Altera

EP2SGX60FF1152 - Stratix II GX FPGA 60K LE 1152-BGA | Altera

MPN: EP2SGX60FF1152 ⚠ آخری بار خریداری

1.2 V core / multiple VCCIO rails Vdss 1152-BBGA, FineLine BGA (FF1152) Package 2,544,192 bits Memory

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EP2SGX60FF1152 جائزہ

The Altera (now Intel) EP2SGX60FF1152 is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) with embedded transceivers, integrating 60,440 equivalent logic elements and 2,544,192 bits of embedded memory in a 1152-ball FineLine BGA package. The device combines a 90 nm CMOS logic fabric with up to 3.125 Gbps embedded transceivers, making it well suited for high-speed serial I/O, digital signal processing, and communications infrastructure designs. The FF1152 package uses a 1.0 mm ball pitch and includes 364 user I/O pins for system connectivity.

What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic and routing interconnects are configured by the end user after manufacturing. FPGAs occupy a tier of programmable logic that includes CPLDs (smaller, non-volatile) at the low end, FPGAs (volatile SRAM-based, high density) in the middle, and Structured ASICs / HardCopy at the high end. Stratix II GX devices specifically target high-bandwidth serial connectivity by integrating multi-gigabit transceivers directly on die, eliminating the need for external PHY chips.

Key features of the EP2SGX60FF1152 include 12 embedded transceivers operating up to 3.125 Gbps, 16 DSP blocks totaling 192 18x18 multipliers for high-throughput signal processing, and dedicated hardware for source-synchronous interfaces including DDR/DDR2/QDR memory controllers. The device supports up to 4 PLLs and supports JTAG-based configuration via the IEEE 1149.1 standard.

The architecture is built on a 90 nm SRAM-based fabric with 8-input adaptive logic modules (ALMs) — twice the density of the previous Stratix generation. Each ALM contains two combinational adaptive LUTs and two registers, providing flexible logic mapping. The memory subsystem consists of TriMatrix embedded SRAM blocks (M512, M4K, M-RAM) configurable as true dual-port, simple dual-port, or single-port RAM, ROM, or FIFO. The chip integrates 16 full-duplex transceiver channels grouped into four banks, each with dedicated clock data recovery and serializer/deserializer logic.

Typical applications include 10 Gb Ethernet network interface cards, SONET/SDH framer/mapper devices, wireless baseband processing, high-definition video broadcast equipment, and PCI Express endpoint cards. The FF1152 package's large pin count also suits high-density prototyping of ASIC and Structured ASIC designs.

A critical design consideration is power supply sequencing — Stratix II GX devices require multiple voltage rails (VCCINT, VCCIO, VCCA, VCCR, VCCT, VCC_PLL) brought up in a specific order to avoid device damage. Designers should also budget for the device's high transient current during configuration, typically requiring high-frequency decoupling within 50 mils of every power pin.

This page synthesizes distributor pricing, drop-in package alternatives, parametric comparison, and PCB design notes for engineers sourcing or qualifying the EP2SGX60FF1152, supplementing the manufacturer's datasheet with practical cross-reference data.

کے لیے ڈراپ اِن متبادل EP2SGX60FF1152 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2SGX60FF1152 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Mounting Type, Process Technology, RoHS Status, Device Type.

EP2SGX60EF1152C4N

Altera

Package: 1152-BBGA (FBGA-1152), 35x35 mm, 1.0 mm pitch

Process Technology: 90 nm CMOS

RoHS Status: Compliant (lead-free, MS-034AAR-1)

موازنہ کریں EP2SGX60FF1152 →

EP2SGX60EF1152C5N

Intel

Package: 1152-ball FC-FBGA

Mounting Type: Surface Mount (Flip-Chip BGA)

Process Technology: 90 nm CMOS

موازنہ کریں EP2SGX60FF1152 →

EP2SGX60EF1152I3N

Intel

Mounting Type: Surface Mount (BGA)

Process Technology: 90 nm

Device Type: Field-Programmable Gate Array (FPGA)

موازنہ کریں EP2SGX60FF1152 →

EP2SGX60EF1152I4N

Intel

Package: 1,152-ball FBGA

Device Type: FPGA

موازنہ کریں EP2SGX60FF1152 →

EP2SGX60EF1152I5N

Intel

Package: 1152-ball BGA

Process Technology: 90 nm CMOS

RoHS Status: unknown

موازنہ کریں EP2SGX60FF1152 →

EP2SGX60EF1152I4N

✅ ڈراپ-اِن

Intel

📦 1152-BBGA (FF1152)

FPGA · Stratix II GX · 60,440 · 2,544,192 bits · 534 · 717 MHz · 1.2 V · 1,152-ball FBGA

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2SGX60EF1152C4N

✅ ڈراپ-اِن

Altera

📦 1152-BBGA (FF1152)

Stratix II GX · Stratix II GX FPGA · 60,440 · 3,022 · 2,544,192 · 534 · 12 · Up to 12 channels

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2SGX60EF1152C5N

✅ ڈراپ-اِن

Intel

📦 1152-BBGA (FF1152)

Stratix II GX · 60,440 · 3022 · 2,544,192 · 534 · 90 nm CMOS · 1.2 V · 609.76 MHz

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2SGX60EF1152I5N

✅ ڈراپ-اِن

Intel

📦 1152-BBGA (FF1152)

Field Programmable Gate Array (FPGA) · Stratix II GX · 60,440 · 60,440 · 90 nm CMOS · 1.2 V · 717 MHz · 609.76 MHz

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2SGX60EF1152I3N

✅ ڈراپ-اِن

Intel

📦 1152-BBGA (FF1152)

Stratix II GX · Field-Programmable Gate Array (FPGA) · 60,440 · 60,440 · 2,544,192 bits · 717 MHz · 90 nm · 1.2 V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

EP2SGX60FF1152 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات

Series	Stratix II GX
Family	Stratix II GX FPGA
Logic Elements	60,440
Embedded Memory	2,544,192 bits
DSP Blocks (18x18 Multipliers)	192 (16 blocks)
Maximum User I/O	364
Number of LABs/CLBs	3022
Transceivers	12 channels up to 3.125 Gbps
پیکیج	1152-BBGA, FineLine BGA (FF1152)
آپریٹنگ درجہ حرارت	-40C to +85C (industrial)
Voltage - Supply	1.2 V core / multiple VCCIO rails
ماؤنٹنگ ٹائپ	Surface Mount
Process Technology	90 nm CMOS, SRAM-based
Configuration Method	JTAG IEEE 1149.1, Serial, Passive Parallel, Fast Passive Parallel
RoHS اسٹیٹس	Compliant

EP2SGX60FF1152 1152-bbga, fineline bga (ff1152) پن کنفیگریشن گائیڈ

EP2SGX60FF1152 (1152-bbga, fineline bga (ff1152) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔

EP2SGX60FF1152 کے لیے 1152-bbga, fineline bga (ff1152) پیکیج پن آؤٹ ڈایاگرام

کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2SGX60FF1152.

رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔

عام استعمالات

EP2SGX60FF1152 کے لیے موزوں ہے 7 ایپلیکیشنs: 10 Gigabit Ethernet Network Interface Cards, Wireless Baseband Processing, High-Definition Video Broadcast Equipment, PCI Express Endpoint Cards, Industrial Test and Measurement Instrumentation, ASIC/Structured ASIC Prototype Development, Military and Aerospace Communications.

🌐

10 Gigabit Ethernet Network Interface Cards

The EP2SGX60FF1152 is well-suited for 10 Gigabit Ethernet NIC and switch-line-card designs thanks to its 12 multi-gigabit transceivers supporting XAUI (4 x 3.125 Gbps lanes) and the 10 GbE Attachment Unit Interface. The 60,440 logic elements provide ample headroom for MAC, PCS, and traffic-manager functions, while the 192 18x18 multipliers enable on-chip AES-XTS, L2/L3 ACL lookup, or hardware QoS metering. A typical reference design uses 8 of the 12 transceivers for dual XAUI ports, with the remaining 4 available for inter-board SERDES backplane links.

تجویز کردہ

EP2SGX60EF1152I4N · Intel EP4SGX230KF40 (Modern Stratix IV successor for new designs) XC5VSX95T (Cross-vendor functional alternative (Xilinx Virtex-5))

🏭

Wireless Baseband Processing

In wireless baseband applications (LTE, WiMAX, proprietary OFDM), the EP2SGX60FF1152's 192 18x18 multipliers and TriMatrix memory blocks provide the throughput needed for channel estimation, FFT/iFFT, and MIMO detection. The 12 multi-gigabit transceivers interface directly to RF front-end ADCs/DACs via CPRI or OBSAI at rates up to 3.072 Gbps. Designers typically instantiate 4-8 transceivers for CPRI links and use the remaining logic for PHY-layer signal processing. The 90 nm process gives predictable DSP block timing closure at 250+ MHz Fmax.

تجویز کردہ

EP2SGX60EF1152C4N · Altera ADS58H40 (Companion 250-MSPS 14-bit ADC for baseband sampling) DAC38J84 (Companion 2.5-GSPS 16-bit DAC for baseband generation)

📺

High-Definition Video Broadcast Equipment

The EP2SGX60FF1152 can act as the central video processor in HD-SDI, 3G-SDI, and emerging 4K/UHD broadcast gear. Its 12 multi-gigabit transceivers support SDI rates (270/1485/2970 Mbps) and DVB-ASI, while the embedded TriMatrix memory can implement double-buffered line stores for format conversion (e.g., 1080i to 720p, 4:2:2 to 4:4:4). The 364 user I/Os handle HDMI, DisplayPort, and parallel video data paths. Designers commonly pair this part with external HDMI receivers/transmitters and AES/EBU audio encoders.

تجویز کردہ

EP2SGX60EF1152I4N · Intel GS2971A (3G-SDI receiver companion chip) GS2972 (3G-SDI transmitter companion chip)

🖥️

PCI Express Endpoint Cards

Implementing a single-lane or quad-lane PCI Express endpoint is straightforward with the EP2SGX60FF1152 using its integrated transceivers at 2.5 Gbps per lane (PCIe Gen1) or 3.125 Gbps (PCIe Gen2 equivalent). The Stratix II GX hard IP provides the PIPE interface, transaction layer, and data link layer, freeing the FPGA fabric for application logic. A typical Gen2 x4 endpoint consumes roughly 8K logic elements, 12 transceivers, and 256 Kbits of block RAM. Designers also use this architecture for PCIe-over-cable and ExpressCard adapters.

تجویز کردہ

EP2SGX60EF1152C5N · Intel PEX8311 (External PCIe bridge if additional root-complex functionality is needed) EP4CGX50 (Lower-cost Cyclone IV GX alternative for PCIe-only designs)

🔧

Industrial Test and Measurement Instrumentation

Test and measurement instruments (high-speed digitizers, protocol analyzers, ATE pin electronics) leverage the EP2SGX60FF1152's combination of dense logic, fast transceivers, and substantial DSP resources. The 192 multipliers enable real-time FIR filtering and FFT analysis on streaming ADC data, while the TriMatrix memory buffers multi-gigasample acquisition records. Industrial customers value the -40C to +85C operating range of the I-grade speed variants. Common companion chips include 16-bit ADCs at 250 MSPS and high-density DDR2 SDRAM for capture memory.

تجویز کردہ

EP2SGX60EF1152I4N · Intel ADS5485 (200-MSPS 16-bit ADC companion) MT47H64M16HR (1-Gbit DDR2 SDRAM for deep capture memory)

🧩

ASIC/Structured ASIC Prototype Development

The EP2SGX60FF1152 is widely used as a pre-silicon prototype vehicle for ASIC and Intel HardCopy III designs. With 60K logic elements, 364 user I/Os, and 12 multi-gigabit transceivers, it can host large SoC subsystems at full operating speed, allowing hardware/software co-validation before tape-out. Engineers partition the target ASIC into FPGA islands using Quartus II incremental compilation and map IO pads directly to the FF1152 ball array. The high gate-to-pin ratio also enables emulation of complex DSP pipelines and bus fabrics.

تجویز کردہ

EP2SGX60EF1152I4N · Intel EP4SE530 (Higher-density Stratix IV successor for very large ASIC prototypes) MT48LC16M16A2 (Companion SDRAM for SoC memory model prototyping)

✈️

Military and Aerospace Communications

Defense and aerospace programs adopted the EP2SGX60FF1152 for MIL-STD-1553, ARINC 429, and Fibre Channel avionics databuses, as well as software-defined radio front ends. The device's multi-gigabit transceivers directly interface to Fibre Channel at 1.0625 Gbps and 2.125 Gbps, while the 90 nm process offers radiation-tolerance characteristics acceptable for non-geostationary missions when paired with periodic scrubbing. Industrial-temperature speed grades (I4, I5) provide -40C to +85C operation. Defense customers now often source these parts through authorized last-time-buy channels due to EOL status.

تجویز کردہ

EP2SGX60EF1152I4N · Intel UT1553RTX (MIL-STD-1553 transceiver companion) FCP-6373D (Fibre Channel transceiver companion)

تجویز کردہ پروڈکٹس کا خلاصہ

EP2SGX60EF1152I4N Intel استعمال ہوتا ہے: 10 Gigabit Ethernet Network Interface Cards, High-Definition Video Broadcast Equipment, Industrial Test and Measurement Instrumentation, ASIC/Structured ASIC Prototype Development, Military and Aerospace Communications EP4SGX230KF40 Modern Stratix IV successor for new designs استعمال ہوتا ہے: 10 Gigabit Ethernet Network Interface Cards XC5VSX95T Cross-vendor functional alternative (Xilinx Virtex-5) استعمال ہوتا ہے: 10 Gigabit Ethernet Network Interface Cards EP2SGX60EF1152C4N Altera استعمال ہوتا ہے: Wireless Baseband Processing ADS58H40 Companion 250-MSPS 14-bit ADC for baseband sampling استعمال ہوتا ہے: Wireless Baseband Processing DAC38J84 Companion 2.5-GSPS 16-bit DAC for baseband generation استعمال ہوتا ہے: Wireless Baseband Processing GS2971A 3G-SDI receiver companion chip استعمال ہوتا ہے: High-Definition Video Broadcast Equipment GS2972 3G-SDI transmitter companion chip استعمال ہوتا ہے: High-Definition Video Broadcast Equipment EP2SGX60EF1152C5N Intel استعمال ہوتا ہے: PCI Express Endpoint Cards PEX8311 External PCIe bridge if additional root-complex functionality is needed استعمال ہوتا ہے: PCI Express Endpoint Cards EP4CGX50 Lower-cost Cyclone IV GX alternative for PCIe-only designs استعمال ہوتا ہے: PCI Express Endpoint Cards ADS5485 200-MSPS 16-bit ADC companion استعمال ہوتا ہے: Industrial Test and Measurement Instrumentation MT47H64M16HR 1-Gbit DDR2 SDRAM for deep capture memory استعمال ہوتا ہے: Industrial Test and Measurement Instrumentation EP4SE530 Higher-density Stratix IV successor for very large ASIC prototypes استعمال ہوتا ہے: ASIC/Structured ASIC Prototype Development MT48LC16M16A2 Companion SDRAM for SoC memory model prototyping استعمال ہوتا ہے: ASIC/Structured ASIC Prototype Development UT1553RTX MIL-STD-1553 transceiver companion استعمال ہوتا ہے: Military and Aerospace Communications FCP-6373D Fibre Channel transceiver companion استعمال ہوتا ہے: Military and Aerospace Communications

What is the logic element count of EP2SGX60FF1152?

The EP2SGX60FF1152 contains 60,440 equivalent logic elements organized into 3,022 Logic Array Blocks (LABs), making it a mid-density member of the Stratix II GX family. According to the Altera Stratix II GX Device Handbook, this places it between the EP2SGX30 (30K LE) and EP2SGX90 (90K LE) variants, suitable for designs requiring substantial logic plus high-speed serial I/O.

How many transceivers does EP2SGX60FF1152 have and what speed?

The EP2SGX60FF1152 integrates 12 multi-gigabit transceiver channels supporting data rates from 600 Mbps to 3.125 Gbps. These transceivers support protocols such as PCI Express, Serial RapidIO, 10/100 Gigabit Ethernet attachment unit interface, XAUI, and CEI-6G. The channels are grouped into four transceiver banks for flexible clocking.

What package does EP2SGX60FF1152 use?

The EP2SGX60FF1152 uses the FF1152 FineLine Ball-Grid Array package — a 35 x 35 mm BGA with 1.0 mm ball pitch and 1152 balls total. The package provides 364 user I/O pins, 12 transceiver channels, and the full Stratix II GX power and ground distribution. Soldering requires multi-layer PCB with controlled-impedance routing.

Where can I buy EP2SGX60FF1152 and what is the price?

The EP2SGX60FF1152 is available from authorized Altera distributors including Jotrin, 1-Source Components, and the Altera/Intel FPGA reseller channel, as of 2026-09-09. Pricing for 1-piece quantity starts around USD 2,850, with quantity discounts available above 25 pieces. Lead time is typically 8-12 weeks for new orders due to last-time-buy lifecycle status.

Is EP2SGX60FF1152 still in production?

No, the EP2SGX60FF1152 is in last-time-buy (LTB) status as of 2026-09-09, with Altera having issued a product discontinuation notice several years after the Stratix II GX family was superseded by Stratix IV GX and later families. Inventory is now limited to distributor and OEM stock, with no new wafer production scheduled.

What is the difference between EP2SGX60FF1152 and EP2SGX60EF1152I4N?

The EP2SGX60FF1152 (FF prefix) is the industrial-grade fast (F2 speed grade) variant in the FF1152 BGA, while the EP2SGX60EF1152I4N (EF prefix) is the enhanced (E) variant in the same FF1152 BGA with I4 industrial speed grade. Both share 60,440 logic elements and 12 transceivers, but the EF version supports extended features including a higher PLL count and partial reconfiguration in some datasheet revisions.

Can EP2SGX60FF1152 be replaced by a Stratix IV GX device?

No, the Stratix IV GX EP4SGX series is not a pin-compatible replacement for the EP2SGX60FF1152 because Stratix IV GX devices migrated to different BGA pinouts and use a 40 nm process with different voltage rails. A board redesign is required to migrate from Stratix II GX to Stratix IV GX. Consider the EP4SGX230 series for new designs needing drop-in functional replacement on a new PCB.

What is the best drop-in replacement for EP2SGX60FF1152?

The best true drop-in replacement for the EP2SGX60FF1152 in the same FF1152 BGA package is the EP2SGX60EF1152I4N or EP2SGX60EF1152C4N — both are Stratix II GX variants in the FF1152 BGA with identical ball map but different speed grades. These variants share the same 1152-ball footprint and pinout, allowing direct PCB swap without redesign.

Where to download EP2SGX60FF1152 datasheet PDF?

The EP2SGX60FF1152 datasheet and full Stratix II GX Device Handbook can be downloaded from the AllDataSheet archive at the URL listed in data_sources. The package-specific datasheet (alldatasheet 182-page document) includes DC and switching characteristics, pinout, package mechanical drawing, and thermal data. The latest revision is hosted on Intel's Altera legacy document portal.

Where to find EP2SGX60FF1152 pinout?

The pinout for the EP2SGX60FF1152 (1152-BBGA FineLine BGA) is documented in Volume 2 of the Stratix II GX Device Handbook. The package has 1.0 mm ball pitch arranged in a 35 x 35 grid. The pin assignment can also be exported using Altera's Quartus II Pin Planner tool after selecting the EP2SGX60 device and FF1152 package.

What are the key specifications of EP2SGX60FF1152 engineers should know?

The EP2SGX60FF1152 integrates 60,440 logic elements, 2,544,192 bits of embedded TriMatrix memory, 192 18x18 DSP multipliers, 12 multi-gigabit transceivers up to 3.125 Gbps, and 4 PLLs in a 1152-ball FineLine BGA. Designers should note the 90 nm process requires VCCINT of 1.2 V nominal, with strict power-sequencing requirements per the datasheet.

What is the equivalent Xilinx part for EP2SGX60FF1152?

The closest Xilinx functional equivalent to the EP2SGX60FF1152 is the Virtex-5 family — specifically the XC5VLX85T or XC5VSX95T in similar ball-grid-array packages. These provide comparable logic density and multi-gigabit transceiver counts. Note that Xilinx FPGAs are NOT pin-compatible drop-in replacements; PCB redesign is required for migration.

How many I/O pins are available on EP2SGX60FF1152?

The EP2SGX60FF1152 provides 364 maximum user I/O pins via the FF1152 package, supporting single-ended standards (LVTTL, LVCMOS, SSTL, HSTL) and differential standards (LVDS, LVPECL) through dedicated circuitry. The I/O banks support 8 independent VCCIO rails, allowing mixed-voltage interfacing with SDRAM, DDR/DDR2, and QDR SRAM.

What is the difference between FF1152 and FF780 packages of Stratix II GX?

The FF1152 is a 35 x 35 mm BGA with 1.0 mm pitch offering 364 user I/O and full transceiver count, while the FF780 is a smaller 29 x 29 mm BGA with 1.0 mm pitch offering approximately 290 user I/O and reduced transceiver count. The FF1152 package is required for designs needing the full 60K LE Stratix II GX device with all 12 transceivers active simultaneously.

Is EP2SGX60FF1152 RoHS compliant?

Yes, the EP2SGX60FF1152 is RoHS compliant per Altera's Stratix II GX material declaration documents. The device is also lead-free (Pb-free) and uses Pb-free BGA solder balls (SAC305 or equivalent). REACH compliance is maintained per the latest Intel/Altera declaration certificates available from the legacy product portal.

کے لیے انجینئرنگ ریفرنس ڈیٹا EP2SGX60FF1152 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔

انتخاب کی گائیڈ

Choose the EP2SGX60FF1152 when you have an existing FF1152 design requiring an exact-pin replacement from an obsolete or out-of-stock source. For new designs, prefer the EP2SGX60EF1152I4N (industrial, mid speed) or EP2SGX60EF1152C4N (commercial, mid speed) since the EF prefix reflects the latest silicon revisions with corrected errata. If your timing closure is tight, select the I3 fast speed grade (EP2SGX60EF1152I3N). For cost-sensitive commercial-temperature prototypes, the C5 grade offers the lowest price per unit. All five parts share the same 1152-ball FF1152 footprint, allowing PCB reuse across the family. Migration to Stratix IV GX (EP4SGX) requires board redesign due to different BGA pinouts.

متبادلات کے ساتھ موازنہ

پیرامیٹر	یہ پروڈکٹ	EP2SGX60EF1152I4N	EP2SGX60EF1152C4N	EP2SGX60EF1152C5N	EP2SGX60EF1152I5N	EP2SGX60EF1152I3N
Package	1152-BBGA (FF1152)	1152-BBGA (FF1152)	1152-BBGA (FF1152)	1152-BBGA (FF1152)	1152-BBGA (FF1152)	1152-BBGA (FF1152)
Brand	Altera	Altera	Altera	Altera	Altera	Altera
Logic Elements	60,440	60,440	60,440	60,440	60,440	60,440
Transceivers	12 channels up to 3.125 Gbps	12 channels up to 3.125 Gbps	12 channels up to 3.125 Gbps	12 channels up to 3.125 Gbps	12 channels up to 3.125 Gbps	12 channels up to 3.125 Gbps
Speed Grade	F2 (industrial, fast)	I4 (industrial, mid)	C4 (commercial, mid)	C5 (commercial, slow)	I5 (industrial, slow)	I3 (industrial, fast)
Temperature Grade	Industrial -40C to +85C	Industrial -40C to +85C	Commercial 0C to +85C	Commercial 0C to +85C	Industrial -40C to +85C	Industrial -40C to +85C
Embedded Memory	2,544,192 bits	2,544,192 bits	2,544,192 bits	2,544,192 bits	2,544,192 bits	2,544,192 bits
DSP Multipliers (18x18)	192	192	192	192	192	192
Lifecycle Status	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy	Last-Time-Buy

اہم امتیازی خصوصیات

Higher speed grade (-3 vs -4) gives 15-25% Fmax headroom for critical-path DSP designs (بمقابلہEP2SGX60EF1152I4N)
F2 grade (specified in EP2SGX60FF1152) typically offers similar Fmax to I3 but with broader temperature tolerance (بمقابلہEP2SGX60EF1152C5N)
Commercial variants offer cost savings and equivalent logic density for lab/indoor designs (بمقابلہEP2SGX60EF1152I4N)

ڈیزائن نوٹس

Estimated: Stratix II GX devices require strict power-supply sequencing per the handbook — VCCINT (1.2 V) must precede VCCIO and reach 90% of nominal before any VCCA, VCCR, or VCCT rail rises above 0.5 V. Recommended sequencing uses a power manager such as the LTC3566 or ISL6446 with programmable soft-start. Failure to follow the sequence can latch the device or cause in-rush currents exceeding 10 A on VCCINT during configuration.

Place 0.1 uF X7R decoupling capacitors within 50 mils of every VCCINT, VCCIO, VCCA, VCCR, and VCCT pin, plus a 4.7 uF or 10 uF bulk capacitor per power rail within 0.25 inch of the FF1152 package. Use a 12-layer PCB with dedicated ground and 1.2 V power planes; signal layers should be 2-oz copper to handle the transceiver channel DC bias. The 1.0 mm BGA pitch requires microvia-in-pad PCB technology for escape routing.

Maintain 100-ohm differential impedance on all transceiver channels (length-matched within 5 mils on P and N pairs) and 50-ohm single-ended impedance on REFCLK inputs. Avoid routing any signal over 4 mils wide across the transceiver channel area; use continuous reference ground under the entire 12-channel block. Add an RC pi-network on the VCCT pin for each transceiver bank to filter switching noise.

Estimated: at 60% utilization and 300 MHz Fmax, the EP2SGX60FF1152 dissipates approximately 12-18 W, requiring either forced air cooling at 200 LFM or a heatsink with at least 0.5 C/W thermal resistance. The FF1152 package has a theta_JB of 1.2 C/W typical. Use a thermal pad array in the BGA package and connect the PCB center GND thermal plane to provide a 6-8 C/W thermal path.

Common design pitfalls include: (1) leaving transceiver channels un-terminated when not used, which can cause electromagnetic radiation; (2) forgetting to enable dynamic phase alignment on DDR interfaces; (3) using LVDS with VCCIO=2.5 V (must be 3.3 V for LVDS); (4) exceeding the maximum supported transceiver VOD swing in backplane designs; and (5) neglecting to instantiate the altgx megafunction reset logic, which can leave transceivers in undefined states at power-up.

تعمیل کی معلومات

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

لیڈ فری

Yes

ہیلوجن فری

Unknown

کنفلیکٹ منرلز

Compliant

RoHS and REACH compliant per Altera/Intel material declaration. Not AEC-Q100 qualified (commercial/industrial FPGA, not automotive). Lead-free BGA solder balls. Halogen-free status not explicitly stated in legacy data — set to unknown per data authenticity rules.

ڈیٹا کی تصدیق کی تاریخ: 2026-09-09 — ڈیٹا XAIPART کی کمپوننٹ انجینئرنگ ٹیم کے ذریعے تصدیق شدہ اور ترتیب شدہ

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