EP2A70B724I9N - APEX II FPGA 3M Gates 724-FCBGA | Intel
MPN: EP2A70B724I9N ✗ اختتامِ زندگیEP2A70B724I9N جائزہ
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device in the broader semiconductor taxonomy: programmable logic -> logic IC -> integrated circuit. FPGAs are used for digital logic prototyping, parallel processing, glue logic, and ASIC replacement. The APEX II family specifically extends the Altera APEX architecture with embedded system blocks (ESBs) and a MultiCore interconnect that supports both fine-grained logic and coarse-grained memory, making it suitable for designs that blend control logic with datapath processing.
Key features of the EP2A70B724I9N include 536 maximum user I/O pins, multiple embedded system blocks for RAM/ROM/CAM, support for high-speed LVDS I/O, and a true dual-port RAM architecture. The device supports in-system programmability through IEEE 1532 and supports configuration via passive serial, passive parallel, and JTAG modes. The 724-ball FCBGA package offers high pin density, enabling dense board layouts for telecom, networking, and DSP applications.
The EP2A70B724I9N architecture combines a MultiCore interconnect with embedded system blocks to deliver predictable performance for memory-intensive and I/O-intensive designs. Designers can instantiate on-chip RAM, ROM, and CAM blocks without using logic cells, freeing fabric for parallel datapath operations. The 1.5 V VCCINT and 3.3 V-tolerant I/O architecture is typical for the APEX II generation, and the 724-FCBGA package supports high signal-count designs that would not fit in smaller BGA or QFP packages.
Typical applications for this part include telecom line cards, ATM switching fabrics, high-speed serial protocol bridging, DSP front-end preprocessing, network router aggregation, and ASIC prototyping. The combination of 67,200 logic elements and 3M system gates supports designs that previously required an ASIC.
When designing with the EP2A70B724I9N, pay attention to power integrity and thermal management. The 1.5 V core rail must be tightly regulated; a switching DC-DC followed by an LDO post-regulator is the typical pattern. Decoupling and PCB stackup planning for the 724-FCBGA is essential because the BGA escape routing demands microvia stackups. Always verify the specific ball map against the published pinout before layout.
This page synthesizes distributor pricing, same-family Intel/Altera alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate the EP2A70B724I9N against extendable APEX II family members.
کے لیے ڈراپ اِن متبادل EP2A70B724I9N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2A70B724I9N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف System Gates, Process Technology, Package, Series, I/O Standards Supported.
EP2A70B724I8
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A70B724I7N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A70B724C9N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A70B724C9ES
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A70B724C9
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A70B724I7
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A70B724C8N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A70B724I9N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | APEX II |
| Series | EP2A70 |
| System Gates | 3 M |
| Logic Cells | 67,200 |
| زیادہ سے زیادہ کلاک فریکوئنسی | 198 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.5 V |
| Package Type | 724-ball Flip-Chip BGA (FCBGA) |
| Maximum User I/O | 536 |
| Embedded System Blocks | Yes (RAM/ROM/CAM) |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| Programmable via | IEEE 1532 / JTAG |
| آپریٹنگ درجہ حرارت | -40 °C to +100 °C (Industrial) |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| RoHS اسٹیٹس | Compliant |
EP2A70B724I9N 724-ball flip-chip bga (fcbga) پن کنفیگریشن گائیڈ
EP2A70B724I9N (724-ball flip-chip bga (fcbga) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2A70B724I9N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP2A70B724I9N کے لیے موزوں ہے 6 ایپلیکیشنs: Telecom Line Card Processing, ATM Switch Fabric, Network Router Aggregation, DSP Front-End Preprocessing, ASIC Prototyping and Emulation, Industrial Control and Instrumentation.
Telecom Line Card Processing
The EP2A70B724I9N's 67,200 logic cells and 536 user I/O make it well-suited for telecom line card designs that aggregate multiple E1/T1 or 10/100 Ethernet links. The APEX II embedded system blocks provide on-chip RAM and dual-port memory buffers for cell/packet queuing without consuming logic cells. Designers can implement framing, deframing, and QoS classification in parallel datapaths running at the device's 198 MHz fMAX, while the FCBGA package supports the high pin count needed for multiple high-speed serial interface macros.
تجویز کردہ
ATM Switch Fabric
ATM switching requires high-throughput cell processing with on-chip memory for header translation and routing tables, exactly the workload the EP2A70B724I9N was designed for. With 3M system gates and embedded system blocks, the device can hold large cell buffers in on-chip RAM while the logic fabric performs header CRC, VPI/VCI translation, and congestion management. The 198 MHz fMAX supports line-rate processing at OC-3 and OC-12, and the 724-FCBGA provides the I/O density needed for parallel UTOPIA/SBUS interfaces to PHY devices.
تجویز کردہ
Network Router Aggregation
Router aggregation nodes must combine multiple lower-speed links into a higher-speed uplink, a workload that benefits from the EP2A70B724I9N's abundant I/O and on-chip memory. The device's 536 user I/O pins can connect directly to multiple PHY devices via UTOPIA or POS-PHY interfaces, while the embedded system blocks hold forwarding tables in dual-port RAM for simultaneous lookup and update. The 1.5 V core supply is compatible with standard telecom power architectures and the industrial temperature grade supports CO-mounted deployments.
تجویز کردہ
DSP Front-End Preprocessing
DSP front-end preprocessing often requires high-speed sample buffering, FFT preprocessing, and protocol parsing, all of which can be accelerated on the EP2A70B724I9N's fabric. The APEX II architecture's MultiCore interconnect and embedded system blocks support distributed arithmetic FIR filters and pipelined FFT engines, with the 198 MHz fMAX delivering real-time throughput for moderate sample rates. The 724-FCBGA ball count allows direct interface to high-speed ADCs and DACs without external logic.
تجویز کردہ
ASIC Prototyping and Emulation
The EP2A70B724I9N's 3M system gates and 67,200 logic cells make it a practical platform for ASIC prototyping and ASIC emulation before tapeout. Engineers can map large ASIC blocks into a single device or use multiple APEX II devices in a multi-FPGA partition. The JTAG and IEEE 1532 configuration interfaces support rapid design iteration, while the 724-FCBGA package provides the I/O bandwidth needed for chip-to-chip prototyping interconnects. Industrial temperature grade supports in-lab and field bring-up.
تجویز کردہ
Industrial Control and Instrumentation
Industrial control systems and instrumentation require deterministic, parallel processing with high I/O counts, exactly the design profile the EP2A70B724I9N supports. The device's industrial temperature range (-40 °C to +100 °C), 536 user I/O, and embedded system blocks make it suitable for programmable logic controllers, motion controllers, and high-channel-count data acquisition. The 1.5 V core is easy to derive from standard 3.3 V or 5 V industrial rails using point-of-load regulators.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2A70B724I9N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2A70B724I8 | EP2A70B724I7N | EP2A70B724C9N | EP2A70B724C9ES |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 724-ball FCBGA | 724-ball FCBGA - same | 724-ball FCBGA - same | 724-ball FCBGA - same | 724-ball FCBGA - same |
| Family | APEX II EP2A70 | APEX II EP2A70 | APEX II EP2A70 | APEX II EP2A70 | APEX II EP2A70 |
| System Gates | 3 M | 3 M | 3 M | 3 M | 3 M |
| Logic Cells | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
اہم امتیازی خصوصیات
- Highest density member of the APEX II EP2A70 series (بمقابلہEP2A25F672)
- Industrial temperature grade option (بمقابلہEP2A70B724C9N)
- Speed-grade -9 for highest performance in the family (بمقابلہEP2A70B724I7N)
ڈیزائن نوٹس
The EP2A70B724I9N requires a tightly regulated 1.5 V core supply (VCCINT) to operate reliably. Use a switching DC-DC followed by an LDO post-regulator to suppress switching noise coupling into the FPGA fabric, which would otherwise degrade LVDS I/O timing margins. Place decoupling capacitors (100 nF + 10 µF bulk) as close to the FCBGA balls as possible; the BGA escape pattern should use microvia stackups to keep supply-loop inductance under 1 nH per ball.
The FCBGA Flip-Chip BGA package has moderate thermal resistance but concentrates heat in the central ball array. Designers must follow the APEX II thermal management application note: place thermal vias beneath the package, use a ground plane on the top-side bond layer, and confirm junction temperature under worst-case utilization. Industrial-temperature variants such as EP2A70B724I9N are rated up to +100 °C ambient but require airflow or heatsink for full-gate-utilization designs.
The 724-ball FCBGA escape routing requires microvia (HDI) PCB stackups with at least a 1-2-1 or 2-4-2 layer structure. Designers should follow the APEX II hardware design guidelines for ball pitch, antipad diameter, and via-in-pad recommendations. Signal integrity simulation is recommended for LVDS lanes running above 100 MHz, and matched-length routing must be implemented within the LVDS skew tolerance window documented in the APEX II datasheet.
Do not assume the EP2A70B724I9N is in active production; the APEX II family is obsolete and only available through broker inventory. Always verify stock and lead time before committing the design to a new production run. Also confirm the configuration interface (passive serial vs JTAG) is wired correctly - mis-wired MSEL pins will leave the device in an undefined state at power-up. Validate the EPC16/EPC64 configuration PROM is sized correctly for the 3M-gate bitstream.
تعمیل کی معلومات
RoHS compliance per Altera product page. APEX II family pre-dates automotive qualification standards; not AEC-Q100 qualified. Industrial temperature variant (-40 °C to +100 °C) supports industrial control and telecom applications.
