EP2A15B724C7 - APEX II FPGA, 600K Gates, 724-BGA | Altera
MPN: EP2A15B724C7 ✗ اختتامِ زندگیEP2A15B724C7 جائزہ
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high density of gate arrays with the design flexibility of in-system programmability. The APEX II family sits in the hierarchy between simple PLDs and high-end ASICs, offering MultiCore interconnect architecture that combines fine-grained look-up tables with coarse-grained embedded memory blocks, allowing designers to implement complex datapaths, DSP, and on-chip bus systems. This places FPGAs squarely within the broader semiconductor and programmable logic category.
Key features of the EP2A15B724C7 include 425,984 bits of embedded system RAM distributed across embedded array blocks (EABs), dedicated True-LVDS receivers and transmitters supporting up to 1 Gbps per channel, and support for LVPECL, PCML, and HyperTransport interface standards. The device integrates phase-locked loops for clock management and supports hot-socketing and configuration via passive serial, passive parallel, or JTAG modes. The 724-ball FCBGA package provides ample signal pins for parallel processing interfaces while maintaining a compact 35 mm x 35 mm footprint suitable for high-density PCB designs.
Architecturally, the EP2A15B724C7 uses Altera's MultiCore interconnect with embedded array blocks (EABs), logic array blocks (LABs), and FastTrack routing, achieving internal performance up to 500 MHz on critical paths. The 1.5 V core minimizes dynamic power relative to 2.5 V predecessors while maintaining signal integrity through dedicated LVDS I/O structures optimized for high-speed serial and parallel differential signaling in telecommunications and DSP backplanes.
Typical applications include high-speed telecommunications backplanes, DSP processing cards, network switches and routers, ASIC prototyping, and parallel computing acceleration. The 1 Gbps True-LVDS support also makes it suitable for chip-to-chip interconnect between processors and memory subsystems on compact processor boards.
When designing with this device, ensure 1.5 V core decoupling with low-ESR ceramic capacitors placed within 100 mils of each supply ball. The high pin count demands controlled-impedance PCB routing, and the BGA package requires X-ray inspection post-assembly. Configuration mode selection (PS, PPA, JTAG) must be set via MSEL pins before power-up.
This page synthesizes distributor inventory, lifecycle signals, drop-in same-family alternatives, and practical BGA design notes not found in the original datasheet.
کے لیے ڈراپ اِن متبادل EP2A15B724C7 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2A15B724C7 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Process Technology, Operating Temperature, PLLs, Family.
EP2A15B724C7N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP2A15B724I7
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP2A15B724C8
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15B724C6
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP2A15B724C9
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15B724C
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15B724C7 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | APEX II |
| Manufacturer | Altera (acquired by Intel) |
| System Gates | 600,000 |
| Logic Elements / Cells | 16,640 |
| Total RAM Bits | 425,984 |
| Number of I/O | 492 |
| Core Voltage | 1.425 V to 1.575 V |
| آپریٹنگ درجہ حرارت | 0 C to 85 C (TJ) |
| پیکیج | 724-BBGA, FCBGA (35 mm x 35 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| Speed Grade | C7 (per part suffix) |
| Maximum Internal Frequency | 500 MHz |
| Process Technology | 0.15 um all-layer copper |
| LVDS Support | True-LVDS up to 1 Gbps |
| Interface Standards | True-LVDS, LVPECL, PCML, HyperTransport |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| RoHS اسٹیٹس | unknown |
EP2A15B724C7 724-bbga, fcbga (35 mm x 35 mm) پن کنفیگریشن گائیڈ
EP2A15B724C7 (724-bbga, fcbga (35 mm x 35 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2A15B724C7.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP2A15B724C7 کے لیے موزوں ہے 6 ایپلیکیشنs: High-Speed Telecommunications Backplane, DSP Processing Card, Network Switch and Router Line Card, ASIC Prototyping Platform, Parallel Computing Acceleration, Industrial Test and Measurement Instrumentation.
High-Speed Telecommunications Backplane
The EP2A15B724C7 fits telecom backplane designs through its 492 user I/O pins and dedicated True-LVDS receivers and transmitters supporting up to 1 Gbps per differential pair. The 16,640 logic elements and 425,984 bits of embedded RAM provide ample resources for bit-serial protocol handling, framing, and clock-domain crossing across multiple backplane lanes. Placed on a line card alongside PHY transceivers, the FPGA implements link-layer glue logic while JTAG (per the APEX II datasheet) supports in-system programming for field upgrades.
تجویز کردہ
DSP Processing Card
The EP2A15B724C7 suits DSP accelerator cards thanks to its 600K system gates and 425,984 bits of embedded RAM, which together enable high-throughput filter, FFT, and modulation blocks. The 500 MHz internal performance on critical paths supports real-time baseband processing, while the 1.5 V core minimizes dynamic power dissipation. Placed between analog front ends and a host processor, the FPGA handles sample buffering and arithmetic, with configuration loaded from a parallel PROM at power-up.
تجویز کردہ
Network Switch and Router Line Card
The EP2A15B724C7 supports switching and routing line cards through its 1 Gbps LVDS I/O, large embedded RAM for packet buffering, and 492 user I/O for multi-port fan-out. Its embedded array blocks (EABs) implement FIFOs and lookup tables for queuing and forwarding, while dedicated PLL resources simplify clock synthesis for fabric interfaces. The 724-ball FCBGA provides the routing density required for parallel connections to PHY and memory devices on a single line card.
تجویز کردہ
ASIC Prototyping Platform
The EP2A15B724C7 is well suited for ASIC prototyping because its 16,640 logic elements, 425,984 RAM bits, and 492 user I/O approximate the gate count of a 600K-gate ASIC while preserving real-world timing characteristics. Designers map ASIC RTL into APEX II MultiCore interconnect to validate functionality, timing closure, and software before tape-out. The JTAG-based configuration stream allows rapid design iteration and in-system debug using SignalTap logic analysis.
تجویز کردہ
Parallel Computing Acceleration
The EP2A15B724C7 accelerates parallel computing workloads through its 16,640 logic elements distributed across MultiCore interconnect with embedded array blocks, providing the parallelism needed for bit-level and word-level operations. The 1 Gbps LVDS channels enable high-bandwidth chip-to-chip interconnect with host processors and memory subsystems. Placed as a co-processor on a compute board, the FPGA offloads SIMD-style kernels while the host CPU manages I/O and control flow.
تجویز کردہ
Industrial Test and Measurement Instrumentation
The EP2A15B724C7 fits industrial test equipment through its 500 MHz internal performance, large embedded RAM for sample storage, and 492 I/O for multi-channel analog front-end interfacing. The commercial 0 to 85 C operating range (or industrial -40 to 100 C variant EP2A15B724I7) supports factory-floor and laboratory environments. Used in oscilloscope digitizers, protocol analyzers, and ATE pin electronics, the FPGA handles real-time triggering, decimation, and pattern generation.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2A15B724C7 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2A15B724C7N | EP2A15B724I7 | EP2A15B724C8 | EP2A15B724C6 | EP2A15B724C |
|---|---|---|---|---|---|---|
| Package | 724-BBGA, FCBGA (35x35 mm) | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same |
| Brand | Altera (Intel FPGA) | Altera | Altera | Altera | Altera | Altera |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Total RAM Bits | 425,984 | 425,984 | 425,984 | 425,984 | 425,984 | 425,984 |
| User I/O | 492 | 492 | 492 | 492 | 492 | 492 |
| Core Voltage | 1.5 V (1.425 to 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | -40 C to 100 C (industrial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Speed Grade | C7 | C7 | I7 (industrial) | C8 (slower) | C6 (faster) | C (base) |
اہم امتیازی خصوصیات
- Industrial temperature grade option in same package (بمقابلہEP2A15B724I7)
- Lead-free / RoHS-compliant packaging variant (بمقابلہEP2A15B724C7N)
- Speed-grade flexibility within the same package (بمقابلہEP2A15B724C6, EP2A15B724C8)
ڈیزائن نوٹس
The 724-ball FCBGA package requires a 6 or 8-layer PCB with continuous ground and power planes beneath the device. Use 1 oz copper outer layers for power and 0.5 oz for signal layers. Microvia or via-in-pad technology is strongly recommended for breakout because the 1.0 mm ball pitch is too dense for dog-bone fanout. Decoupling capacitors (0.1 uF and 1 uF X5R or X7R) must be placed within 100 mils of each power ball group, with via connections to inner power planes for low inductance.
Although the EP2A15B724C7 operates at a low 1.5 V core, the 724-ball FCBGA has a theta-JA of approximately 8 to 12 C/W on a standard JEDEC test board. At 600K-gate utilization with 50 percent toggle rate, internal dissipation can reach 3 to 5 W, resulting in 30 to 60 C junction temperature rise above ambient. For enclosed industrial enclosures, attach a heatsink with thermal interface material to the package lid, or improve board-level cooling with forced airflow across the BGA top.
Differential LVDS pairs must be routed with 100 ohm differential impedance and length-matched within 20 mil for the 1 Gbps True-LVDS channels. Keep LVDS pairs on the same signal layer with no more than two vias per net to avoid impedance discontinuities. Reference LVDS traces to a continuous ground plane with no splits, and maintain 3W spacing (3 times the dielectric height) between LVDS pairs to minimize crosstalk. JTAG and configuration signals should be routed away from LVDS to avoid coupling.
Do not leave MSEL pins floating; tie them to VCC or GND through 1 kohm resistors to select the desired configuration mode before power-up. The configuration PROM or download cable must be present at the rising edge of nCONFIG or the FPGA will not enter user mode. After assembly, verify BGA solder joints using X-ray inspection or boundary-scan JTAG testing because optical inspection is impossible beneath the BGA. For obsolete parts, verify date code and lot traceability to avoid counterfeit or relabeled devices.
تعمیل کی معلومات
RoHS and lead-free status reported as unknown in verified distributor data; the N suffix variants are typically RoHS compliant per Altera's transition policy. The APEX II family is obsolete, predating many current compliance schemes. Request a Certificate of Compliance from the distributor for the specific date code.
