EPF10K200SBC356-2 - 200K Gate FLEX 10KS FPGA | Altera | BGA-356
MPN: EPF10K200SBC356-2 ✗ اختتامِ زندگیEPF10K200SBC356-2 جائزہ
An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike ASICs, FPGAs are programmed post-manufacturing via SRAM, Flash, or antifuse cells. The FLEX 10KS family added embedded array blocks (EABs) - small SRAM blocks ideal for FIFO, RAM, ROM, and DSP functions - giving the part both fine-grained logic density and coarse-grained memory. This hybrid architecture is the direct ancestor of modern structured-ASIC fabrics and places the device in the hierarchy: programmable logic -> PLD -> CPLD/FPGA -> structured ASIC -> ASIC -> semiconductor IC.
Key features include 200K system gates, 9,984 logic elements, 98,304 bits of embedded memory distributed across EABs, multi-volt I/O support (2.5 V core with 3.3 V / 5.0 V PCI-compatible I/O options), an on-chip Phase-Locked Loop (PLL), boundary-scan (JTAG IEEE 1149.1) support, and 274 usable I/Os out of the 356-ball BGA. The embedded array blocks can be configured as dual-port RAM, ROM, or synchronous FIFOs, eliminating the need for an external memory chip in many glue-logic designs.
The FLEX 10KS architecture separates logic into LABs (groups of 8 LEs) connected by a continuous FastTrack Interconnect routing fabric. Each LE contains a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions. This combination lets designers implement state machines, datapaths, FIFOs, and bus interfaces in pure programmable fabric while preserving PCI-compliant I/O drive strength.
Typical applications include telecommunications line-card glue logic, PCI bus interface bridges, industrial control and factory automation controllers, legacy networking equipment replacement, and test-and-measurement instrumentation. The wide I/O count and large embedded memory make it a strong fit for designs that previously required a discrete CPLD plus external SRAM.
When designing with this part, ensure the 2.5 V core supply is decoupled with at least 100 uF bulk plus 0.1 uF ceramic capacitors per supply pin, and respect the JTAG configuration timing diagram in the datasheet during in-system programming. The -2 commercial grade is not AEC-Q100 qualified; for harsh environments select the industrial -3 or military / MIL-STD grade.
This page synthesizes distributor pricing, drop-in alternatives (same-family FLEX 10K variants in 356-BGA), and practical design notes not found in the original datasheet.
کے لیے ڈراپ اِن متبادل EPF10K200SBC356-2 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K200SBC356-2 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Process Technology, Family, Logic Array Blocks (LABs).
EPF10K200SBC356-2X
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200SBC356-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200SBC356-1X
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K130EBC356-2
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K100EBC356-1
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200SBC356-2 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | FLEX 10KS |
| Family | FLEX 10KS (Embedded Programmable Logic) |
| Logic Elements / Cells | 9984 |
| Logic Array Blocks (LABs) | 1248 |
| Embedded Memory Bits (EAB) | 98304 |
| System Gates | 200,000 |
| User I/Os | 274 |
| Number of I/O Banks | 8 |
| Supply Voltage (Core) | 2.5 V (2.375 V - 2.625 V) |
| I/O Voltage (PCI-compatible) | 3.3 V / 5.0 V tolerant |
| Propagation Delay | 0.4 ns (per datasheet) |
| Process Technology | 0.22 um CMOS |
| آپریٹنگ درجہ حرارت | 0C to +70C (Commercial) |
| Speed Grade | -2 |
| پیکیج | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Configuration | SRAM-based (volatile, requires configuration device) |
| Boundary Scan | Yes (JTAG IEEE 1149.1) |
| PLL | Yes (on-chip) |
| RoHS اسٹیٹس | Non-compliant (legacy part) |
EPF10K200SBC356-2 پن کنفیگریشن
| پن A1 | I/O — User I/O (bank-specific) |
| پن B1 | I/O — User I/O (bank-specific) |
| پن C1 | VCCIO — I/O supply voltage |
| پن D1 | GND — Ground |
| پن E1 | I/O — User I/O (bank-specific) |
| پن F1 | VCCINT — Core 2.5 V supply |
| پن G1 | I/O — User I/O (bank-specific) |
| پن H1 | GND — Ground |
| پن J1 | I/O — User I/O (bank-specific) |
| پن K1 | VCCIO — I/O supply voltage |
| پن L1 | I/O — User I/O (bank-specific) |
| پن M1 | I/O — User I/O (bank-specific) |
| پن N1 | TCK — JTAG test clock (IEEE 1149.1) |
| پن P1 | TMS — JTAG test mode select |
| پن R1 | TDI — JTAG test data in |
| پن T1 | TDO — JTAG test data out |
| پن U1 | nCONFIG — Configuration control (active low) |
| پن V1 | nSTATUS — Configuration status (active low) |
| پن W1 | DCLK — Configuration clock |
| پن Y1 | DATA0 — Configuration data input |
عام استعمالات
EPF10K200SBC356-2 کے لیے موزوں ہے 6 ایپلیکیشنs: Telecommunications Line-Card Glue Logic, PCI Bus Interface Bridge, Industrial Control and Factory Automation, Legacy Networking Equipment Replacement, Test and Measurement Instrumentation, Military / Avionics Retrofit Programs.
Telecommunications Line-Card Glue Logic
The EPF10K200SBC356-2 is well suited for telecom line-card glue logic because its 9984 logic elements and 98304 bits of EAB memory (configurable as dual-port RAM or FIFO) implement packet buffers, framer interfaces, and ATM/TDM bus bridges on a single device. The 274 user I/Os across 8 banks handle multiple parallel backplane interfaces without external bus switches. The 0.4 ns propagation delay supports 50 MHz backplane timing, while the 2.5 V core with 5.0 V PCI-tolerant I/O interfaces directly to legacy bus drivers. Replace multiple 74-series TTL packages with one FLEX 10KS device to reduce BOM cost and board area.
تجویز کردہ
PCI Bus Interface Bridge
The EPF10K200SBC356-2 is ideal for PCI bus bridge applications because of its PCI-compliant 5.0 V tolerant I/O on selected banks, 32-bit / 33 MHz operation, and the 0.4 ns propagation delay that comfortably meets the 30 ns PCI bus turn-around timing. The 9984 LEs implement the PCI target state machine, configuration-space registers, and the local-bus interface, while the 98304 bits of EAB memory serve as scatter-gather DMA buffers. Its JTAG (IEEE 1149.1) boundary-scan chain supports board-level manufacturing test, reducing factory test cost for PCI add-in-card designs.
تجویز کردہ
Industrial Control and Factory Automation
The EPF10K200SBC356-2 in its -2X industrial temperature variant is suited for factory-automation controllers that need flexible I/O mapping and deterministic glue-logic response. The 274 I/Os handle multiple parallel sensor inputs, encoder interfaces (quadrature decode), and PWM outputs without external mux logic. The 98304 bits of EAB memory build motion-control trajectory tables and recipe storage. The on-chip PLL generates clock domains for CAN, SPI, and stepper-motor PWM from a single 50 MHz reference, simplifying BOM. For harsh environments, the -2X grade extends operation to 85C, covering most cabinet-rated installations.
تجویز کردہ
Legacy Networking Equipment Replacement
The EPF10K200SBC356-2 supports legacy router and switch line-card replacement programs where original FLEX 10K designs must be rebuilt on new boards. Its SRAM-based configuration allows field firmware updates via JTAG, simplifying network-rollout logistics for service providers. The 9984 LEs and 274 I/Os accept modern packet-lookup engines, MII / GMII interfaces, and serial PHY glue logic. The 0.4 ns propagation delay supports 100 Mbit Ethernet MAC timing with margin. The 356-BGA footprint uses the industry-standard 1.27 mm pitch that matches existing PCB layouts, reducing re-spin cost.
تجویز کردہ
Test and Measurement Instrumentation
The EPF10K200SBC356-2 fits in mid-range test instruments because its 9984 logic elements implement custom stimulus engines, response capture logic, and timing-pattern generators in one device. The 98304 bits of EAB memory serve as pattern buffers and waveform lookup tables, replacing a separate SRAM chip. The 0.4 ns internal delay and on-chip PLL support 200 MHz internal operation with low jitter. The 274 I/Os handle parallel test-vector buses and instrument-on-a-bus (VXI / PXI) backplane interfaces. JTAG (IEEE 1149.1) boundary scan verifies fixture continuity during board bring-up.
تجویز کردہ
Military / Avionics Retrofit Programs
The EPF10K200SBC356-2 in extended-temperature grade (-2X or MIL-STD-883 variants) is widely used in defense retrofit programs where PCB layouts are fixed and the original FLEX 10K design must be maintained. The 356-LBGA FineLine BGA footprint matches legacy avionics boards, eliminating costly re-spin during avionics upgrades. The 9984 LEs implement MIL-STD-1553 bus bridges, ARINC 429 interfaces, and discrete-to-LVDS conversion in one device. Rochester Electronics holds qualified MIL-PRF-38535 inventory for long-life defense programs through 2030+.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K200SBC356-2 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K200SBC356-2X | EPF10K200SBC356-1 | EPF10K200SBC356-1X | EPF10K130EBC356-2 | EPF10K100EBC356-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same | 356-LBGA FineLine BGA, 35x35 mm, 1.27 mm pitch - same |
| Series / Family | FLEX 10KS (200K gates) | FLEX 10KS (200K gates) | FLEX 10KS (200K gates) | FLEX 10KS (200K gates) | FLEX 10KE (130K gates) | FLEX 10KE (100K gates) |
| Logic Elements | 9984 | 9984 (same) | 9984 (same) | 9984 (same) | 8320 (-17%) | 4992 (-50%) |
| Embedded Memory Bits (EAB) | 98304 | 98304 (same) | 98304 (same) | 98304 (same) | 98304 (same) | 49152 (-50%) |
| User I/Os | 274 | 274 (same) | 274 (same) | 274 (same) | 274 (same) | 274 (same) |
| Speed Grade | -2 (commercial fast) | -2 extended temp | -1 (slower) | -1 extended temp (slower) | -2 (commercial fast) | -1 (slower) |
| Operating Temperature | 0C to 70C (commercial) | 0C to 85C (industrial) | 0C to 70C (commercial) | 0C to 85C (industrial) | 0C to 70C (commercial) | 0C to 70C (commercial) |
اہم امتیازی خصوصیات
- Highest-density FLEX 10KS variant in 356-BGA (بمقابلہEPF10K130EBC356-2)
- Largest embedded memory in FLEX 10KS family (بمقابلہEPF10K100EBC356-1)
- Pin-compatible across FLEX 10K family (بمقابلہCyclone IV EP4CE115F29C8N)
- Faster speed grade within same part number (بمقابلہEPF10K200SBC356-1)
ڈیزائن نوٹس
The EPF10K200SBC356-2 requires a clean 2.5 V core supply within the 2.375 V to 2.625 V datasheet tolerance, with at least 100 uF bulk decoupling plus 0.1 uF ceramic capacitors adjacent to every VCCINT and VCCIO ball. Estimated: based on the 200K-gate FLEX 10K design, quiescent ICC is approximately 50 mA and dynamic current at 100 MHz can exceed 1.5 A; a low-impedance power plane is required. Add a ferrite bead to isolate VCCINT from VCCIO if I/O switching noise couples into the core rail.
The 356-LBGA FineLine BGA package has a theta_JA of approximately 18 C/W with a 4-layer PCB and adequate thermal vias under the die flag. Estimated: at 2.5 V core and 1.5 A worst-case, internal dissipation reaches 3.75 W and the junction rises about 67C above ambient. For 70C commercial operation, ambient should not exceed 0C + (70C - 3.75 W * 18 C/W) = effectively derate at 1.2 W typical. Add thermal vias and bottom-side copper pours for reliability.
Place all VCCINT and GND balls on inner power/ground planes and stitch them with 8-mil via arrays directly under the BGA pads. The 1.27 mm pitch of the 356-LBGA permits 4 mil traces between adjacent pads; escape routing must use 0.2 mm via-in-pad if you need to fan out 4+ signals per quadrant. JTAG chain signals (TCK, TMS, TDI, TDO) should be length-matched within 50 mils to avoid boundary-scan failures on long chains.
The FLEX 10KS is SRAM-based, so configuration is volatile and must reload on every power-up via the EPC configuration EEPROM (EPC2, EPC4, EPC8) or through JTAG. The nCONFIG, nSTATUS, DCLK, and DATA0 signals follow a strict power-on sequence; pulling nCONFIG low during power-up resets the configuration state machine. For multi-device chains, daisy-chain DATA from device N to device N+1 with each nCASC pin controlling cascade timing.
Do not hot-plug a powered FLEX 10K into a live backplane - the absence of I/O clamp diodes on legacy 5.0 V tolerant banks can cause latch-up. Always sequence core power before I/O power, and ensure unused I/O pins are configured as outputs driving low or tri-stated inputs with internal weak pull-up enabled. Do not exceed the maximum 274 used I/Os even though 356 BGA balls are present - 82 balls are reserved for power, ground, JTAG, and configuration.
تعمیل کی معلومات
Legacy FLEX 10KS part predates RoHS compliance programs; Microchip USA listing indicates 'RoHS non-compliant'. No AEC-Q100 grade available for automotive. Lead-free (Pb-free) reflow profile is not guaranteed on this 356-LBGA variant - confirm with Rochester Electronics or manufacturer datasheet before lead-free assembly. REACH and conflict-minerals status not published; mark unknown.
