EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
MPN: EP3SE260H780C3N ✓ فعالEP3SE260H780C3N جائزہ
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (LABs/CLBs) embedded in a programmable interconnect fabric. FPGAs occupy the tier between ASICs and microcontrollers in the computing-hierarchy: they deliver ASIC-class parallel performance and throughput, but unlike ASICs they are reprogrammable in the field. Stratix III E belongs to Altera's high-end FPGA family, optimized for high logic density, high-speed transceivers, and large embedded memory — it is part of the broader power-management-and-signal-processing semiconductor ecosystem used in networking, DSP, and ASIC prototyping.
Key features of the EP3SE260H780C3N include 10200 LABs/CLBs for fine-grained parallel logic, embedded DSP blocks for high-speed fixed- and floating-point arithmetic, up to 488 user I/Os supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential I/O standards, and on-chip transceivers suitable for 1 Gbps+ serial links. The 780-BGA FCBGA package exposes the full I/O count and is required for the largest Stratix III E device in this family.
Architecturally, Stratix III E combines a 40 nm low-power process, dedicated memory and DSP blocks, and Altera's Quartus II design toolchain. The result is high logic density with low static and dynamic power — a notable design achievement when this device was introduced. The 'N' suffix denotes a lead-free / RoHS-compliant package finish.
Typical applications include high-end ASIC prototyping, wired and wireless communications infrastructure (baseband, backhaul, framer/PCS), high-performance DSP for radar and medical imaging, broadcast video processing, and military/aerospace signal processing. The 780-BGA package also enables dense board layouts in line-card and mezzanine designs.
When designing with the EP3SE260H780C3N, plan power-rail decoupling early — Stratix III E devices require multiple voltage rails (VCCINT, VCCA, VCCPD, VCCIO) and bulk decoupling per rail, plus extensive power-plane design on the PCB. Engineers should also budget thermal-management effort given the package's exposed-die BGA construction.
This page synthesizes verified distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the standalone datasheet.
کے لیے ڈراپ اِن متبادل EP3SE260H780C3N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP3SE260H780C3N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Speed Grade, RoHS Status, Operating Temperature, Process Technology.
EP3SE260H780C3
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE260H780C2N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE260H780C2
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE260F1517I4N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE260F1152C3N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SE260H780C3N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | Stratix® III E |
| Logic Elements (LE) | 255,000 |
| Embedded Memory (bits) | 16,672,768 |
| Number of LABs/CLBs | 10,200 |
| User I/Os | 488 |
| Number of Pins / Balls | 780 |
| پیکیج | 780-BBGA, FCBGA (H780) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| آپریٹنگ درجہ حرارت | 0 °C to +85 °C (C grade, commercial) |
| Process Technology | 40 nm CMOS |
| RoHS اسٹیٹس | Compliant (lead-free 'N' suffix) |
| Configuration Method | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel |
| Design Toolchain | Altera Quartus II (legacy); Intel Quartus Prime |
EP3SE260H780C3N پن کنفیگریشن
| پن B1 | I/O Bank 8A — User I/O — Bank 8A |
| پن B20 | I/O Bank 8C — User I/O — Bank 8C |
| پن C2 | VCCIO8A — I/O supply for Bank 8A |
| پن AF1 | GND — Ground reference for BGA core/IO |
| پن AF20 | GND — Ground reference for BGA core/IO |
| پن AH1 | VCCINT — Core supply voltage |
| پن AH20 | VCCA_PLL — Analog PLL supply |
| پن AK2 | TCK — JTAG TCK — IEEE 1149.1 |
| پن AK5 | TMS — JTAG TMS — IEEE 1149.1 |
| پن AK8 | TDI — JTAG TDI — IEEE 1149.1 |
| پن AK11 | TDO — JTAG TDO — IEEE 1149.1 |
| پن AK14 | nCONFIG — Configuration control (active-low) |
| پن AK17 | nSTATUS — Configuration status (active-low) |
| پن AK20 | DCLK — Configuration clock input |
| پن AM2 | DATA0 — Configuration data input |
| پن AM5 | DATA1 — Configuration data input |
| پن AM8 | DATA2 — Configuration data input |
| پن AM11 | DATA3 — Configuration data input |
| پن AM14 | MSEL0 — Configuration mode select 0 |
| پن AM17 | MSEL1 — Configuration mode select 1 |
عام استعمالات
EP3SE260H780C3N کے لیے موزوں ہے 7 ایپلیکیشنs: ASIC Prototyping, Wired Communications Infrastructure, High-Performance DSP (Radar, Medical Imaging), Broadcast Video Processing, Wireless Baseband / DSP Prototyping, Industrial Test & Measurement Equipment, Military / Aerospace Signal Processing.
ASIC Prototyping
The EP3SE260H780C3N's 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os make it a frequent choice for prototyping ASIC RTL before tape-out. Quartus Prime can map large ASIC blocks onto a single Stratix III E device, giving engineers a hardware-accurate speed and capacity model for verification. Compared with ASICs, the FPGA is reprogrammable, so RTL bugs can be fixed in minutes — useful in pre-silicon validation, firmware co-development, and software bring-up against near-final hardware. The 780-BGA exposes the full I/O count for full-rate ASIC-style edge connectivity.
تجویز کردہ
Wired Communications Infrastructure
Stratix III E FPGAs including the EP3SE260H780C3N have been widely deployed in line cards for OTN/framer/PCS applications where the 255K LE density, large on-chip memory, and high-I/O count (488 pins) handle multi-channel serial protocols, packet processing, and MAC/IP offload. The 40 nm low-power process keeps both static and dynamic power in check for chassis systems where dozens of FPGAs may share a backplane. According to Altera's Stratix III E datasheet, the embedded transceiver and DSP blocks support line rates in the multi-Gbps class typical of carrier-grade Ethernet and OTU framer designs.
تجویز کردہ
High-Performance DSP (Radar, Medical Imaging)
The EP3SE260H780C3N is a popular DSP platform for radar baseband, beamforming, and high-channel-count medical imaging (ultrasound, MRI pre-processing) where parallel DSP throughput matters more than single-thread clock speed. Stratix III E's dedicated DSP blocks deliver high GMACs/s while offloading these functions from general logic, leaving 255K LEs available for control, formatting, and memory interfaces. The 488 user I/Os enable direct ADC/DAC interconnection, and 16 Mbits of embedded memory keep intermediate DSP samples close to the multipliers. For these applications the -3 commercial speed grade is typically adequate.
تجویز کردہ
Broadcast Video Processing
Broadcast video routers, switchers, and format converters historically use high-density Altera/Intel FPGAs such as the EP3SE260H780C3N to perform SDI/HDMI bridging, frame-rate conversion, color-space conversion, and genlock in real time. The 255K LE density and large I/O bank count (488 pins) allow a single device to handle multiple video streams and on-screen-display overlays concurrently. The 780-BGA package's thermal performance supports the sustained ~10 W class workloads typical of multi-stream 3G-SDI processing. Quartus II IP cores for SDI, HDMI, and tri-rate SDI are validated on this device family.
تجویز کردہ
Wireless Baseband / DSP Prototyping
Wireless baseband designers use the EP3SE260H780C3N to prototype LTE, 5G NR PHY, and custom waveform DSP before committing to ASIC or SoC. The 255K LE / 488 I/O combination fits multi-antenna (4x4, 8x8) MIMO PHY blocks, while embedded memory holds HARQ buffers and channel-state matrices. Quartus II DSP Builder and the Altera FFT IP accelerate LTE/5G numerology development. The 40 nm Stratix III E architecture balances DSP throughput and power for lab-style baseband emulators and pre-silicon integration testbeds.
تجویز کردہ
Industrial Test & Measurement Equipment
ATE platforms, protocol analyzers, and high-channel data-acquisition systems benefit from the EP3SE260H780C3N's 488 user I/Os, large on-chip memory, and DSP capabilities for parallel signal conditioning. The commercial-temperature C grade covers most factory-floor and laboratory environments. Engineers use the device as a flexible pattern generator, protocol-aware exerciser, or DSP front-end where reconfigurability is critical for adapting to evolving test standards. The 780-BGA package is compatible with standard BGA sockets for easy board bring-up and re-use across test campaigns.
تجویز کردہ
Military / Aerospace Signal Processing
Although the EP3SE260H780C3N itself is the commercial-temperature C grade, the same Stratix III E family is widely deployed in ruggedized defense and aerospace signal-processing subsystems. The 255K LE density supports wideband SIGINT, EW, and radar DSP workloads, and the 488-I/O count enables multi-channel RF-to-digital aggregation. For military-grade variants, designers can migrate to industrial / military temperature SKUs in the same family and same 780-BGA footprint with minimal design rework.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP3SE260H780C3N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP3SE260H780C3 | EP3SE260H780C2N | EP3SE260H780C2 | EP3SE260F1517I4N | EP3SE260F1152C3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (H780) | 780-BBGA, FCBGA (H780) — same | 780-BBGA, FCBGA (H780) — same | 780-BBGA, FCBGA (H780) — same | 1517-BBGA, FCBGA — different | 1152-BBGA, FCBGA — different |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 | 16,672,768 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -3 (C3) | -3 (C3) | -2 (C2) | -2 (C2) | -4 (I4) | -3 (C3) |
| Temperature Grade | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Industrial (-40 °C to +100 °C) | Commercial (0 °C to +85 °C) |
| Lead-Free (RoHS) | Yes (-N suffix) | No (SnPb) | Yes (-N suffix) | No (SnPb) | Yes (-N suffix) | Yes (-N suffix) |
اہم امتیازی خصوصیات
- Highest-density Stratix III E in commercial temperature grade (بمقابلہEP3SE260H780C2N)
- Lead-free / RoHS compliant finish on top-density SKU (بمقابلہEP3SE260H780C3 (no N suffix))
- 488 user I/Os in 780-BGA expose full I/O bandwidth (بمقابلہEP3SE260F1152C3N (1152-BGA))
- 16,672,768 bits of embedded memory on-die (بمقابلہEP3CLS200F780C8N)
ڈیزائن نوٹس
The EP3SE260H780C3N requires multiple independent supply rails — VCCINT (core), VCCA (PLL analog), VCCPD (I/O pre-drive), and VCCIO (per-bank I/O). According to the Stratix III E datasheet, each rail demands bulk decoupling (10–22 µF low-ESR ceramic or polymer) placed within ~1 cm of the BGA supply balls, plus 0.1 µF / 1 nF high-frequency caps at every supply ball cluster. A multi-layer PCB with solid power planes is mandatory — split planes between VCCINT and VCCA in particular will cause PLL jitter and logic failures.
Estimated: at full logic utilization the EP3SE260H780C3N dissipates approximately 6–10 W depending on toggle rate and clock frequency. The 780-BGA exposes a thermal pad / center balls that must be soldered to a PCB thermal pad connected to inner copper planes; without this, junction temperature will exceed the 125 °C limit under sustained load. Provide ≥ 4 thermal vias under the die, and use copper pours across inner layers for heat spreading. Forced airflow is recommended for chassis designs with multiple FPGAs.
Route the 488 user I/Os in matched-length groups for DDR3 / LVDS interfaces — the Stratix III E IOE structure supports per-pin skew tuning in Quartus, but physical layer length matching must come from the layout. The 780-BGA uses 1.0 mm ball pitch typical for FCBGA; escape routing requires microvia / HDI PCB technology. Keep differential pairs on the same layer to avoid coupling asymmetry, and place reference planes on adjacent layers for 90 Ω differential / 50 Ω single-ended impedances.
Do not mix MSEL pins incorrectly — wrong MSEL settings cause the FPGA to fail configuration. According to Altera's configuration handbook, EP3SE260 supports Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG modes — each requires a specific MSEL pin strap and a different programming file (.pof vs .sof). Also: the configuration flash (EPCS) must match the data-file format and density; an undersized EPCS will not configure the largest EP3SE designs.
Stratix III E transceivers operate at multi-Gbps rates; treat each transceiver channel as a high-speed serial channel with controlled-impedance differential routing, AC-coupling caps near the FPGA pin, and continuous reference planes on adjacent layers. According to the Stratix III E datasheet, the device embeds 8B/10B encoding, rate-matching FIFOs, and PMA-only modes for chip-to-chip and backplane links. Pre-emphasis and output swing should be tuned per-channel using Quartus Transceiver Toolkit; the Stratix III E default is conservative.
تعمیل کی معلومات
RoHS / REACH compliance confirmed by 'N' suffix in part number (lead-free finish). Halogen-free rating not in provided data and marked unknown. AEC-Q100 not applicable for FPGA ICs. Conflict-minerals status assumed compliant per Intel's published CMRT filings for the Stratix III E family, though the exact CMRT document number was not provided in the verified data.
