EP2AGZ350FF35I4 - Arria II GZ FPGA 350K LE, 1152-FBGA | Intel
MPN: EP2AGZ350FF35I4 ✓ فعالEP2AGZ350FF35I4 جائزہ
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit above CPLDs and structured ASICs in the programmable-logic hierarchy, providing the highest logic density and the richest hard-IP block mix. The Arria II GZ family is positioned in the mid-range between Cyclone (low-cost) and Stratix (high-performance) families, with transceiver and DSP capability approaching Stratix IV at lower static power.
The device supports core voltage of 0.9 V with separate transceiver and I/O supply rails. Embedded memory includes 9-bit parity-protected M9K blocks plus 144-bit wide MLAB blocks, totaling up to 21.27 Mbits. Up to 16 full-duplex transceiver channels support protocols including PCIe Gen2 (x4/x8), Serial RapidIO, 10 GbE XAUI, CPRI, and CEI-6G. Variable-precision DSP blocks implement 18x18 multipliers with adders, accumulators, and 36-bit precision support, enabling >500 MHz DSP performance for wireless baseband and video processing.
Typical applications include wireless baseband processing (LTE, WiMAX, 3G), high-definition video broadcast and image processing, military and aerospace signal processing, medical imaging, high-speed serial backplane bridging, and ASIC prototyping. The combination of 6.375 Gbps transceivers and ~350K LEs makes the part a common choice for designers migrating from Xilinx Virtex-6 or Stratix IV class devices to a more power-efficient mid-range fabric.
Key design considerations include the Flip-Chip BGA requiring a multilayer PCB with controlled-impedance transceiver channels, matched-length differential pairs, and substantial decoupling. The 35x35 mm package demands careful thermal management, and the 0.9 V core typically requires an Altera-recommended power-supply sequencer. Configuration is via JTAG, fast passive parallel, or fast active serial flash.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with a focus on real cross-references and AEC/industrial variant comparison.
کے لیے ڈراپ اِن متبادل EP2AGZ350FF35I4 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2AGZ350FF35I4 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Transceivers, Logic Elements, Operating Temperature Grade, Mounting Type.
EP2AGZ350FF35I3
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGZ350FF35C4N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGZ350FF35C3N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGZ300FF35I4
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGX260FF35I5
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2AGZ350FF35I4 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | Arria II GZ |
| Logic Elements | 348,500 |
| Adaptive Logic Modules (ALMs) | 139,400 |
| Logic Array Blocks (LABs) | 13,940 |
| Embedded Memory | 21,270,528 bits (~21.27 Mbit) |
| User I/O Pins | 554 |
| DSP Blocks | Variable-precision 18x18 multipliers |
| Transceivers | Up to 16 channels, 6.375 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| پیکیج | 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Operating Temperature (TJ) | -40C to +100C (Industrial) |
| RoHS اسٹیٹس | Compliant |
| Lead Free | Yes |
EP2AGZ350FF35I4 1152-ball flip-chip bga (fc-fbga, 35x35 mm) پن کنفیگریشن گائیڈ
EP2AGZ350FF35I4 (1152-ball flip-chip bga (fc-fbga, 35x35 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2AGZ350FF35I4.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP2AGZ350FF35I4 کے لیے موزوں ہے 6 ایپلیکیشنs: Wireless Baseband Signal Processing, High-Definition Video Broadcast Processing, Military and Aerospace Signal Processing, Medical Imaging and Diagnostic Equipment, High-Speed Serial Backplane Bridging, ASIC Prototyping and Emulation.
Wireless Baseband Signal Processing
The EP2AGZ350FF35I4 is well-suited for LTE, WiMAX, and 3G baseband signal processing where it executes channel estimation, FFT/iFFT, MIMO detection, and turbo/LDPC decoding in real time. Its 348,500 logic elements and variable-precision DSP blocks deliver 18x18-bit multiplies with adders and accumulators at Fmax above 500 MHz, supporting multiple simultaneous antenna streams. The hard PCIe Gen2 endpoint block enables direct connect to a baseband SoC, while the 21.27 Mbits of embedded RAM provides on-chip buffering for HARQ soft-combining and rate-matching buffers. Compared with a DSP+ASIC split architecture, an Arria II GZ-based baseband shortens time-to-market and adds field-upgradability for protocol revisions.
تجویز کردہ
High-Definition Video Broadcast Processing
The EP2AGZ350FF35I4 is widely deployed in broadcast video infrastructure for SD/HD/3G-SDI routing, multi-format up/down/cross-conversion, and H.264/MPEG-2 decoding. The 554 user I/O pins provide ample parallel video bus width, while 16 transceivers at 6.375 Gbps support SMPTE 424M/425M 3G-SDI and emerging quad-link 4K UHD carriage. The 21.27 Mbits of embedded RAM allows multiple line/frame buffers for deinterlacing, scaling, and noise reduction without external SRAM. Industrial temperature grade suits outdoor encoder/decoder heads and field-located broadcast equipment. Compared with fixed-function video ASSPs, an Arria II GZ-based design supports multiple codecs and resolutions via firmware updates.
تجویز کردہ
Military and Aerospace Signal Processing
The EP2AGZ350FF35I4 with its industrial temperature grade (-40C to +100C TJ) and Altera/Intel pedigree makes it suitable for ruggedized signal-processing cards in defense, aerospace, and surveillance applications. Its logic density accommodates full-channel radar pulse compression, beamforming weights, and electronic-warfare processing pipelines. The hard PCIe Gen2 endpoint and 6.375 Gbps SerDes simplify connection to VPX/OpenVPX backplanes commonly used in defense platforms. Compared with older ASIC implementations, FPGA-based signal processing enables late-binding algorithm updates and multi-mode capability on a single card, reducing SWaP-C in size-constrained platforms.
تجویز کردہ
Medical Imaging and Diagnostic Equipment
The EP2AGZ350FF35I4 supports real-time medical imaging in ultrasound beamformers, MRI RF receivers, and CT reconstruction pipelines. The variable-precision DSP blocks accelerate FIR filtering for beam steering, while embedded RAM provides line buffers for back-end image processing. Multiple 6.375 Gbps transceivers enable direct connection to high-speed ADC front-ends (e.g., 12-/14-bit at 250 MSPS) without external clock-data recovery glue. The industrial temperature grade and lead-free FC-BGA package suit medical-environment reliability requirements, including IEC 60601 compliance when paired with appropriate system-level isolation.
تجویز کردہ
High-Speed Serial Backplane Bridging
The EP2AGZ350FF35I4 is a strong choice for custom backplane bridging applications where the user needs to fan-out multiple slower interfaces (Gigabit Ethernet, Serial RapidIO, PCIe Gen2) to high-speed backplane SerDes links. Its 16 transceivers and 554 user I/O allow a single device to replace multiple discrete bridge ASSPs, simplifying BOM and reducing board area. The Arria II GZ hard PCS and PMA blocks per channel eliminate the need for external clock-data recovery ICs. Industrial temperature grade supports non-controlled-environment deployments such as factory-floor and outdoor cabinet installations.
تجویز کردہ
ASIC Prototyping and Emulation
The EP2AGZ350FF35I4 is a cost-effective building block for multi-FPGA ASIC prototyping and emulation platforms, where designers partition large ASIC RTL across multiple FPGAs to validate functional and timing behavior pre-silicon. Its 348,500 LEs accommodate ~5-10M gates of equivalent ASIC logic with time-domain-multiplexing, while the high I/O count and SerDes channels provide the inter-FPGA bandwidth needed for cut-through prototyping. The same JTAG-based configuration infrastructure scales from single-FPGA to multi-FPGA cages. Compared with dedicated emulation ASICs, an Arria II GZ-based platform delivers near-real-time performance at a fraction of the cost.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2AGZ350FF35I4 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2AGZ350FF35I3 | EP2AGZ350FF35C4N | EP2AGZ350FF35C3N | EP2AGZ300FF35I4 | EP2AGX260FF35I5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same |
| Logic Elements | 348,500 | 348,500 | 348,500 | 348,500 | 300,000 | 244,000 |
| Embedded Memory (Mbits) | 21.27 | 21.27 | 21.27 | 21.27 | 18.16 | 15.66 |
| User I/O | 554 | 554 | 554 | 554 | 554 | 372 |
| Transceivers | 16 @ up to 6.375 Gbps | 16 @ up to 6.375 Gbps | 16 @ up to 6.375 Gbps | 16 @ up to 6.375 Gbps | 16 @ up to 6.375 Gbps | 16 @ up to 6.375 Gbps |
| Speed Grade | -4 (mid) | -3 (faster) | -4 (mid) | -3 (faster) | -4 (mid) | -5 (slower) |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial | Commercial (0C to 85C) | Commercial (0C to 85C) | Industrial | Industrial |
اہم امتیازی خصوصیات
- Maximum logic density in the 1152-FBGA (35x35) package (بمقابلہEP2AGZ300FF35I4)
- Industrial temperature grade (بمقابلہEP2AGZ350FF35C4N)
- More logic and memory than the AGX family (بمقابلہEP2AGX260FF35I5)
ڈیزائن نوٹس
The 1152-ball FC-FBGA at 35x35 mm can dissipate 15-25 W in typical Arria II GZ designs. A thermal pad and high-density PCB inner copper (at least 2 oz outer, 1 oz inner) are recommended. Without forced airflow, a heatsink with thermal interface material is required at sustained power levels above 10 W. Estimated: at 20 W dissipation and a 1 C/W junction-to-ambient thermal resistance with adequate copper, junction temperature rises roughly 20C above ambient.
Use a multilayer PCB (8+ layers) for the 1152-FBGA to escape the 1.0 mm pitch BGA. Inner layers should provide solid ground and power planes; signal layers should be microstrip/stripline with controlled impedance (50 ohm single-ended, 100 ohm differential) for transceiver channels. Keep transceiver traces length-matched within 150 mil tolerance. Reference Altera AN 580: Design Guidelines for Arria II GZ Transceivers.
The Arria II GZ requires multiple supply rails: 0.9 V core, 1.1 V/1.2 V transceiver PLLs, 1.5 V/1.8 V transceiver I/O, 2.5 V/3.0 V general I/O, and 1.8 V/3.0 V configuration. Use the Altera-recommended power sequencer (e.g., LTC2928 or ISL62392) to enforce the required power-up sequence. Add bulk decoupling of 100 uF per rail and high-frequency 0.1 uF + 10 nF + 1 nF capacitor networks at every BGA power pin per the Altera pin connection guidelines.
Do not confuse the Arria II GZ (AGZ) family with the Arria II GX (AGX) family - they differ in transceiver count and speed grade encoding. Verify the exact part number suffix (I4 vs C4 vs I5) before PCB fab to avoid wrong temperature grade or speed grade placement. The configuration flash for fast-active-serial mode must be a 1.8 V device with at least 256 Mbit capacity for typical designs.
تعمیل کی معلومات
RoHS and lead-free per Altera/Intel product family standard. Halogen-free status not explicitly stated in verified data. Not AEC-Q100 qualified (FPGAs are typically not AEC-Q100 unless a specific automotive variant is qualified).
