AMD

XC3S400-4FTG256C - 400K Gate Spartan-3 FPGA | AMD | 256-LBGA

MPN: XC3S400-4FTG256C ✗ اختتامِ زندگی
1.2 V Vdss 256-LBGA Package
MOQ: 1 |

XC3S400-4FTG256C جائزہ

The AMD XC3S400-4FTG256C is a Spartan-3 field-programmable gate array FPGA with 400,000 system gates, 8,064 logic cells, and a 256-LBGA package. It operates from a 1.2 V core supply and is specified for a 0 to 85 °C commercial operating-temperature range. The device combines programmable logic, block RAM, dedicated input/output resources, and configurable interconnect resources in a single integrated circuit.

A field-programmable gate array is a digital semiconductor whose logic functions are established after fabrication by loading a configuration bitstream. FPGAs sit within the broader programmable-logic hierarchy, alongside CPLDs, and are used when parallel hardware processing, high logic density, configurable interfaces, or design revision flexibility are more important than the simplicity of a fixed-function ASIC. The Spartan-3 architecture is intended for embedded systems requiring moderate logic capacity without the cost and complexity of the largest FPGA families.

The XC3S400-4FTG256C provides 8,064 logic cells and 294,912 system gates according to the manufacturer-related product listing. Its 256-LBGA package supports dense board integration, while the 1.2 V supply specification identifies it as a 1.2 V FPGA. The exact device speed grade is encoded by the -4 designation, and the FTG256 package, commercial temperature option, and RoHS-oriented lead-free construction are reflected in the ordering code.

Typical uses include industrial control, communications infrastructure, instrumentation, video processing, embedded systems, and digital signal-processing front ends. The programmable architecture allows parallel datapaths, custom interface logic, protocol handling, and control functions to be consolidated into one device. Designers should verify pin-level power, configuration, clock, and differential-I/O requirements against the Spartan-3 family documentation before laying out the PCB.

The most important design tradeoff is package migration. A part with the same logic-cell count but a different package cannot be assumed to be a drop-in replacement. When replacing the XC3S400-4FTG256C, confirm the exact FTG256 footprint, ball assignment, speed grade, temperature range, supply architecture, configuration interface, and high-speed I/O requirements. For new designs, the I/O count and selected package should be checked against the intended board outline and escape-routing strategy.

This page combines the key ordering information for the XC3S400-4FTG256C with package-aware replacement guidance, comparison parameters, and practical design considerations. It is intended to help engineers identify whether a candidate is electrically and mechanically suitable before committing to a PCB or production BOM.

کے لیے ڈراپ اِن متبادل XC3S400-4FTG256C — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں XC3S400-4FTG256C (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف System Gates, Device Type, Logic Cells, Operating Temperature, Package.

AMD
System Gates: 400,000 gates
Device Type: Spartan-3 Field Programmable Gate Array (FPGA) IC
Package: 256-LBGA
موازنہ کریں XC3S400-4FTG256C →
Xilinx
System Gates: 400,000 gates
Device Type: Field Programmable Gate Array (FPGA)
Logic Cells: 8,064 logic cells
موازنہ کریں XC3S400-4FTG256C →
AMD
System Gates: 400,000
Logic Cells: 8,064
Operating Temperature: 0°C to +85°C (commercial)
موازنہ کریں XC3S400-4FTG256C →

XC3S400A-4FTG256C

✅ ڈراپ-اِن
AMD
📦 256-LBGA (FTG256)
Spartan-3A · AMD (Xilinx) · 400,000 · 8,064 · 368,640 · 20 (18 Kbit each) · 195 · 4 (18 × 18-bit signed)

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

XC3S500E-4FTG256C

✅ ڈراپ-اِن
📦 256-LBGA (FTG256)
Logic capacity increases from 8,064 to 10,476 cells, approximately 30% more logic, while retaining the FTG256 package

📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)

XC3S400-4FT256C

✅ ڈراپ-اِن
AMD
📦 256-LBGA (FTG256)
Spartan-3 Field Programmable Gate Array (FPGA) IC · 400,000 gates · 8,064 cells · 173 I/O · 1.2 V · -4 speed grade · Commercial · 256-LBGA

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

XC3S400-4FTG256I

✅ ڈراپ-اِن
📦 256-LBGA (FTG256)
Industrial-temperature suffix replaces the commercial suffix; core device and FTG256 package remain the same family

📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)

XC3S400-4FT256I

✅ ڈراپ-اِن
Xilinx
📦 256-LBGA (FTG256)
Field Programmable Gate Array (FPGA) · Spartan-3 · 400,000 gates · 8,064 logic cells · 173 I/Os · 256-ball FTBGA · Lead-free FTBGA · 256 pins

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

XC3S400-4FTG256C زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات

Device Type Spartan-3 Field Programmable Gate Array (FPGA)
System Gates 294,912 gates
Logic Cells 8,064 cells
Architecture Spartan-3
Core Supply Voltage 1.2 V
Package Type 256-LBGA
Package Designation FTG256
Device Number 173
Lead-Free Construction Lead-free
آپریٹنگ درجہ حرارت 0 °C to +85 °C
ماؤنٹنگ ٹائپ Surface Mount
I/O Count 264 I/O
RoHS اسٹیٹس unknown
REACH Status unknown

XC3S400-4FTG256C ftg256 پن کنفیگریشن گائیڈ

XC3S400-4FTG256C (ftg256 پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔

XC3S400-4FTG256C کے لیے ftg256 پیکیج پن آؤٹ ڈایاگرام

کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں XC3S400-4FTG256C.

رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔

عام استعمالات

XC3S400-4FTG256C کے لیے موزوں ہے 6 ایپلیکیشنs: Industrial Control and Automation, Communications Protocol Conversion, Instrumentation and Data Acquisition, Video Timing and Display Control, Embedded System Control Hub, Digital Signal Processing Front End.

🏭

Industrial Control and Automation

The XC3S400-4FTG256C suits compact industrial controllers that require parallel logic, configurable I/O, and deterministic programmable behavior. Its 8,064 logic cells and 264 I/O provide substantial capacity for sequencing, interlocks, machine-state logic, and communication framing without multiple fixed-function controllers. The 1.2 V core supply supports a conventional multi-rail FPGA power architecture. Before deployment, verify the commercial 0 to 85 °C rating against the actual enclosure temperature, and confirm that every high-speed interface has adequate board-level timing margin.

🌐

Communications Protocol Conversion

The Spartan-3 architecture in the XC3S400-4FTG256C can implement parallel protocol conversion, framing, buffering, and interface adaptation in one programmable device. The available 8,064 logic cells support multiple concurrent datapaths when wide buses, lookup functions, and state machines are required, while 264 I/O simplifies connection to external transceivers. The key design consideration is timing closure: external interfaces must be constrained correctly, and the 1.2 V FPGA core rails require stable, decoupled supply delivery for reliable operation.

📡

Instrumentation and Data Acquisition

The XC3S400-4FTG256C can consolidate acquisition control, digital filtering, calibration tables, and test sequencing around a sensor or analog front end. Its 8,064 logic cells are useful for parallel sampling pipelines and fixed-point signal processing, while the 264 I/O support sensors, counters, displays, and control registers. Designers should allocate pins according to the FTG256 package drawing and assess clock jitter and skew against the target sampling rate, because package-level routing and supply integrity can limit system performance.

📺

Video Timing and Display Control

The XC3S400-4FTG256C can be evaluated for pixel timing, character generation, overlay processing, and control-plane logic in embedded video systems. Programmable logic allows horizontal and vertical counters, blanking intervals, and memory interfaces to be implemented in parallel rather than through a microcontroller loop. The 8,064-cell and 264-I/O resources support moderate multi-plane timing functions. Video designs must still verify supported I/O standards, clocking limits, and external memory timing against the specific Spartan-3 performance data.

🖥️

Embedded System Control Hub

The XC3S400-4FTG256C is well suited to an FPGA-centered embedded hub that combines boot control, bus arbitration, watchdog logic, peripheral interfacing, and data routing. Its programmable structure allows hardware behavior to be updated through the configuration bitstream while avoiding a fixed hardware revision for every change. The commercial temperature range makes it appropriate for indoor industrial or commercial equipment. Firmware teams should define configuration memory, startup sequencing, clock sources, and watchdog recovery before finalizing the FPGA implementation.

⚡

Digital Signal Processing Front End

The XC3S400-4FTG256C can implement fixed-point filters, correlators, counters, and parallel data conditioning in hardware. Using 8,064 logic cells, a designer can trade between parallel channels and deeply pipelined sequential logic while using the 264-I/O interface for converters, memories, and test points. Performance depends on a clean clock and careful timing constraints. Use the family documentation to validate the selected speed grade, supported memory interfaces, I/O standards, and maximum operating conditions before sign-off.

تجویز کردہ پروڈکٹس کا خلاصہ

STM32F103ZET6 STMicroelectronics استعمال ہوتا ہے: Industrial Control and Automation LAN8742-CZ-TR Microchip Technology استعمال ہوتا ہے: Industrial Control and Automation, Communications Protocol Conversion ISO1430BDWR Texas Instruments استعمال ہوتا ہے: Industrial Control and Automation MAX3485EESA+T RS-485 interface for industrial communications استعمال ہوتا ہے: Communications Protocol Conversion ISO1410BDWR Texas Instruments استعمال ہوتا ہے: Communications Protocol Conversion MCP3424-E/SL Microchip Technology استعمال ہوتا ہے: Instrumentation and Data Acquisition AD779JN Analog Devices استعمال ہوتا ہے: Instrumentation and Data Acquisition ADS1254E Texas Instruments استعمال ہوتا ہے: Instrumentation and Data Acquisition, Digital Signal Processing Front End OPA132UA Texas Instruments استعمال ہوتا ہے: Video Timing and Display Control NE5534PSR Texas Instruments استعمال ہوتا ہے: Video Timing and Display Control PCF8574DWR Texas Instruments استعمال ہوتا ہے: Video Timing and Display Control STM32F103ZGT6 STMicroelectronics استعمال ہوتا ہے: Embedded System Control Hub W25Q128JVSIQ External configuration or data flash memory استعمال ہوتا ہے: Embedded System Control Hub C8051F311R Silicon Labs استعمال ہوتا ہے: Embedded System Control Hub AD9023AZ Analog Devices استعمال ہوتا ہے: Digital Signal Processing Front End TCXO2000 Stable clock reference for deterministic sampling استعمال ہوتا ہے: Digital Signal Processing Front End
What is the AMD XC3S400-4FTG256C?
The AMD XC3S400-4FTG256C is a Spartan-3 FPGA with 294,912 system gates, 8,064 logic cells, and a 1.2 V core supply in a 256-LBGA package. According to the AMD product listing, the device is identified as a lead-free Spartan-3 field-programmable gate array. The -4 suffix identifies the speed grade, FTG256 identifies the package, and the final C indicates the commercial temperature option.
Where can I download the XC3S400-4FTG256C datasheet PDF?
The XC3S400-4FTG256C datasheet PDF is available through the linked Xilinx datasheet listing and the AMD/Xilinx product documentation. The manufacturer family documentation contains the device ordering table, pin definitions, electrical characteristics, configuration information, and package drawings. Use the exact XC3S400-4FTG256C ordering code when interpreting speed grade, temperature range, and package data.
What are the key specifications of XC3S400-4FTG256C that engineers should know?
The key XC3S400-4FTG256C specifications are 294,912 system gates, 8,064 logic cells, a 1.2 V core supply, a 256-LBGA FTG256 package, and a 0 to 85 °C commercial operating range. The device is a lead-free Spartan-3 FPGA. Before schematic capture, also verify configuration pins, clocking, power rails, differential I/O requirements, and exposed-pad connection from the family documentation.
Is XC3S400-4FTG256C in stock?
Current stock status should be confirmed through the Request a Quote form on this page because availability can change by lot, date code, and order quantity. The XC3S400-4FTG256C is a mature Spartan-3 device, so production planning should include lifecycle confirmation rather than assuming indefinite availability. Quote requests should state the required quantity, packaging preference, and target delivery schedule.
What is the price of XC3S400-4FTG256C?
The current XC3S400-4FTG256C price depends on quantity, inventory, and delivery requirements. Use the Request a Quote form on this page to request a current quotation for the exact 256-LBGA FTG256 device. Include the order quantity, target date, and whether unopened production reels or another permitted delivery format is required.
What is the lead time for XC3S400-4FTG256C?
The current lead time for XC3S400-4FTG256C must be confirmed through the Request a Quote form on this page. Lead time can vary with available inventory, device date code, quantity, and whether the order can be fulfilled from an existing reel. Production planners should request a committed schedule before approving a build that depends on this legacy FPGA.
Where can I buy XC3S400-4FTG256C online?
Use the Request a Quote form on this page to request XC3S400-4FTG256C availability and commercial terms. The exact FTG256 package and commercial temperature suffix should appear in the request so that the quotation matches the intended production BOM. For continuity of supply, specify accepted date codes, inspection requirements, and the required delivery schedule.
What is the difference between XC3S400-4FTG256C and XC3S400A-4FTG256C?
Both devices are listed with 8,064 logic cells in the 256-LBGA FTG256 package, but they belong to different Spartan generations. The XC3S400A-4FTG256C is a Spartan-3A device, while the XC3S400-4FTG256C is the original Spartan-3 device. Verify the complete family data sheet for architecture, I/O, memory, and device-specific differences before using one as a drop-in replacement.
What is the difference between XC3S400-4FTG256C and XC3S400-4FT256C?
The XC3S400-4FTG256C and XC3S400-4FT256C are both listed as 256-LBGA Spartan-3 devices with 8,064 logic cells, but their package-ordering codes differ. A different package code can represent a different construction or qualification option even when the ball count is similar. Confirm the package drawing, ball map, lead-free status, and temperature suffix before treating them as interchangeable.
Is XC3S400-4FTG256C suitable for industrial control systems?
The XC3S400-4FTG256C can be evaluated for industrial control tasks that fit its 8,064 logic cells and 264 I/O, with a 0 to 85 °C commercial operating range. Its programmable architecture is useful for parallel control, communications, data acquisition, and custom peripheral logic. The enclosure temperature, power integrity, long-term availability, and any required industrial qualification must also be checked.
When should I choose XC3S400-4FTG256C over XC3S400A-4FTG256C?
Choose the XC3S400-4FTG256C when an existing design is qualified around the original Spartan-3 device and its verified clock, I/O, and power implementation. Consider the XC3S400A-4FTG256C only after confirming that every electrical, timing, configuration, and pin-level requirement is satisfied for the specific board. A shared package name alone does not establish functional or timing equivalence.
What can replace the XC3S400-4FTG256C?
A valid replacement must match the 256-LBGA FTG256 footprint and satisfy the required logic, I/O, memory, speed, supply, temperature, and configuration specifications. Same-family candidates such as XC3S400A-4FTG256C, XC3S500E-4FTG256C, and XC3S400-4FTG256I require careful qualification before substitution. Request a controlled migration review and complete the FPGA design’s timing and I/O verification.
Can XC3S400-4FTG256I replace XC3S400-4FTG256C?
The XC3S400-4FTG256I uses the same FTG256 package family but represents an industrial-temperature ordering option rather than the commercial option in XC3S400-4FTG256C. It can be a candidate for a drop-in review because the package designation and core family align. Confirm electrical ratings, clock limits, I/O behavior, temperature grade, and all design timing before approving the substitution.
What is the best AMD equivalent for XC3S400-4FTG256C?
The closest package-aligned AMD candidate is XC3S400A-4FTG256C because both product listings identify 8,064 logic cells and the 256-LBGA FTG256 package. It remains a same-brand migration candidate rather than an automatic replacement. Validate configuration compatibility, pin behavior, memory resources, I/O standards, timing performance, and lifecycle requirements before using it on an existing board.
Where is the XC3S400-4FTG256C pinout and package drawing?
The XC3S400-4FTG256C pinout, ball assignments, and package drawing are located in the Spartan-3 family documentation linked from this page’s datasheet listing. The exact FTG256 package drawing should be used rather than a generic 256-ball outline. Confirm exposed-pad treatment, configuration pins, clock pins, supply pins, and user I/O locations against the package-specific tables.

کے لیے انجینئرنگ ریفرنس ڈیٹا XC3S400-4FTG256C — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔

انتخاب کی گائیڈ

Choose the XC3S400-4FTG256C when maintaining an established Spartan-3 design that uses the commercial temperature option and the exact FTG256 footprint. It offers 8,064 logic cells, 264 I/O, and a 1.2 V core supply for programmable control and data-processing functions. Consider XC3S400A-4FTG256C for a migration within a related AMD generation, but review configuration, timing, and I/O differences rather than relying on the shared package. Consider XC3S500E-4FTG256C when the larger 10,476-cell device provides useful capacity without requiring a package change. The XC3S400-4FTG256I and XC3S400-4FT256I variants may fit projects needing the industrial suffix or alternate package construction. In every case, validate the exact ball map, electrical limits, timing closure, configuration memory, and production availability before releasing a PCB.

متبادلات کے ساتھ موازنہ

پیرامیٹر یہ پروڈکٹ XC3S400A-4FTG256C XC3S500E-4FTG256C XC3S400-4FT256C XC3S400-4FTG256I XC3S400-4FT256I
Package 256-LBGA (FTG256) 256-LBGA (FTG256) 256-LBGA (FTG256) 256-LBGA (FT256) 256-LBGA (FTG256) 256-LBGA (FT256)
Brand AMD AMD AMD AMD AMD AMD
FPGA Family Spartan-3 Spartan-3A Spartan-3E Spartan-3 Spartan-3 Spartan-3
Temperature Grade Commercial Commercial Commercial Commercial Industrial Industrial

اہم امتیازی خصوصیات

  • Original Spartan-3 device identity (بمقابلہXC3S400A-4FTG256C)
  • Commercial-temperature ordering option (بمقابلہXC3S400-4FTG256I)
  • Lower logic utilization than a capacity-expanded candidate (بمقابلہXC3S500E-4FTG256C)

ڈیزائن نوٹس

Design the 1.2 V core rail and any auxiliary I/O supplies as a complete power tree with local high-frequency decoupling and controlled sequencing. Place the closest bypass capacitors directly beside the appropriate supply and ground balls, then validate return paths on the FTG256 footprint. Check the family documentation for the exposed-pad connection, permitted voltage combinations, and startup requirements before finalizing the schematic.

Use the exact FTG256 package drawing and ball table when assigning clocks, configuration pins, and high-speed interfaces. Keep clock nets short, route series-terminated signals according to the applicable I/O standard, and avoid unnecessary stubs beneath the BGA. Because the 256-LBGA footprint is escape-routing intensive, perform layer-stackup and signal-integrity review before committing to board routing.

Do not treat a same-ball-count package as sufficient proof of drop-in compatibility. For XC3S400-4FTG256C replacements, compare the exact package drawing, speed grade, temperature suffix, supply requirements, configuration behavior, I/O standards, and timing limits. After substitution, rerun synthesis, place-and-route, timing analysis, and board-level validation rather than relying only on the ordering code.

تعمیل کی معلومات

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
لیڈ فری
Yes
ہیلوجن فری
Unknown
کنفلیکٹ منرلز
Unknown

The product listing identifies the XC3S400-4FTG256C as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status require confirmation from current manufacturer or lot documentation.

ڈیٹا کی تصدیق کی تاریخ: 2026-11-04 — ڈیٹا XAIPART کی کمپوننٹ انجینئرنگ ٹیم کے ذریعے تصدیق شدہ اور ترتیب شدہ

متعلقہ تلاشیں

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متعلقہ اجزاء اور اصطلاحات

AMD Xilinx XC3S400-4FTG256C XC3S400A-4FTG256C XC3S500E-4FTG256C XC3S400-4FTG256I Spartan-3 Spartan-3A Spartan-3E field-programmable gate array FPGA programmable logic logic cell system gate CPLD ASIC configuration bitstream 256-LBGA FTG256 surface-mount package 1.2 V core supply 264 I/O industrial control communications protocol conversion instrumentation digital signal processing
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