XC7K160T-1FB484I - 162240 Logic Cells Kintex-7 FPGA | AMD
MPN: XC7K160T-1FB484I ✓ فعالXC7K160T-1FB484I جائزہ
An FPGA is a semiconductor whose logic, I/O and programmable interconnect resources are configured after manufacture. FPGA devices are placed between programmable processors and fixed-function application-specific integrated circuits: they can accelerate parallel algorithms, implement custom interfaces and consolidate multiple functions into one device. The Kintex-7 family combines high-performance programmable logic with advanced serial transceivers, memory resources and general-purpose I/O.
The XC7K160T includes 162240 logic cells, 12675 logic cells and programmable blocks according to the product listing, 285 I/O pins and a 1 V core supply. The device is identified as a 484-BBGA, FCBGA package. Its extensive logic capacity makes it suitable for data acquisition, industrial control, communications, signal processing and test systems where parallel data paths or multiple independent functions must operate concurrently.
The listed device belongs to the Kintex-7 product family, which is available in -3, -2, -1, -1L and -2L speed grades. The -2L versions are screened for lower maximum static power and can operate at lower core voltages for lower dynamic power than -2 devices. The XC7K160T-1FB484I uses the -1 grade designation, while its “I” suffix identifies the industrial temperature option in the manufacturer’s ordering nomenclature.
Typical applications include high-speed data acquisition, industrial automation, communications infrastructure, embedded signal processing, FPGA-based accelerator boards and high-resolution control systems. The 285 available I/O pins also make the device useful for systems combining wide parallel buses with high-speed serial links.
PCB implementation should preserve the exact 484-ball FCBGA footprint, power and ground distribution, decoupling, configuration interface and high-speed routing. Because the package contains many balls and a large FPGA configuration context, the layout should be reviewed against the manufacturer’s pinout, power guidance and design-assistance recommendations before fabrication.
This product record combines the exact configuration, package and logic-density information with practical engineering guidance, qualified same-footprint alternatives and a parameter comparison. It is intended to accelerate component selection and board planning for engineers designing with the Kintex-7 XC7K160T platform.
کے لیے ڈراپ اِن متبادل XC7K160T-1FB484I — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
XC7K160T-1FBG484I
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC7K160T-1FBG484C
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC7K160T-2FBG484I
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC7K160T-2FBG484C
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC7K160T-1FBG484C
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC7K160T-1FB484I زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Device Type | Kintex-7 FPGA |
| Logic Cells | 162240 |
| Logic Cells and Programmable Blocks | 12675 LABs/CLBs |
| Process Technology | 28 nm |
| Core Supply Voltage | 1 V |
| I/O Count | 285 |
| پیکیج | 484-BBGA, FCBGA |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Speed Grade | -1 |
| Temperature Grade | Industrial |
XC7K160T-1FB484I 484-bbga, fcbga پن کنفیگریشن گائیڈ
XC7K160T-1FB484I (484-bbga, fcbga پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں XC7K160T-1FB484I.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
XC7K160T-1FB484I کے لیے موزوں ہے 6 ایپلیکیشنs: High-Speed Data Acquisition, Industrial Automation and Control, Communications Signal Processing, Test and Measurement Equipment, Parallel Computing Accelerator, Aerospace and Defense Control Systems.
High-Speed Data Acquisition
The XC7K160T-1FB484I is suitable for wide parallel and mixed-signal data-acquisition systems because it provides 162240 logic cells and 285 I/O pins in a 484-ball FCBGA package. Parallel converters, capture memories and control logic can be implemented in one programmable device, reducing inter-device data transfers and helping synchronize acquisition channels. The 1 V core and -1 speed grade support demanding pipelines, while the large I/O count supports wide sensor and memory interfaces. Engineers should use the exact ball map to separate high-speed transceiver pins from regular I/O and preserve the manufacturer’s decoupling and power-return guidance.
تجویز کردہ
Industrial Automation and Control
The XC7K160T-1FB484I can consolidate machine-control logic, sensor conditioning interfaces, motion sequencing and communications in one industrial FPGA. Its 162240 logic cells provide substantial parallel capacity for deterministic control loops, while 285 I/O pins support digital inputs, outputs, encoders and field-bus transceivers. The industrial-temperature suffix is appropriate for equipment expected to operate outside benign commercial conditions. Designers should partition deterministic logic from supervisory functions, constrain clocks carefully and validate timing under voltage and temperature corners. Robust power sequencing, grounding and isolation boundaries remain essential for factory-floor reliability.
تجویز کردہ
Communications Signal Processing
The XC7K160T-1FB484I fits communications systems requiring parallel filtering, packet processing, buffering and custom interface logic. Its 162240 logic cells can support multi-channel data paths, while the 484-ball FCBGA package supplies extensive I/O and power connectivity for board-level transceiver integration. The -1 grade is appropriate when timing closure does not require a faster speed bin. High-speed routing should use the manufacturer’s recommended layer stack and transmission-line conventions, and clocking should avoid avoidable fabric crossings. A timing-focused design can evaluate the -2 alternative if additional implementation margin is needed.
تجویز کردہ
Test and Measurement Equipment
The XC7K160T-1FB484I can implement multi-channel pattern generation, acquisition, timing control and analysis logic within a compact instrument. Its 162240 logic cells and 285 I/O pins allow multiple wide interfaces to operate concurrently, while the 1 V core and industrial-temperature option support deployment across demanding test environments. The -1 grade can satisfy moderate clock rates, although timing-critical instrumentation should be evaluated at the required voltage and temperature corners. Separate high-speed and sensitive measurement grounds, control BGA return paths and place decoupling directly at the relevant power balls to minimize analog and digital coupling.
تجویز کردہ
Parallel Computing Accelerator
The XC7K160T-1FB484I supports FPGA-based accelerators that divide matrix, image or cryptographic workloads across parallel pipelines. Its 162240 logic cells provide substantial configurable arithmetic and control capacity, while 285 I/O pins enable high-bandwidth interfaces to external memory and host processors. The -1 speed grade is useful for cost-sensitive systems that can close timing at the chosen clock, and the industrial suffix supports harsher operating environments. For accelerator development, benchmark actual arithmetic and memory mappings in the implementation tool, constrain critical paths and plan a faster-grade path if throughput cannot be met.
تجویز کردہ
Aerospace and Defense Control Systems
The XC7K160T-1FB484I is applicable to avionics, guidance and mission-control prototypes requiring programmable logic, extensive I/O and configurable signal paths. Its 162240-cell Kintex-7 architecture supports parallel control functions and adaptive processing, while the industrial suffix provides a documented ordering path for demanding temperature conditions. Qualification for any specific airborne program depends on the full device, package, screening flow and system requirements rather than FPGA logic capacity alone. Pin compatibility, radiation and reliability requirements, supply-chain documentation and long-term lifecycle commitments should be reviewed with the manufacturer before design freeze.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا XC7K160T-1FB484I — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | XC7K160T-1FBG484I | XC7K160T-1FBG484C | XC7K160T-2FBG484I | XC7K160T-2FBG484C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA |
| Logic Cells | 162240 | 162240 | 162240 | 162240 | 162240 |
| I/O Count | 285 | 285 | 285 | 285 | 285 |
| Core Voltage | 1 V | 1 V | 1 V | 1 V | 1 V |
| Speed Grade | -1 | -1 | -1 | -2 | -2 |
| Temperature Suffix | I | I | C | I | C |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
اہم امتیازی خصوصیات
- Exact -1 speed-grade match (بمقابلہXC7K160T-2FBG484I)
- Industrial-temperature ordering option (بمقابلہXC7K160T-1FBG484C)
- Closest documented package-suffix alternative (بمقابلہXC7K160T-1FBG484I)
ڈیزائن نوٹس
Implement the 1 V core rail and auxiliary I/O rails as separate, tightly regulated power domains. Follow the exact DS182 power-rail and decoupling tables for the ordered suffix rather than treating all 484 balls as interchangeable. Place bulk and high-frequency capacitors at the nearest available supply and ground balls, provide adequate plane or via connectivity, and keep sensitive return paths short. Validate ripple and sequencing in hardware because an FPGA’s dynamic current can vary sharply with logic activity and clock state.
Create the PCB footprint from the manufacturer’s 484-FCBGA mechanical drawing, including ball pitch, pad diameter, solder-mask definition and thermal-via requirements. Preserve the prescribed via-in-pad or via-near-pad structure so that power delivery and heat removal meet the package requirements. Confirm the suffix-specific ball map before routing configuration, clocks and high-speed I/O. A mechanically similar BGA footprint is not enough because ball assignments determine whether the board is truly compatible.
Estimate worst-case junction temperature from actual utilization, selected speed grade, core voltage, I/O activity and ambient conditions rather than using logic-cell count alone. Use the manufacturer’s thermal model or power-estimation tools to account for local hot spots around the FPGA and adjacent memory. Distribute the thermal path with copper and vias, control adjacent heat sources and avoid enclosing the board without convection. Retest power and temperature during representative workloads because activity-dependent heating can exceed idle estimates.
Route clocks and high-speed interfaces with continuous reference planes, controlled impedance and minimized via transitions. Apply the manufacturer’s guidance for unused I/O, configuration pins, clock-capable pins and voltage-standard constraints. Avoid long stubs and split power planes beneath the BGA, and keep high-speed and sensitive signals separated where coupling could affect accuracy. After layout, run signal-integrity and power-integrity simulations for the actual stackup, connector and package details.
Do not approve a replacement using only the 484-ball package size. Compare the complete ball map, voltage rails, configuration pins, speed grade and temperature suffix. The -2 alternatives can change timing performance, while the C-suffix alternatives change the temperature ordering option; either can invalidate an unqualified substitution. Confirm the configuration bitstream and pin constraints, then rerun synthesis, implementation, timing analysis and board-level validation after any device change.
تعمیل کی معلومات
The target is an industrial-temperature Kintex-7 FPGA in a 484-FCBGA package. Confirm material and environmental declarations using the current manufacturer product documentation and the applicable orderable-part record.
