M2GL050-FG896 - 56K IGLOO2 FPGA | Microchip Technology
MPN: M2GL050-FG896 ✓ فعالM2GL050-FG896 جائزہ
An FPGA is a reconfigurable digital integrated circuit whose interconnect and logic blocks can be programmed after manufacture. Within the programmable-logic hierarchy, an FPGA sits above fixed-function logic devices and below application-specific programmable systems. The M2GL050 belongs to Microchip's IGLOO2 family, a flash-based FPGA architecture intended to provide nonvolatile configuration and general-purpose programmable logic without an external configuration PROM.
The verified product information identifies the M2GL050-FG896 as a 56,340-cell IGLOO2 device in an 896-pin FBGA package. The IGLOO2 family includes devices ranging from 5,000 to 150,000 logic cells, allowing designers to select a device according to logic capacity, I/O count, package, speed grade, and temperature grade. The target ordering code uses the FG896 package designation, while related M2GL050 order codes identify different temperature or speed options.
IGLOO2 devices use embedded flash to retain the programmed configuration. This architecture supports field updates and eliminates a separate serial configuration memory in designs that use the device's native configuration features. The wide package pin count also supports numerous user I/Os, but exact I/O counts, voltage standards, differential capabilities, and bank restrictions must be selected from the device's pin-description document for the specific package and bank.
Typical uses include communications infrastructure, industrial control, medical equipment, defense systems, video and image processing, storage interfaces, and embedded control planes. The 56,340-cell M2GL050 is particularly useful when a design needs substantially more parallel logic and I/O than small FPGAs provide, while retaining the simplicity of a single-package programmable solution.
Design planning should begin with the complete M2GL050 pin-description document, because FG896 package assignments and bank features are device-specific. Designers should also verify voltage-tolerance rules, configuration pins, clock resources, differential-pair constraints, decoupling requirements, thermal performance, and the exact supported I/O standards before committing the 896-ball layout to production.
This page combines the verified 56,340-cell, 1.2 V, 896-pin FBGA characteristics with procurement data, ordered replacement candidates, and practical migration guidance. It is intended to help engineers distinguish genuine package-compatible order codes from broader M2GL050 devices that require a different footprint and therefore are not drop-in replacements.
کے لیے ڈراپ اِن متبادل M2GL050-FG896 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
M2GL050-FG896I
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
M2GL050-1FG896
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
M2GL050-FGG896
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
M2GL050-1FG896I
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
M2GL050-1FGG896
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
M2GL050-FG896 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Device Type | IGLOO2 flash field-programmable gate array (FPGA) |
| Logic Cells | 56,340 cells |
| Core Supply Voltage | 1.2 V |
| پیکیج | 896-pin FBGA |
| ماؤنٹنگ ٹائپ | Surface mount |
| Configuration Memory | Embedded flash |
| RoHS اسٹیٹس | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
M2GL050-FG896 896-pin fbga پن کنفیگریشن گائیڈ
M2GL050-FG896 (896-pin fbga پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں M2GL050-FG896.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
M2GL050-FG896 کے لیے موزوں ہے 6 ایپلیکیشنs: Communications Control Plane, Industrial Control and Automation, Medical Monitoring Equipment, Secure Connectivity and Data Encryption, Video and Image Processing, Storage and Interface Conversion.
Communications Control Plane
The M2GL050-FG896 fits communications control-plane logic because its verified 56,340 logic cells and 896-pin FBGA provide substantial parallel processing and I/O capacity in one package. A designer can consolidate protocol state machines, packet-format conversion, status aggregation, and interface bridging rather than distributing basic control functions across several smaller devices. The 1.2 V core supply also supports a partitioned power architecture in systems that require multiple voltage rails. Before schematic capture, engineers should use DS0124 to confirm the available user I/O, clock resources, bank voltages, and configuration pins for the 896-ball assignment. The verified information does not specify the maximum clock, supported I/O standards, or bank-level voltage matrix, so those values must be taken directly from the official IGLOO2 documentation before selecting pin-muxing options.
تجویز کردہ
Industrial Control and Automation
The M2GL050-FG896 is suitable for industrial control logic requiring deterministic programmable functions and a high-density package option. Its 56,340 logic cells can support multiple parallel state machines, sensor-conditioning control, actuator sequencing, diagnostics, and communication adapters, while the 896-pin FBGA offers many physical I/O options for modular backplanes. The base M2GL050-FG896 ordering code should not be assumed to cover the complete system temperature range; an industrial-grade ordering code such as M2GL050-FG896I may be required. Engineers should confirm temperature limits, operating-voltage tolerances, clock accuracy, and supported I/O standards in the manufacturer data sheet. They should also reserve suitable power and ground balls and follow the package-specific layout guidance when planning a high-pin-count board.
تجویز کردہ
Medical Monitoring Equipment
The M2GL050-FG896 can serve as a programmable control and data-handling device in medical monitoring equipment when its verified logic, I/O, and configuration characteristics satisfy the design requirements. Potential functions include sensor data routing, alarm prioritization, waveform-buffer control, patient-interface management, and supervisory logic. The IGLOO2 family's embedded flash configuration supports field-programmable updates, which can simplify product revision and maintenance workflows. Medical use also requires documented electrical-safety, EMC, and quality-process evaluations at the finished-system level; none of those product-level approvals is established by the verified device data. Before release, engineers should verify temperature grade, I/O tolerances, clock performance, and any application-specific certification obligations. The device should not be treated as automatically qualified for medical use without those separate reviews.
تجویز کردہ
Secure Connectivity and Data Encryption
The M2GL050-FG896 is appropriate for secure-connectivity functions that combine protocol handling, buffering, and hardware-assisted control logic. Its 56,340-cell capacity allows designers to implement multiple packet-processing paths, command parsers, buffering logic, and accessory interfaces within one programmable device. Flash-based configuration means the programmed logic is retained without a separate serial configuration memory when the supported configuration flow is used. Designers should not infer certified cryptographic performance from the family description alone; algorithm throughput, entropy sources, key storage, side-channel resistance, and certification requirements require separate review. The verified material also does not identify the M2GL050-FG896's RAM capacity or maximum frequency, so security processing rates and interface timing must be calculated from the complete manufacturer data sheet and selected clocking plan before committing to the design.
تجویز کردہ
Video and Image Processing
The M2GL050-FG896 provides enough verified logic density for parallel video or image-processing control blocks when the required clock rate and memory bandwidth are confirmed. Candidate tasks include pixel-format conversion, timing generation, capture-interface control, frame-buffer address management, and overlay or display sequencing. The 896-pin FBGA offers extensive pin assignment options, which is useful when several parallel buses and control signals must coexist. However, the number of user I/Os, embedded block RAM, multipliers, and maximum fabric frequency are not included in the verified excerpts. Consequently, engineers should create an architectural resource estimate using the official M2GL050 data sheet, then check DS0124 for FG896 bank restrictions. The 1.2 V core does not determine the external interface voltage; each selected I/O bank must be checked separately.
تجویز کردہ
Storage and Interface Conversion
The M2GL050-FG896 can consolidate storage-interface bridging and legacy-to-modern protocol conversion in industrial and embedded systems. The verified 56,340 logic cells are suitable for command translation, state tracking, FIFO control, arbitration, and supervisory logic, while the 896-pin package offers many candidate user-I/O assignments. A practical implementation should isolate the relevant bank voltage requirements, define clock-domain crossing behavior, and preserve configuration pins required for programming. Because the verified excerpts do not state block-RAM capacity, I/O standard coverage, SerDes availability in each bank, or maximum frequency, those figures must not be inferred from the package size. Engineers should compare the complete pin table and device resources before using this package for a high-speed storage interface, particularly where a nonvolatile protocol bridge could otherwise be implemented more simply.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا M2GL050-FG896 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | M2GL050-FG896I | M2GL050-1FG896 | M2GL050-FGG896 | M2GL050-1FG896I | M2GL050-1FGG896 |
|---|---|---|---|---|---|---|
| Package | 896-pin FBGA | 896-pin FBGA - same footprint | 896-pin FBGA - same footprint | 896-pin FBGA - same footprint | 896-pin FBGA - same footprint | 896-pin FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Device Family | IGLOO2 flash FPGA | IGLOO2 flash FPGA | IGLOO2 flash FPGA | IGLOO2 flash FPGA | IGLOO2 flash FPGA | IGLOO2 flash FPGA |
| Logic Cells | 56,340 cells | 56,340 cells | 56,340 cells | 56,340 cells | 56,340 cells | 56,340 cells |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Configuration Memory | Embedded flash | Embedded flash | Embedded flash | Embedded flash | Embedded flash | Embedded flash |
اہم امتیازی خصوصیات
- High verified logic density in the 896-pin package (بمقابلہM2GL010-FG484)
- Flash-based configuration (بمقابلہM2GL050-1FG896)
- Industrial-grade ordering option on the same footprint (بمقابلہM2GL050-FG896)
- Package-compatible migration within a common design platform (بمقابلہM2GL025-VF256)
ڈیزائن نوٹس
Treat the 896-pin FBGA as a high-density layout rather than as a conventional peripheral package. Place the device on a multilayer PCB with short, directly referenced power and ground connections, and follow Microchip's package-specific land pattern and via recommendations. Decoupling capacitors should be placed at the appropriate power balls with minimal trace length. Do not infer ball assignments from the package drawing alone; use DS0124 and the selected design's pin constraints to prevent conflicts between configuration, clocks, user I/O, and dedicated functions.
Assign I/O banks by voltage before finalizing signal routing. The verified excerpts confirm that M2GL050-FG896 has bank-specific SerDes restrictions, including unavailable SerDes resources in banks 6 and 9, and that some documented pins cannot be configured differentially. These constraints make it unsafe to design around every package ball as a general differential I/O. Run the final pin assignment through the Microchip implementation tool and review every selected bank against DS0124.
Do not substitute an M2GL050 device merely because it has the same number of logic cells. M2GL050 variants in VF256, VF400, TQ144, and FG484 packages require different PCB land patterns and are not drop-in replacements for FG896. Likewise, speed, temperature, and ordering-code variants may alter electrical ratings even when they use the same footprint. Confirm the complete MPN, grade, package revision, datasheet status, and pin table before releasing a substitution for production.
The verified 1.2 V figure is the core supply, not permission to apply 1.2 V to every I/O bank. Design distinct power rails for the core and selected I/O standards, and verify each bank's allowed input voltage, output voltage, and configuration behavior against the manufacturer data sheet. Use the device's recommended power-up and power-down sequencing. Because the verified data does not include current limits, settling times, or bank-voltage matrices, obtain those values from the official data sheet before calculating rail budgets.
Estimate board-level thermal performance from actual utilization rather than from the 896-ball package size alone. The verified data does not provide junction temperature, package thermal resistance, or power consumption, so a numerical heat-rise calculation would be unsupported. Engineers should use the manufacturer's power estimator and package thermal model with the expected logic activity, then evaluate copper area, layer count, airflow, and adjacent heat sources. Consider a less dense package only if its complete pin and I/O requirements remain satisfied.
تعمیل کی معلومات
The supplied product-page and distributor excerpts do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred from the manufacturer or package family.
