 3.0 V; otherwise the internal POR may trigger a brown-out reset. Always assert the RESETN pin low for at least 1 ms after both rails stabilize.
تعمیل کی معلومات
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for automotive applications, refer to ATSAMxE5xA-qualified variants. Lead-free reflow profile per J-STD-020 MSL3.
