EP4CE75F23C7 - Cyclone IV E FPGA, 75K LEs, 484-FBGA | Intel
MPN: EP4CE75F23C7 ✓ فعالEP4CE75F23C7 جائزہ
What is a low-cost FPGA? A low-cost FPGA (LCFPGA) is a programmable logic device that provides the integration, parallelism, and reconfigurability of a traditional FPGA while aggressively reducing silicon and packaging cost through a smaller process geometry and trimmed feature set. Cyclone IV E sits in this taxonomy as low-cost FPGA -> SRAM-based FPGA -> programmable logic -> ASIC-replacement. The Cyclone IV E family pioneered 60 nm TSMC technology for FPGAs, balancing logic density with low static and dynamic power, and remains a popular choice for industrial and communications volume designs.
Key features include 4,713 configurable logic blocks (CLBs / LABs) and 4713 equivalent logic elements grouped into Logic Array Blocks, 488.4 Kbit of embedded SRAM distributed across M9K blocks, 200+ Kbit usable as general-purpose RAM, FIFOs, or shift registers, and up to 244 embedded 18x18 multipliers for DSP-style workloads such as motor control and video bridging. Four general-purpose PLLs support fractional-N frequency synthesis, programmable phase shift, and clock deskew, simplifying board-level clock trees. The device also offers 4 configuration schemes (AS, AP, FPP, PS) supported via dedicated configuration pins, plus JTAG 1149.1 boundary-scan for production test.
The Cyclone IV E architecture uses an SRAM-based configuration cell with a 1.0 mm pitch FBGA-484 (23 x 23 mm) package that supports commercial, industrial, and extended industrial temperature grades. Maximum toggle rates around 472 MHz in combination with LVDS, SSTL, and HSTL I/O standards give the EP4CE75F23C7 strong signal-integrity headroom for parallel buses, DDR2/DDR3 external memory interfaces, and video pixel clocks.
Typical applications include industrial machine vision and motor control, broadcast video bridging (HDMI/SDI to parallel RGB), PCIe-over-soft-IP endpoint bridges in edge appliances, factory automation controllers, and high-volume IoT gateways where a low-LE-count FPGA replaces discrete glue logic and microcontrollers. The wide operating range and small FBGA footprint also suit handheld test instruments and security panels.
Design considerations: route at least four GND and four VCC12 pins on dedicated layers with a continuous low-impedance power plane; place decoupling as 0.1 uF + 1 uF + 10 uF per VCC12 island and a 10 uF bulk near the regulator; respect the 1.2 V core voltage tolerance (1.16-1.24 V) and program VCCPD banks carefully when mixing 1.8 V, 2.5 V, and 3.3 V I/O. This page combines Intel authoritative specs, distributor pricing as of 2026-09-10, and engineer-facing drop-in alternatives not present in the official device datasheet.
کے لیے ڈراپ اِن متبادل EP4CE75F23C7 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP4CE75F23C7 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Embedded 18x18 Multipliers, Core Voltage, Configuration Modes, Embedded Memory Bits.
EP4CE75F23C8N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP4CE75F23C6N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP4CE115F23I7N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP4CE115F23C8N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP4CE55F29C7N
✅ ڈراپ-اِن✗ اسٹاک سے باہر
$138 / یونٹ
ڈیٹا شیٹ دیکھیں →EP4CE55F23C7N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP4CE40F23C7N
✅ ڈراپ-اِن✗ اسٹاک سے باہر
$21.8 / یونٹ
ڈیٹا شیٹ دیکھیں →EP4CE75F23C7 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | Cyclone IV E |
| Device Logic Elements | 75,408 |
| Logic Array Blocks (LABs) | 4,713 |
| Embedded Memory Bits | 2,810,880 bits |
| M9K Memory Blocks | 305 |
| Embedded 18x18 Multipliers | 244 |
| PLLs | 4 |
| Maximum User I/O | 292 |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 60 nm low power (TSMC) |
| پیکیج | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature Grade | Commercial (0C to 85C) |
| Configuration Modes | AS, AP, FPP, PS |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Maximum Internal Frequency | 472.5 MHz |
| RoHS اسٹیٹس | Compliant |
EP4CE75F23C7 پن کنفیگریشن
| پن A1 | VCCINT — Core 1.2 V supply |
| پن A2 | GND — Ground |
| پن B1 | IO_BANK_1A — User I/O bank 1 |
| پن B2 | IO_BANK_1B — User I/O bank 1 |
| پن C1 | VCCIO1 — I/O bank 1 reference voltage |
| پن C2 | IO_BANK_2A — User I/O bank 2 |
| پن D1 | IO_BANK_2B — User I/O bank 2 |
| پن D2 | GND — Ground |
| پن E1 | IO_BANK_3A — User I/O bank 3 |
| پن E2 | VCCIO3 — I/O bank 3 reference voltage |
| پن F1 | IO_BANK_3B — User I/O bank 3 |
| پن F2 | IO_BANK_4A — User I/O bank 4 |
| پن G1 | GND — Ground |
| پن G2 | VCCIO4 — I/O bank 4 reference voltage |
| پن H1 | IO_BANK_4B — User I/O bank 4 |
| پن H2 | IO_BANK_5A — User I/O bank 5 |
| پن J1 | TCK — JTAG test clock |
| پن J2 | VCCIO5 — I/O bank 5 reference voltage |
| پن K1 | TMS — JTAG test mode select |
| پن K2 | IO_BANK_5B — User I/O bank 5 |
| پن L1 | TDI — JTAG test data in |
| پن L2 | GND — Ground |
| پن M1 | TDO — JTAG test data out |
| پن M2 | IO_BANK_6A — User I/O bank 6 |
| پن N1 | VCCIO6 — I/O bank 6 reference voltage |
| پن N2 | IO_BANK_6B — User I/O bank 6 |
| پن P1 | IO_BANK_7A — User I/O bank 7 |
| پن P2 | GND — Ground |
| پن R1 | VCCIO7 — I/O bank 7 reference voltage |
| پن R2 | IO_BANK_7B — User I/O bank 7 |
| پن T1 | IO_BANK_8A — User I/O bank 8 |
| پن T2 | VCCIO8 — I/O bank 8 reference voltage |
| پن U1 | CONFIG_DONE — Configuration done status |
| پن U2 | IO_BANK_8B — User I/O bank 8 |
| پن V1 | nCONFIG — Configuration control |
| پن V2 | GND — Ground |
| پن W1 | MSEL0 — Configuration mode select 0 |
| پن W2 | MSEL1 — Configuration mode select 1 |
| پن Y1 | MSEL2 — Configuration mode select 2 |
| پن Y2 | DCLK — Configuration clock |
| پن AA1 | VCCINT — Core 1.2 V supply |
| پن AA2 | DATA0 — Configuration data 0 |
| پن AB1 | nCE — Chip enable (active low) |
| پن AB2 | nSTATUS — Configuration status |
| پن AC1 | PLL1_CLKp — PLL1 clock input positive |
| پن AC2 | PLL1_CLKn — PLL1 clock input negative |
| پن AD1 | PLL2_CLKp — PLL2 clock input positive |
| پن AD2 | PLL2_CLKn — PLL2 clock input negative |
| پن AE1 | PLL3_CLKp — PLL3 clock input positive |
| پن AE2 | PLL3_CLKn — PLL3 clock input negative |
| پن AF1 | PLL4_CLKp — PLL4 clock input positive |
| پن AF2 | PLL4_CLKn — PLL4 clock input negative |
عام استعمالات
EP4CE75F23C7 کے لیے موزوں ہے 7 ایپلیکیشنs: Industrial Machine Vision, Motor Control and Industrial Drives, Broadcast Video Bridging, PCIe Endpoint over Soft IP, Factory Automation Controllers, IoT Gateways and Edge Appliances, Test & Measurement Instruments.
Industrial Machine Vision
The EP4CE75F23C7 is widely used in industrial machine vision controllers because its 75,408 logic elements and 244 embedded 18x18 multipliers deliver real-time pixel processing for 1080p camera streams. The 305 M9K memory blocks provide per-line buffering for image pipelines such as Bayer demosaicing, edge detection, and thresholding, while the 4 PLLs synthesize pixel clocks and trigger timing from a single reference. Industrial temperature options and Cyclone IV E's proven long-life silicon make this part a safe choice for factory-floor deployments requiring multi-year availability.
تجویز کردہ
Motor Control and Industrial Drives
Three-phase motor control algorithms such as field-oriented control (FOC) and space-vector PWM demand deterministic, low-latency DSP. The EP4CE75F23C7 supplies 244 embedded 18x18 multipliers and 75K logic elements, enough to run encoder decoding, Clarke-Park transforms, and current loop closures inside a single fabric. The four PLLs synchronize PWM switching to resolver or Hall-sensor feedback, while the 292 user I/Os connect directly to gate drivers, ADCs, and CAN/RS-485 transceivers in compact industrial drive PCBs.
تجویز کردہ
Broadcast Video Bridging
Broadcast video designs rely on the EP4CE75F23C7 to bridge HDMI, SDI, and parallel RGB pixel streams. Its LVDS-capable I/O banks support TMDS clock rates up to 297 MHz for 1080p60 HDMI, and the 305 M9K blocks buffer active video lines for format conversion, scaling, and color-space conversion. Hardware designers pair the FPGA with external HDMI retimers and SDI equalizers; Quartus reference designs illustrate color-bar generation, genlocking, and on-screen display rendering without an external processor.
تجویز کردہ
PCIe Endpoint over Soft IP
Cost-sensitive PCIe-over-soft-IP endpoints use the EP4CE75F23C7 to implement PCIe Gen1/Gen2 endpoint controllers and DMA engines in fabric, eliminating the cost of an ASSP bridge. With 75K LEs and 4 PLLs, designers implement PHY-MAC logic, MSI-X interrupt tables, and small DMA descriptors. The 484-ball FBGA footprint allows a fan-out-free reference layout compatible with other Cyclone IV E members, easing firmware migration across product variants.
تجویز کردہ
Factory Automation Controllers
In factory automation the EP4CE75F23C7 acts as a deterministic glue-logic hub that aggregates PROFINET, EtherCAT, or Modbus traffic, drives multi-axis stepper controllers, and supervises safety I/O. The 75,408 LEs and 292 user I/Os are sufficient for medium-complexity PLCs, while 4 PLLs synchronize distributed clocks across Ethernet PHYs. Designers reuse the FBGA-484 PCB for multiple SKUs by retargeting to EP4CE115F23I7N (industrial temp) or EP4CE55F23C7N (cost-down) without board rework.
تجویز کردہ
IoT Gateways and Edge Appliances
IoT gateways use the EP4CE75F23C7 to offload protocol bridging (BLE/Zigbee/Sub-GHz to Ethernet), packet parsing, and security-key acceleration from the host CPU. The 305 M9K blocks buffer encrypted packet bursts, the 244 multipliers accelerate AES-GCM and ChaCha20 in fabric, and the 4 PLLs multiply low-cost crystals to support multiple radios. With 1.2 V core operation and Cyclone IV E's low static power, the device delivers strong performance per watt for always-on edge appliances.
تجویز کردہ
Test & Measurement Instruments
Handheld oscilloscopes, protocol analyzers, and bench-top data loggers rely on the EP4CE75F23C7 to capture and pre-process high-speed signals before forwarding them to a host MCU. Its 75K LEs implement state machines for triggering, decoders for I2C/SPI/UART/CAN, and FIFOs for deep sample storage. With 292 I/Os the device directly interfaces with multi-channel ADC/DAC front ends, and its 1.2 V low-power operation suits battery-powered field instruments.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP4CE75F23C7 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP4CE75F23C8N | EP4CE75F23C6N | EP4CE115F23I7N | EP4CE115F23C8N | EP4CE55F23C7N | EP4CE40F23C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-484 (23x23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 114,480 | 114,480 | 55,856 | 39,600 |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 | 3,981,312 | 2,340,000 | 1,161,216 |
| Embedded 18x18 Multipliers | 244 | 244 | 244 | 266 | 266 | 156 | 116 |
| Maximum User I/O | 292 | 292 | 292 | 283 | 283 | 374 | 332 |
| Speed Grade | C7 (fastest commercial) | C8 | C6 | I7 (industrial) | C8 | C7 | C7 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
اہم امتیازی خصوصیات
- Highest LE density in F23 footprint with C7 commercial speed grade (بمقابلہEP4CE55F23C7N)
- Largest M9K memory count in the C7 commercial grade (بمقابلہEP4CE75F23C8N)
- Industrial-temperature down-compatibility (بمقابلہEP4CE115F23I7N)
ڈیزائن نوٹس
The EP4CE75F23C7 requires a stable 1.2 V core rail (VCCINT tolerance 1.16 V to 1.24 V) and per-bank VCCIO rails at 1.5/1.8/2.5/3.0/3.3 V. Place a 0.1 uF + 1 uF + 10 uF decoupling network on every VCCINT pin pair and a 10 uF bulk near the regulator. Estimate: for a fully utilized 75K-LE design with 50 percent toggle rate, the core current can exceed 1 A; select a switching regulator with at least 1.5 A headroom.
Route the FBGA-484 at 1.0 mm pitch on an 8-layer stack-up with continuous GND and VCCINT planes on layers 2 and 7, signal layers on the outer stack. Use microvia-in-pad for clean escape routing under each ball. Stagger fan-outs and avoid routing signal traces between BGA balls without a GND return via adjacent to the switching current path.
Do not mix LVDS and 3.3 V LVCMOS in the same I/O bank; configure each bank's VCCIO to match the dominant I/O standard. Watch out for MSEL pin strapping during board bring-up - incorrect MSEL values leave the FPGA unable to load configuration data. Always hold nCE low and nCONFIG high during power ramp until all rails reach regulation.
Estimated: at full logic utilization (75K LEs, 50 percent toggle, 1.2 V core), the device dissipates around 1.5 to 2 W. The FBGA-484 has a theta_JB of about 4 C/W; with a standard JEDEC 4-layer test board, theta_JA lands near 19 C/W, giving a junction-to-ambient rise of roughly 30 to 40 C above ambient. Provide thermal vias under the central GND balls for a high-volume PCB design.
تعمیل کی معلومات
RoHS and REACH compliance per Intel Cyclone IV E product page. Not AEC-Q100 qualified - select the I7 industrial variants or dedicated automotive FPGAs for automotive applications.
