MPC859TZP133A - PowerQUICC 133MHz MPU 32-Bit | NXP | 357-BGA
MPN: MPC859TZP133A ✗ اختتامِ زندگیMPC859TZP133A جائزہ
An MPU/MPMC (Microprocessor Unit) is the central processing element of an embedded computing system, executing instructions, managing memory, and orchestrating peripherals. The PowerQUICC family sits in the hierarchical taxonomy of: MPU -> embedded processor -> microprocessor -> integrated circuit. The MPC859T specifically integrates a PowerPC core with on-chip communications peripherals (SCCs, SMCs, FCCs), eliminating the need for external communication chipsets.
Key features include 133MHz core clock speed, 32-bit RISC architecture, integrated communications controller block with multiple serial channels, 0.18um CMOS process technology, and an operating temperature range of 0C to +95C. The 357-ball PBGA package provides high-density interconnect for the extensive peripheral set while maintaining manageable PCB routing. The device operates on 3.3V I/O with an internal 1.8V core.
Architecturally, the MPC859TZP133A combines a PowerPC 603e-class core with the CPM (Communications Processor Module), enabling offloading of serial protocol handling from the main CPU. This heterogeneous structure is particularly efficient for telecom and networking workloads where serial I/O dominates. The integrated memory controller supports DRAM, SRAM, and flash, while the system interface includes PCI.
Typical applications include WAN routers, DSLAM line cards, telecom switching equipment, industrial control with networking, and legacy serial-protocol aggregation platforms. The wide peripheral integration makes it suitable for compact designs where multiple communication channels are required.
When designing with the MPC859TZP133A, ensure proper power-supply sequencing (3.3V before 1.8V, or simultaneously) and adequate decoupling on both rails. The BGA package requires X-ray inspection or careful reflow profiling; pad design must follow NXP's design guide to avoid solder voids under the 1.0mm pitch balls.
This page synthesizes distributor pricing (as of 2026-10-16), lifecycle insight, drop-in alternatives within the MPC8xx family, and practical design notes not typically aggregated on a single manufacturer product page.
کے لیے ڈراپ اِن متبادل MPC859TZP133A — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MPC859TZP133A (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, RoHS Status, Lead Free Status, Number of Cores, Mounting Type.
MPC859TZP100A
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC859TZP80A
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC857TZP133A
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MPC866TZP133A
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC859PZP133A
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MPC859TZP133A زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | PowerPC Power Architecture, 32-Bit RISC |
| Operating Frequency | 133 MHz |
| Core Process Technology | 0.18 um CMOS |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Number of Cores | 1 |
| پیکیج / کیس | 357-BBGA (PBGA 25x25 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| آپریٹنگ درجہ حرارت | 0C to +95C |
| Lead Free Status | Contains Lead (per DigiChip listing) |
| RoHS اسٹیٹس | Non-Compliant (per DigiChip listing, datasheet legacy) |
| Packaging | Tray |
| Peripheral Highlights | CPM (Communications Processor Module), SCCs, FCCs, PCI interface, memory controller |
| Series / Family | MPC859T - Quad Integrated Communications Controller (PowerQUICC I) |
MPC859TZP133A 357-bbga (pbga 25x25 mm) پن کنفیگریشن گائیڈ
MPC859TZP133A (357-bbga (pbga 25x25 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں MPC859TZP133A.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
MPC859TZP133A کے لیے موزوں ہے 6 ایپلیکیشنs: WAN Router Control Plane, DSLAM Line Card Controller, Industrial Ethernet Gateway, TDM Cross-Connect / Channel Bank, Protocol Aggregation Embedded Board, Legacy Telecom Switching Equipment.
WAN Router Control Plane
The MPC859TZP133A's 133MHz PowerPC core combined with the CPM's multi-channel serial offload engine makes it well suited for WAN router control-plane processing where multiple T1/E1, HDLC, and Ethernet ports converge. Per the PowerQUICC datasheet, the integrated FCCs and SCCs can run HDLC/PPP framing, ATM AAL5 segmentation, and 10/100 Ethernet MAC concurrently without loading the CPU. Compared to a discrete MPU + external serial controller architecture, this single-chip integration reduces PCB footprint, BOM, and power at the cost of using a legacy part that requires careful long-term supply planning.
تجویز کردہ
DSLAM Line Card Controller
DSLAM line cards aggregate multiple DSL modem channels over ATM or Ethernet uplinks, and the MPC859TZP133A's CPM can drive both ATM SAR functions and multi-port HDLC aggregation in the same device. Operating from 3.3V I/O and 1.8V core with 0C to +95C temperature range, it sits comfortably in typical central-office line-card thermal envelopes. The integrated PCI interface enables connection to framer/line-driver companions such as discrete transceivers, allowing channelized line cards without an external northbridge.
تجویز کردہ
Industrial Ethernet Gateway
In industrial Ethernet gateways that bridge legacy serial fieldbuses (RS-232/485, Modbus RTU) to Ethernet/IP, the MPC859TZP133A offers a balance of deterministic serial handling via the CPM and Ethernet MAC support. The 133MHz PowerPC core can host a real-time or Linux-based protocol stack while the CPM handles serial-channel DMA and HDLC framing. Compared to a Cortex-M based gateway, this part delivers substantially more serial bandwidth at the cost of power consumption, but remains valuable for long-life industrial designs where stable software is already deployed.
تجویز کردہ
TDM Cross-Connect / Channel Bank
Legacy TDM cross-connect systems in carrier networks rely on multi-channel T1/E1 grooming, which maps directly to the MPC859TZP133A's serial-channel controllers. The CPM microcode performs time-slot cross-connection without CPU intervention, allowing the PowerPC core to handle system-level management. Per NXP's PowerQUICC marketing materials, this part family powered a generation of PBX and channel-bank equipment. A drop-in replacement from the same family (e.g., MPC866TZP133A) allows capacity scaling within the same 357-PBGA footprint.
تجویز کردہ
Protocol Aggregation Embedded Board
Compact COM/SOM style boards that aggregate multiple serial protocols (USB, RS-232/485, Ethernet) onto a single Ethernet uplink benefit from the MPC859TZP133A's CPM-driven multi-channel architecture. With 32-bit PowerPC core plus on-chip peripherals, a Linux/RTOS image can provide protocol translation while the CPM handles inbound serial framing in hardware. For new designs, NXP recommends QorIQ successors; for legacy maintenance and proven designs, the MPC859T family remains supported via NXP's long-term supply program and authorized brokers.
تجویز کردہ
Legacy Telecom Switching Equipment
In legacy Class-5 switches and digital cross-connect equipment still in service, the MPC859TZP133A serves as a control processor with associated serial interfaces. The 357-BBGA 25x25mm footprint is mature on long-lifecycle telecom PCBs, and the part is qualified to 0C-95C industrial-grade operating range. Replacement designs that want to extend field life use NXP's long-term purchase agreements or migrate to PowerQUICC II/QorIQ siblings that fit a software-defined porting path. This makes the MPC859T a strategic bridge component during network-function virtualization (NFV) transitions.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا MPC859TZP133A — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | MPC859TZP100A | MPC859TZP80A | MPC857TZP133A | MPC866TZP133A | MPC859PZP133A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Frequency | 133 MHz | 100 MHz | 80 MHz | 133 MHz | 133 MHz | 133 MHz |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| CPM Configuration | MPC859T Quad Integrated Comm Controller | MPC859T same CPM | MPC859T same CPM | MPC857T - reduced CPM channels | MPC866T - similar CPM, slight peripheral mix | MPC859T same CPM, screening code variant |
| Family | PowerQUICC I | PowerQUICC I | PowerQUICC I | PowerQUICC I | PowerQUICC I | PowerQUICC I |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
| Architecture | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC | 32-bit PowerPC |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Pin Count | 357-ball PBGA | 357-ball PBGA | 357-ball PBGA | 357-ball PBGA | 357-ball PBGA | 357-ball PBGA |
اہم امتیازی خصوصیات
- Drop-in scalability within the same 357-PBGA footprint (بمقابلہMPC859TZP100A)
- Higher CPM channel count than the reduced sibling (بمقابلہMPC857TZP133A)
ڈیزائن نوٹس
The MPC859TZP133A requires coordinated 3.3V I/O and 1.8V core rail power-up sequencing (or simultaneous ramp) to prevent internal bus contention. Per the datasheet DC electrical characteristics, the 1.8V supply must be stable before clock input CLKIN is driven; a violation can latch the device into an undefined state requiring full power-cycle reset. Decoupling requires a minimum of 12x 0.1uF X7R ceramic capacitors plus 4x 10uF bulk caps on each rail, placed within 5mm of each ball pair. Estimated: based on standard 357-PBGA power distribution, more decoupling may be required if the user places a multi-layer board with dedicated power/ground planes.
The 357-BBGA package at 1.0mm ball pitch requires 4-layer or higher PCB stackup with matched 50-ohm controlled-impedance routing for the 32-bit memory bus. Vias-in-pad (VIPPO) or dog-bone fanout is recommended with microvia-in-pad preferred for the inner-row balls. NXP's PowerQUICC design guide specifies minimum pad-to-trace clearance of 0.2mm and via-to-pad pitch of 0.5mm. Solder paste stencil should be laser-cut with 0.4mm aperture (4-mil) and 0.075mm stencil thickness for the BGA pads. X-ray or AOI inspection is mandatory post-reflow - the 1.0mm pitch obscures visual inspection of inner solder joints.
Common pitfalls when designing with the MPC859TZP133A include: (1) using non-DDR-aware memory timings - the UPM and GPCM machines have specific register programming sequences; (2) failing to configure the CPM microcode before bringing up serial channels; (3) leaving the JTAG pins floating on production boards (they should be pulled to known states); (4) ignoring the maximum junction temperature of 105C and running at full 133MHz in poorly ventilated enclosures. Always download the latest NXP errata document and check against your silicon revision mask before locking the PCB layout.
تعمیل کی معلومات
Per DigiChip listing, the MPC859TZP133A contains lead and is RoHS non-compliant. The part is not AEC-Q100 qualified (industrial/telecom market, not automotive). REACH and halogen status not stated explicitly in available data; marked unknown.
