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XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP
XC3S200-4VQ100C

XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP

The AMD/Xilinx XC3S200-4VQ100C is a Spartan-3 Field Programmable Gate Array (FPGA) with 200,000 system gates, 63 user I/O pins, and a 100-pin VQFP package. It operates from a 1.2 V FPGA supply and is specified for a 0 °C to 85 °C operating-temperature range. The device is intended for embedded programmable-logic applications where moderate logic density, surface-mount packaging, and a broad I/O count are more important than the very high performance of a large FPGA. An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. The XC3S200-4VQ100C belongs to the Spartan-3 FPGA family, placing it in the broader hierarchy of programmable-logic device, FPGA, and semiconductor. Its 200,000 system gates provide a practical platform for control logic, interface bridging, signal conditioning, and embedded state-machine designs. The 100-pin VQFP package also supports conventional PCB assembly and inspection processes. The -4 speed designation identifies the device performance grade, while VQ100 identifies the 100-pin VQFP package and C identifies the commercial temperature grade. The listed electrical characteristics include 63 user I/O pins, a 1.14 V to 1.26 V core-supply range, and a 0 °C to 85 °C operating range. These figures define the principal design constraints for voltage regulation, thermal planning, signal-interface design, and industrial or commercial equipment. Typical uses include industrial control and automation modules, communications-interface adapters, embedded test equipment, and low-to-medium complexity digital systems. The FPGA can implement parallel logic, state machines, counters, protocol front ends, and control functions in one configurable device. Engineers should confirm that the selected design does not require more logic resources, I/O, clocking, or memory than the available device resources provide. The most important design consideration is ensuring that the 1.2 V core rail is generated with adequate tolerance and decoupling, while all connected I/O structures remain compatible with the target board voltage levels. Because this is a surface-mount VQFP package, solderability, pin-1 orientation, assembly profile, and thermal performance should be reviewed against the selected PCB footprint and manufacturing process. This page consolidates distributor availability, verified device parameters, package information, and practical FPGA selection guidance. It also distinguishes exact drop-in alternatives from upgrade candidates so engineers can assess PCB reuse without confusing package compatibility with complete functional equivalence.

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XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD
XC3S200-4VQ100I

XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD

AMD XC3S200-4VQ100I is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 logic elements, a 1.2 V supply, and a 100-pin TQFP package. The device combines programmable logic, block RAM, and dedicated multiplier resources in a compact 14 mm × 14 mm surface-mount package. Its industrial-oriented ordering suffix supports use in embedded control, communications, instrumentation, and industrial automation systems where deterministic programmable logic is required. A Spartan-3 FPGA is a reconfigurable digital semiconductor in the FPGA and CPLD product hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA allows engineers to define parallel logic, state machines, interfaces, and data-processing functions in hardware. Its configurable interconnect routes signals among logic cells, dedicated block RAM, multipliers, and general-purpose I/O, making the device suitable for designs requiring deterministic timing and flexible hardware architecture. The XC3S200-4VQ100I provides 200000 system gates and 4320 logic elements according to distributor listings. The family-level product information also identifies 12 block RAMs, 12 multipliers, and 4 digital clock managers for designs requiring embedded memory, dedicated arithmetic, and clock-management resources. Its 1.2 V core supply and 100-pin TQFP package provide a practical balance between capability, I/O access, and board footprint. The “-4” portion identifies the device speed grade, while “VQ100” identifies the 100-pin package configuration and “I” identifies the industrial temperature grade. These ordering codes allow procurement teams to distinguish devices that otherwise belong to the same Spartan-3 family. Because FPGA designs depend on the configuration file, device speed, pinout, memory resources, and supported I/O standards, engineers should verify the exact ordering code against the AMD/Xilinx datasheet and board constraints before substitution. Typical uses include industrial control logic, low-latency communication interfaces, data acquisition, embedded signal processing, test equipment, and general-purpose embedded systems. The 100-pin package is particularly useful where a larger FPGA would be unnecessary and where external SDRAM or a high-pin-count BGA package would add unnecessary board complexity. Its integrated resources can reduce external logic-component count while retaining software-side reconfiguration flexibility. The primary design consideration is package-level resource and signal-integrity verification. The 100-TQFP footprint requires exact land-pattern, pin-orientation, and power-decoupling review before layout release. Engineers should also account for configuration memory, configuration interface, clocking, I/O voltage limits, unused pins, and startup behavior in the complete FPGA design rather than treating the FPGA only as a collection of logic blocks. This product page consolidates verified distributor specifications, package information, ordering-code details, sourcing links, and engineering guidance. It also distinguishes a genuine same-footprint replacement from a merely similar FPGA family member and records unknown technical values explicitly for engineers to confirm in the manufacturer datasheet.

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XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA
XC3S200-5FT256C

XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA

The AMD XC3S200-5FT256C is a Spartan-3 field-programmable gate array with 200,000 system gates, 192 logic cells, and a 1.2 V supply in a 256-LBGA package. The -5 speed designation identifies the device performance grade, while the FT256C suffix identifies the lead-free commercial package variant. Its operating temperature range is 0°C to 85°C, making it suitable for cost-sensitive embedded systems that require programmable logic without the resources of a larger FPGA. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmed devices, and application-specific programmable logic. The Spartan-3 architecture combines configurable logic, memory resources, dedicated input/output structures, and programmable interconnect, allowing a designer to implement multiple control, interface, datapath, and signal-processing functions in one device. The XC3S200-5FT256C provides 50,000 system gates according to one distributor listing and 200,000 system gates according to Mouser and Partstack. The verified sources also report 192 logic cells, a 1.2 V FPGA supply, a 256-LBGA package, 256 terminals, and a square package shape. These source differences should be resolved against the applicable AMD Spartan-3 family data sheet before final design release. Because the device belongs to the Spartan-3 generation, engineers should treat it as a legacy programmable-logic platform and validate toolchain availability, configuration method, I/O standards, timing, and sourcing before beginning a new production design. The operating range of 0°C to 85°C distinguishes it from extended-temperature variants. Its 256-ball land-grid-array package also requires a PCB footprint and assembly process capable of handling fine-pitch balls, while configuration storage, clocking, decoupling, and I/O voltage planning remain central implementation concerns. Typical uses include industrial control and factory automation, embedded instrumentation, communications interfaces, display and video control, consumer products, and general-purpose digital signal processing. The Spartan-3 family was specifically positioned for high-volume, cost-sensitive consumer electronic applications, but individual designs still require complete timing, thermal, signal-integrity, and configuration verification. The principal design caution is that a replacement FPGA must match the package, ball assignment, supported I/O standards, voltage requirements, configuration interface, and timing constraints. A device with the same family name or logic density is not automatically pin-compatible. Migration decisions should therefore use AMD pinout data, device-generation constraints, and design-tool checks rather than relying only on distributor similarity labels. This page consolidates the verified distributor and manufacturer references for the XC3S200-5FT256C, distinguishes verified characteristics from parameters requiring confirmation, and provides migration, sourcing, and application guidance that is not present in a basic distributor listing.

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XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-5VQ100C

XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx

The AMD Xilinx XC3S200-5VQ100C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 63 user I/O pins, and 221,184 RAM bits, supplied in a 100-pin TQFP package. It operates from a 1.2 V supply and is specified for a 0 to 85 °C operating temperature range. A field-programmable gate array is a programmable digital semiconductor that combines configurable logic, programmable interconnect, and memory resources in one device. In the broader semiconductor hierarchy, an FPGA belongs to programmable logic devices and provides a hardware alternative to implementing a fixed function in an application-specific integrated circuit. The Spartan-3 family was designed for cost-sensitive embedded, industrial, consumer, and communication systems. The XC3S200-5VQ100C provides 4,320 logic cells and 221,184 RAM bits for parallel datapaths, control logic, state machines, and interface conditioning. Its 63 user I/O pins provide connections to external memory, sensors, converters, communication transceivers, and display or control peripherals. The -5 speed designation identifies the device's performance grade, while the commercial C temperature designation corresponds to the stated 0 to 85 °C range. The device uses a 1.2 V core supply, making power-supply design important in compact embedded systems. Available details confirm 200,000 system gates, 4,320 logic cells, 63 I/O pins, 221,184 RAM bits, and a 100-TQFP package. Additional detailed information such as exact I/O standards, configuration interface characteristics, and recommended operating limits is not present in the supplied verified records and must be confirmed from the manufacturer datasheet before design release. Typical uses include industrial controllers, embedded control systems, video and image-processing front ends, communication equipment, and consumer electronics. In each case, the Spartan-3 architecture permits logic and memory functions to be updated in the field, reducing the need for a custom ASIC in moderate-volume designs. Designers should preserve the manufacturer's recommended power and decoupling arrangement, validate every I/O voltage and bank configuration, and account for configuration-pin requirements during power-up. Because the supplied records do not include a complete verified pin table, the package drawing is represented by the generic library key rather than an invented pinout. This page combines the verified distributor specifications, packaging information, source links, and drop-in alternatives. It also distinguishes directly comparable speed-grade parts from larger-package or functionally similar devices that cannot replace the target without PCB changes.

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XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I

XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx

The AMD/Xilinx XC3S200A-4FTG256I is a Spartan-3A family Field Programmable Gate Array (FPGA) with 200,000 system gates, 4,032 logic cells, and 195 user I/Os in a 256-ball FineLine Thin-profile BGA (FTG256) package at industrial temperature grade (I suffix). Built on 90nm CMOS technology with a 1.2V core, the device targets cost-sensitive, high-volume digital logic applications. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM and multipliers. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic; the Spartan-3A family is Xilinx's low-cost, high-volume segment designed for consumer, industrial, and communications glue-logic applications. Key specifications of the XC3S200A-4FTG256I include 448 Configurable Logic Blocks (CLBs), 288 Kbits of block RAM, up to 667 MHz maximum operating frequency (speed grade -4), dedicated 18x18 hardware multipliers for DSP, and a Digital Clock Manager (DCM) block for clock synthesis. The FTG256 package measures 17x17 mm and uses a 1.0 mm ball pitch. Architecturally, the Spartan-3A integrates CLBs arranged in rows and columns, surrounded by IOBs (I/O blocks), with block RAM columns interleaved, four DCMs, and dedicated multiplier blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential HSTL/SSTL for direct interface to external memories and high-speed peripherals. Typical applications include industrial control and machine vision, consumer electronics display controllers, communications protocol bridges, low-cost video processing, motor control, and educational/hobbyist development boards. The wide operating temperature range (-40C to +100C industrial grade) also suits factory automation and outdoor equipment. Designers should pay attention to the FTG256 ball-pinout for PCB layout: a 256-ball BGA with 1.0 mm pitch requires 4-6 layer PCB design with microvia or via-in-pad technology for reliable assembly. Use Xilinx ISE WebPACK or the modern AMD Vivado/Vivado Lab Edition for configuration bitstream generation. Power estimation should be performed with the Xilinx Power Estimator (XPE) tool before finalizing thermal management. This page consolidates current distributor pricing, verified pin-compatible drop-in alternatives in the Spartan-3A family, and practical design notes - practical context not found in the bare manufacturer datasheet.

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XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4FT256C

XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4FT256C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, 173 I/O, and a 1.2 V core supply, housed in a 256-LBGA package. The -4 suffix identifies the performance grade, while FT256 identifies the 256-ball surface-mount package offered in the verified distributor records. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated hard multipliers, and clock-management resources. This makes the Spartan-3 family useful when engineers need hardware-level parallelism, rapid design changes, or compact implementation of complex digital systems without committing to a custom application-specific integrated circuit. The verified listing identifies 400,000 system gates and 8,064 logic cells for the XC3S400 device. It provides 173 I/O in a 256-LBGA package and uses a 1.2 V core voltage. Related Spartan-3 data identifies 90 nm fabrication technology and a 630 MHz figure for the XC3S400-4FTG256C comparison variant; those values should not be transferred to XC3S400-4FT256C without confirmation from its own manufacturer datasheet. The device is suitable for parallel data processing, custom interface control, embedded signal processing, communications infrastructure, test equipment, and industrial control systems. Its 173 I/O permit substantial board-level connectivity, while the 8,064-cell logic resource supports parallel datapaths and state machines. The FT256 package can also simplify component density compared with larger leaded packages, but it requires careful PCB layout, thermal analysis, and BGA assembly capability. The commercial -4 grade is intended for cost-optimized designs rather than the extreme operating range implied by an industrial temperature suffix. Before releasing a design, engineers should verify the exact I/O standards, supported memory interfaces, configuration requirements, power-up behavior, and package pinout against the manufacturer documentation for XC3S400-4FT256C. A critical design consideration is that the FT256 package requires exact land-pattern, solder-mask, paste, via, and assembly-process control. Power rails and decoupling should be implemented according to the manufacturer's guidance, while configuration and programming interfaces should be checked for signal-integrity and termination requirements before layout signoff. This page consolidates verified distributor pricing, same-footprint Spartan-3 alternatives, application guidance, and design cautions that are not presented together on a manufacturer product page. It also distinguishes confirmed target-device facts from parameters that remain unavailable in the supplied source data.

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XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx
XC3S400-4FT256I

XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FT256I is a Spartan-3 field-programmable gate array providing 400,000 system gates, 8,064 logic cells, and 173 user I/Os in a 256-ball FTBGA package. The device operates from a 1.14 V to 1.26 V core supply, uses 90 nm process technology, and is specified for industrial-temperature operation from 0 °C to 85 °C. Its -4 speed grade supports operation up to 630 MHz according to the compared manufacturer-family specification in the provided web data. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after fabrication. The Spartan-3 family belongs to the FPGA and programmable-logic hierarchy, providing configurable logic resources rather than a fixed instruction set. The XC3S400-4FT256I is intended for designs requiring substantial parallel logic, control, communications, or signal-processing functions while using a single highly integrated package. The main device characteristics include 400,000 system gates, 8,064 logic cells, 173 user I/Os, a 256-ball FTBGA package, and a 1.2 V nominal core supply. The listed family comparison identifies 90 nm technology and a 630 MHz performance figure for the XC3S400-4FT256I. Its industrial temperature range and lead-free package information make it relevant to industrial control, communications equipment, and embedded systems, although current availability and lifecycle status should be confirmed before new production commitments. The FTBGA package provides a dense connection arrangement for high-density programmable-logic designs. The 173 user I/Os can be assigned to digital interfaces, control signals, communications links, or mixed external circuitry, while the FPGA fabric allows parallel functions to be implemented with deterministic hardware timing. Unlike a microcontroller with a fixed peripheral architecture, the XC3S400-4FT256I allows system functions and interfaces to be defined during configuration, making it suitable for custom protocols, accelerators, and legacy system control logic. Typical applications include industrial automation controllers, communications equipment, embedded control systems, test and measurement platforms, and signal-processing modules. In these systems, the FPGA can implement parallel interfaces, protocol conversion, timing and sequencing functions, and custom hardware processing. The 400,000-system-gate density is substantially larger than small CPLDs, supporting multi-module designs while keeping the implementation in one programmable device. The primary design consideration is package-level integration. A 256-ball FTBGA requires careful PCB layout, via and escape-routing planning, thermal management, and assembly-process control. The core supply and I/O supply requirements, configuration interface, clocking, decoupling, and termination must follow the Spartan-3 device documentation. Because the XC3S400-4FT256I is associated with a discontinued-product notice in the provided AMD support result, engineers should preserve the exact MPN in legacy designs and evaluate any replacement against pinout, voltage, timing, and configuration compatibility. This product record combines verified distributor and manufacturer-search information with practical design guidance for industrial FPGA implementations. It highlights the density, logic-cell count, I/O count, package, voltage, temperature range, and source links while clearly separating confirmed data from specifications that require confirmation from the manufacturer datasheet.

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XC3S400-4TQ144C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4TQ144C

XC3S400-4TQ144C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4TQ144C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 97 I/Os, and a 1.2 V core supply in a 144-pin TQFP package. The -4 speed grade is intended for designs requiring the specified Spartan-3 performance class, while the C suffix identifies the commercial operating-temperature option documented by the available product data. An FPGA is a programmable logic device within the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function ASIC, an FPGA combines configurable logic, programmable routing, dedicated input/output resources, and embedded memory blocks on one device. This lets engineers revise digital architectures through configuration files instead of redesigning and fabricating custom silicon, making FPGAs useful for prototypes, industrial controllers, communication systems, and embedded signal-processing equipment. The Spartan-3 architecture provides 8,064 logic cells for implementing sequential and combinational functions. The device also includes 97 I/Os and 294,912 bits of block RAM, according to the DigiKey listing. A 1.2 V core operating voltage suits modern low-voltage digital designs, while the TQFP-144 package provides 144 leads for external power, configuration, clock, and user-interface connections. The part belongs to the Spartan-3 family, which combines programmable logic with dedicated multipliers, block RAM, and clock-management resources. Those blocks allow designers to implement parallel data paths, packet-processing pipelines, control logic, and memory-intensive functions without relying on external discrete logic. The commercial-temperature C-grade designation supports product designs operating from 0 °C to 85 °C when all specified electrical and environmental limits are observed. Typical uses include industrial automation, communication equipment, embedded control, test and measurement, video and image processing, and general-purpose digital prototyping. The 97 available I/Os are particularly useful for parallel buses, counters, status signals, memory interfaces, and communication links. Designers should account for configuration startup behavior, clocking, decoupling, and I/O-standard requirements when planning the surrounding PCB. For a new board, place all supply pins and their associated decoupling capacitors according to the manufacturer layout guidance, keep sensitive clock and configuration routing away from noisy digital nets, and validate every interface voltage against the selected I/O standard. Existing XC3S400 TQFP-144 designs should compare device speed grade, temperature grade, package drawing, configuration interface, and supply requirements before selecting a replacement. This page consolidates verified distributor information, same-family drop-in alternatives, commercial availability data, and practical migration guidance. It is intended to accelerate component identification and sourcing without presenting unverified package details or unsupported cross-brand substitutions as drop-in replacements.

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XC3S400-4TQ144I - 400K Gate Industrial Spartan-3 FPGA | AMD
XC3S400-4TQ144I

XC3S400-4TQ144I - 400K Gate Industrial Spartan-3 FPGA | AMD

AMD XC3S400-4TQ144I is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 294,912 bits of embedded RAM, and 97 user I/Os in a 144-pin TQFP package. It operates from a 1.2 V core supply and is manufactured using a 90 nm process. The -4 suffix identifies one of the Spartan-3 performance grades, while the I suffix identifies the industrial-temperature ordering option. The TQFP-144 package provides a surface-mount form factor for systems requiring moderate logic density, dedicated block RAM, and programmable digital interfaces without the cost or complexity of a larger FPGA. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and provides parallel combinational logic, sequential logic, block RAM, programmable I/O, and clocking resources. The Spartan-3 architecture is intended for cost-sensitive embedded applications in which designers need configurable hardware without developing a custom ASIC. Verified product data identifies 400,000 system gates, 8,064 logic cells, 294,912 RAM bits, and 97 user I/Os for XC3S400-4TQ144I. The listed maximum operating frequency is 630 MHz, and the device uses 1.2 V core technology. These resources make it suitable for control logic, communications interfaces, industrial automation, test equipment, embedded signal processing, and general-purpose programmable system functions. The 144-pin package balances external connectivity against board-space requirements. The -4 performance designation makes this device appropriate for designs that prioritize cost and power efficiency over the fastest available Spartan-3 grade. Its 8,064 logic cells and block RAM can support parallel datapaths, state machines, protocol handling, and control functions. Exact clock-rate, I/O-standard, and timing-budget conclusions should be based on the manufacturer datasheet and the selected I/O implementation rather than inferred solely from the maximum frequency listed by a distributor. Typical applications include industrial controller logic, data-acquisition front ends, communications bridges, embedded test systems, and compact control platforms. In these systems, the FPGA can implement parallel interfaces and state machines while offloading deterministic tasks from a microcontroller. The 97 available user I/Os are particularly useful for legacy parallel buses, control signals, status indicators, and external memory or peripheral connections. Designers should verify the exact bank supply voltages, supported I/O standards, configuration method, pinout, and timing constraints in the manufacturer datasheet before layout release. The TQFP package also requires attention to thermal dissipation and lead co-planarity. Configuration storage, clocking, decoupling, and JTAG access must be planned so that the device can be programmed and debugged in production without board rework. This page combines verified distributor specifications, official-product search results, same-family replacement options, package-level comparison data, and practical design guidance. It distinguishes confirmed parameters from unavailable details instead of filling gaps with assumed values, helping engineers select, compare, source, and implement the XC3S400-4TQ144I with greater confidence.

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XC3S400-5PQ208C - 400K Gate Spartan-3 FPGA | Xilinx
XC3S400-5PQ208C

XC3S400-5PQ208C - 400K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-5PQ208C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, and 141 I/O sites in a 208-pin PQFP package. The device operates from a 1.2 V core supply and is associated with a 725 MHz device speed rating, making it suitable for embedded logic, control, communications, and general-purpose programmable systems. Its commercial-temperature designation indicates operation from 0°C to 85°C according to the available distributor specifications. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after fabrication. FPGAs sit above programmable logic devices in the hardware hierarchy and combine configurable logic blocks, programmable interconnect, input/output blocks, and embedded memory resources. The Spartan-3 architecture uses a 90 nm process and provides a substantial logic capacity while using a conventional 208-pin PQFP surface-mount package, avoiding the larger ball-grid-array footprints used by many comparable devices. The XC3S400-5PQ208C provides 8,064 logic cells, 400,000 system gates, and 141 I/O. The -5 suffix identifies the device speed grade, while PQ208 identifies the 208-pin PQFP package. The available component listings also identify the device as lead-free and classify the package as 208-BFQFP. Exact core-voltage tolerances, configuration-memory organization, I/O standards, and recommended decoupling values were not supplied in the verified data and therefore are not inferred here. Typical applications include industrial control and automation, embedded instrumentation, communications gateways, digital signal-processing front ends, and general-purpose logic consolidation. The 141 I/O sites allow the FPGA to interface with parallel data buses, control signals, clocks, and external memory, while the 8,064 logic cells support state machines, protocol handling, data formatting, and arithmetic logic. Designers should assess clock-rate requirements carefully because a faster internal fabric does not guarantee that an external interface meets its specified timing. For a new PCB, the key design consideration is package-level planning. The 208-pin PQFP footprint requires adequate escape routing, exposed via access, and careful decoupling around the 1.2 V supply. A finished Spartan-3 design must also include a supported configuration path and a valid bitstream generated for the exact device, speed grade, and package identifier. Legacy software support should be verified before committing the part to a long-lived production program. This page consolidates verified distributor specifications, same-package replacement information, package and sourcing constraints, and engineering selection guidance. It also distinguishes directly compatible PQ208 alternatives from FG320 options that require a different PCB footprint, helping prevent a functionally similar FPGA from being mistaken for a true drop-in replacement.

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XC3S400-5TQ144C - 400K Gate Spartan-3 FPGA | Xilinx
XC3S400-5TQ144C

XC3S400-5TQ144C - 400K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-5TQ144C is a Spartan-3 field-programmable gate array with 400,000 system gates, a 1.2 V supply, and a 144-pin LQFP package. It is designed for programmable-logic applications requiring a balance of logic capacity, embedded block RAM, digital I/O, and device availability in a compact surface-mount package. The commercial temperature designation indicates operation from 0°C to +85°C according to the verified distributor specifications. The “-5” suffix identifies the device speed grade, while “TQ144C” identifies the 144-lead package and commercial grade. As an FPGA, the XC3S400-5TQ144C combines configurable logic blocks, programmable interconnect, block RAM, dedicated input/output resources, and embedded processor capabilities in a single semiconductor device. It belongs to the hierarchy FPGA > programmable logic device > digital semiconductor. Unlike a fixed-function application-specific integrated circuit, its internal functions are established through a configuration bitstream, allowing one device to implement multiple control, interface, arithmetic, and signal-processing functions. The verified distributor information identifies the component as a 400,000-system-gate Spartan-3 FPGA operating at 1.2 V in a 144-LQFP package. Its 144-pin surface-mount format is suitable for compact industrial, communications, control, and embedded-processing systems where larger BGA packages would be impractical. The active-low configuration pins, dedicated configuration resources, clock-management capabilities, and distributed and block RAM allow designers to implement parallel data paths and stateful control logic without combining numerous discrete devices. System timing should be evaluated against the -5 speed grade, the selected I/O standard, the external clock architecture, and the specific Spartan-3 family documentation. An LCSC result lists the XC3S400-5TQ144C as in stock with a price from $17.8523, making current supply and price useful differentiators. This page combines verified distributor specifications, price information, package details, practical design guidance, and strictly drop-in replacement candidates. It also separates confirmed values from engineering data that still requires manufacturer-documentation verification.

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XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD
XC3S400A-4FTG256C

XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD

The AMD (Xilinx) XC3S400A-4FTG256C is a Spartan-3A Field Programmable Gate Array (FPGA) with 400,000 system gates, 8,064 logic cells, and 195 user I/Os housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) measuring 17 × 17 mm. Built on a 90 nm CMOS process, the part operates across 0°C to +85°C commercial temperature range and supports up to 770 MHz internal clock performance per the Spartan-3A family datasheet. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (semiconductor IC) that lets engineers configure digital logic, memory blocks, and I/O behavior after manufacture. Within the broader taxonomy, the Spartan-3A sits under FPGA -> programmable logic -> logic ICs -> integrated circuits -> semiconductor. FPGAs like the Spartan-3A family are used as flexible hardware platforms that replace large clusters of discrete glue logic, custom ASICs, and processor peripherals, enabling rapid design iteration without a fabrication spin. Key differentiating features of the XC3S400A include 368,640 bits of embedded Block RAM distributed across 20 dedicated blocks (each 18 Kbit), 4 dedicated silicon hardware multipliers (18 × 18-bit signed), 4 Digital Clock Managers (DCMs) for clock conditioning, and integrated configuration support for SPI, BPI, and JTAG modes. The 256-FTBGA package offers high board-density and a low-profile mounting footprint suitable for portable and embedded products, while the commercial speed/grade designation ("-4") reflects the timing/voltage balance selected for general-purpose logic systems. Architecturally, the Spartan-3A uses a structured ASIC-style fabric of Configurable Logic Blocks (CLBs), a hierarchical routing network, and a hardened set of I/O standards including LVCMOS, LVTTL, LVDS, and HSTL. The four silicon multipliers deliver deterministic DSP performance independent of slice utilization, while the four DCMs provide frequency synthesis, phase shifting, and jitter filtering on a per-clock-domain basis. Typical applications for the XC3S400A-4FTG256C include industrial control and factory automation backplanes, video/image processing front-ends, low-density DSP pipelines, embedded display controllers, automotive infotainment prototyping, communications glue logic, and legacy parallel-interface bridges between microcontrollers and high-speed peripherals. Its combination of moderate logic density and ample Block RAM makes it a strong fit for cost-sensitive designs that would otherwise require several smaller FPGAs. When designing with the 17 × 17 mm FTG256 package, allocate at least four PCB layers with a solid ground plane under the device to control simultaneous switching noise (SSN). All I/O banks must share a common Vcco reference per bank, and unused pins should be left floating per AMD/Xilinx guidelines to avoid leakage paths during configuration. This page synthesizes distributor pricing, drop-in same-package alternatives (XC3S400A-4FTG256I and XC3S400-4FTG256C), and practical design notes not consolidated in the manufacturer datasheet alone.

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XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx
XC3S50-4CP132I

XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S50-4CP132I is a 50,000-system-gate Spartan-3 field-programmable gate array in a 132-terminal, approximately 8 mm square TFBGA package. Verified listings identify the device as a 192-CLB FPGA, while one comparison source states 630 MHz and 90 nm process technology. The “-4” ordering code identifies the performance grade, “CP” identifies the package family, “132” identifies the terminal count, and “I” identifies the industrial temperature grade. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a configurable semiconductor. Spartan-3 devices target cost-sensitive embedded systems where parallel logic, state machines, protocol handling, data acquisition, and modest control functions must fit into a compact board area. The verified sources report 50,000 system gates and 192 configurable logic blocks. The DigiKey result for the closely identified XC3S50-4CPG132I also reports 73,728 registers and 1,728 logic cells, but those figures were not explicitly supplied for XC3S50-4CP132I and therefore are not treated as target specifications here. The target belongs to the Spartan-3 family and is suitable for consumer, automotive, industrial, telecommunications, communications-hardware, and embedded-control applications. The CP132 package uses ball terminals and is identified by sources as TFBGA or CSPBGA. Because it is a fine-pitch, 132-terminal surface-mount package, PCB layout quality directly affects assembly yield and long-term reliability. Its approximately 8 mm square body demands exact land-pattern, solder-mask, stencil, and component-placement verification against the manufacturer package drawing before fabrication. Typical designs use configurable logic for acquisition control, sensor conditioning, digital filtering, communications, industrial interfaces, and compact embedded systems. Unlike a microcontroller, this FPGA performs parallel operations in hardware and can achieve deterministic latency after configuration. Designers must still supply configuration memory or another supported configuration source, clocking, decoupling, I/O standards, and a valid power-distribution network. The primary procurement caution is lifecycle and exact-ordering-code validation. Multiple distributors reported inventory in October 2026, but long-term availability should be confirmed for the production quantity rather than inferred from a single marketplace listing. Rochester Electronics reported 22.534 units and a starting unit price of $2.10, while another marketplace result reported 5,641 pieces; these figures are source-specific and should not be treated as guaranteed consolidated stock. This page consolidates verified package, capacity, market-availability, and cross-reference information with a strict analysis of whether any candidate is truly drop-in compatible. Unlike a generic distributor listing, it also distinguishes exact evidence from unavailable electrical, pin-level, lifecycle, and certification details so engineers can identify what still requires manufacturer-documentation review.

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XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD
XC3S50-4CPG132C

XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD

The AMD XC3S50-4CPG132C is a Spartan-3 field-programmable gate array supplied in a 132-ball TFBGA package, with 89 I/O and a distributor-listed logic-resource value of 73728. The ordering code identifies a -4 speed grade and a commercial-temperature grade through the C suffix. AMD acquired the original Xilinx Spartan-3 product line, so historical design materials commonly identify this device as XC3S50 rather than by its current corporate name. A field-programmable gate array, or FPGA, is a reconfigurable digital integrated circuit in which configurable logic blocks, programmable interconnect, and input/output resources implement a digital design. Within the semiconductor hierarchy, an FPGA sits above a programmable logic device and occupies the broader categories of programmable logic and digital logic ICs. Unlike a fixed-function microcontroller or application-specific processor, an FPGA allows parallel hardware architectures, timing control, and post-configuration logic updates. The verified distributor listing identifies 89 I/O, a 73728 logic-resource value, a 1728 feature value, and a 132-TFBGA package. The exact interpretation of the 73728 and 1728 distributor fields should be confirmed against the applicable Spartan-3 family data sheet before they are used in a resource budget. The part is identified as a Spartan-3 FPGA IC and is listed by DigiKey, Octopart, Win Source, IC-Components, and other distributors. The -4 suffix denotes the device speed grade within the Spartan-3 ordering system. A -4 grade is generally selected when design timing must be closed under a specified system clock, while it should not be treated as a guaranteed replacement for every speed grade. The C suffix identifies the commercial temperature grade, but exact minimum and maximum junction or ambient temperature limits require verification from the original manufacturer data sheet because those limits were not included in the retrieved snippets. The 132-ball TFBGA package supports compact, high-density board layouts, although its fine ball pitch makes inspection and rework more demanding than with a leaded package. Typical design uses include custom interface controllers, data-acquisition logic, embedded control functions, protocol bridges, and parallel signal processing. The 89 I/O count is a useful initial planning figure, but designers must also account for dedicated configuration pins, power pins, and other package balls that cannot be assigned as general user I/O. Because a BGA pin map was not included in the verified source material, the complete pin assignment cannot be reproduced safely. Before layout release, obtain the official Spartan-3 package data, confirm every power, ground, configuration, and user-I/O ball, and use the manufacturer land pattern and decoupling guidance. Do not infer the 132-ball map from the 89 user-I/O count. This page consolidates the verified distributor identity, package information, ordering-code details, cross-reference findings, and practical migration guidance. It also separates confirmed values from fields that still require manufacturer-document verification, helping engineers assess this legacy FPGA without treating distributor search snippets as a substitute for the complete data sheet.

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XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD
XC3S50-4CPG132C0974

XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD

The AMD (formerly Xilinx) XC3S50-4CPG132C0974 is a Spartan-3 Field Programmable Gate Array offering 50,000 system gates, 1,728 logic cells, and 89 user I/Os in a 132-ball Chip-Scale BGA (CSBGA / TFBGA) package. The device is part of the lowest-density Spartan-3 family, designed for cost-sensitive, high-volume applications requiring programmable logic glue, custom bus interfaces, and low-cost DSP functions without the overhead of higher-density FPGAs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-logic-density end of that family. Within a digital system, an FPGA typically handles parallel processing, high-speed glue logic, custom peripheral bridging, and rapid-prototype ASIC replacement. Key differentiating features of the XC3S50 include 73,728 bits of distributed SelectRAM, 16 dedicated 18x18 hardware multipliers (DSP48-style slices for Spartan-3), four Digital Clock Managers (DCMs) for zero-delay clock alignment and frequency synthesis, and JTAG IEEE 1149.1/1532 boundary-scan support. The 132-ball CSBGA package supports up to 89 user I/Os at densities appropriate for industrial control, consumer, and communications glue logic. The speed grade -4 indicates a mid-range timing bin (faster than -5, slower than -3) optimized for design margin rather than peak performance. The Spartan-3 architecture combines a sea-of-CLBs fabric with block RAM tiles, multipliers, and DCMs stitched together by a hierarchical routing network. The 90 nm process node and 1.2 V core voltage deliver low static power compared to earlier Spartan generations, and the device supports multiple I/O standards (LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL) on a per-pin basis for direct interfacing to memory, microprocessors, and differential links. The -C suffix indicates a commercial temperature grade (0 C to +85 C). Typical applications include consumer electronics glue logic, industrial control and machine interfaces, low-cost DSP pre/post-processing, custom peripheral expansion for microcontrollers, and legacy ASIC replacement in production. Designers select the Spartan-3 family for non-volatile-free, lowest-cost FPGA deployment where the simplicity of SRAM configuration is acceptable. When designing with the XC3S50-4CPG132C0974, ensure that the configuration memory (typically an external SPI flash or Platform Flash) is sized appropriately for the bitstream and that the JTAG chain is accessible for in-system programming. Consider migrating to the pin-compatible Spartan-3AN or Spartan-6 family for new designs that require non-volatile configuration or lower power. This page synthesizes distributor pricing, drop-in Spartan-3 family alternatives, and practical design notes not found in the bare manufacturer datasheet front matter.

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XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD
XC3S50-4CPG132I

XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD

AMD XC3S50-4CPG132I is a Spartan-3 field-programmable gate array with 1,728 logic cells, 89 user I/O, and 73,728 RAM bits in a 132-pin TFBGA/CSPBGA package. The device operates from a 1.14 V to 1.26 V supply and is specified for a -40°C to 100°C junction-temperature range. Its -4 speed designation identifies the performance grade used by the ordering code, while the I suffix identifies the industrial temperature option. A field-programmable gate array is a semiconductor device whose digital logic and interconnect structures are configured after manufacture. An FPGA sits above programmable logic within the broader semiconductor hierarchy and differs from a fixed-function application-specific integrated circuit because one package can implement many control, interface, datapath, or communication designs. This configurability is useful when product requirements evolve, production volumes warrant custom logic, or a system needs parallel processing beyond a simple microcontroller. The verified device data identifies 192 LABs or CLBs, 89 I/O, and 73,728 RAM bits. These resources support parallel state machines, control logic, data acquisition, communications, and embedded control functions. The Spartan-3 architecture is specifically associated with a 1.2 V-class supply in the supplied results, but individual bank requirements, configuration interfaces, AC/DC limits, and timing values must be checked in the official family documentation before implementation. Typical uses include industrial controllers, data-acquisition systems, communication peripherals, instrumentation, embedded processors, and compact control platforms. Its 89 available I/O provide external interfaces for clocks, serial links, digital buses, status indicators, and actuator controls. Designers should account for the 132-ball package when planning fanout and PCB escape routing, and must preserve the exact ball assignments used by the selected board design. For a new board, XC3S50-4CPG132I is appropriate when its 1,728 cells and 73,728 RAM bits satisfy the design and when an industrial-temperature, 1.2 V-class FPGA is required. For a direct replacement, compatibility must include the 132-ball footprint, exact ball map, supply rails, I/O standards, configuration interface, timing margin, and bitstream support rather than package count alone. This product record combines verified source specifications, procurement context, and engineering checks that should precede substitution. It distinguishes confirmed values such as cell count, RAM, I/O, voltage, package, and temperature from data that still requires the official pinout, price, lifecycle, and electrical-characteristic tables.

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XC3S50-4PQ208C - 50K Gate Spartan-3 FPGA | AMD
XC3S50-4PQ208C

XC3S50-4PQ208C - 50K Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4PQ208C is a 50,000-system-gate Spartan-3 field-programmable gate array with 1,728 logic cells, 124 user I/O pins, and a 208-pin PQFP package. The supplied data identifies a 1.2 V device and a maximum stated frequency of 630 MHz. Its architecture combines configurable logic, programmable I/O, and 73,728 total RAM bits in a cost-optimized device intended for logic-intensive embedded and control systems. A field-programmable gate array is a semiconductor device whose logic and interconnect resources are configured after fabrication. FPGAs sit above simple fixed-function logic devices in the hardware hierarchy because designers can implement counters, state machines, interfaces, control logic, and signal processing without manufacturing a custom integrated circuit. The Spartan-3 family targets applications where moderate logic density, flexible I/O, and economical implementation are more important than the very high capacity of larger FPGAs. The XC3S50-4PQ208C provides 50,000 system gates and 1,728 logic cells, while the supplied distributor information reports 124 user I/O pins. Its 73,728 RAM bits can support small internal buffers, lookup-table-based storage, counters, and communication state. The 208-pin PQFP package is a leaded surface-mount package that is easier to inspect and rework than a very fine-pitch BGA, although its 208 leads require a substantially larger board footprint. The device is associated with 90 nm technology and a 1.2 V supply in the supplied product references. The -4 designation is associated with the device’s speed grade, while the C suffix identifies the commercial temperature/grade coding used by the manufacturer’s ordering system. Exact timing constraints should be taken from the applicable Xilinx Spartan-3 datasheet and the selected design package. Typical uses include industrial control, instrumentation, communications, embedded systems, consumer electronics, and compact digital logic platforms. The 124 available I/O pins make the device useful when a design requires more external connectivity than a small FPGA package provides. The internal RAM can support protocol state, data buffering, and lookup functions without using external memory when the required storage is small. Designers should verify the exact pinout, power rails, decoupling requirements, configuration interface, I/O standards, and timing constraints against the official Spartan-3 documentation before layout. The PQFP footprint requires adequate solder mask and paste design around 208 leads, while the FPGA’s configuration pins, clock inputs, and I/O buffers must be planned during schematic capture. This page consolidates distributor and manufacturer-linked reference information, including logic density, RAM, I/O count, package, voltage, and stated frequency, and provides engineering guidance for selecting and integrating the XC3S50-4PQ208C. Availability, pricing, lifecycle status, and exact electrical limits should be confirmed against the current authorized source data.

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XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx
XC3S50-4PQ208I

XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx

The Xilinx XC3S50-4PQ208I is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic elements, 124 user I/O pins, and a 208-pin BFQFP package. According to the verified product data, it uses 1.2 V core technology, offers 73,728 RAM bits, and is rated for an operating temperature range of 0°C to 85°C. The device is designed for programmable logic, embedded control, communications, and cost-sensitive digital systems. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA combines programmable logic blocks, programmable interconnect, input/output blocks, and memory resources into a flexible parallel-processing platform. The Spartan-3 family targets designs that need more capability than simple fixed-function logic while retaining cost, power, and design-entry advantages appropriate to compact embedded systems. The XC3S50-4PQ208I provides 50,000 system gates, 1,728 logic cells, 124 user I/O pins, and 73,728 RAM bits. Its -4 speed designation identifies the verified performance grade, while the I suffix denotes the specified industrial temperature class. The 208-BFQFP package provides 208 physical terminals for PCB integration, with gull-wing leads and a square package format. The verified distributor listing also identifies 1.2 V FPGA operation and 90 nm technology. Because the device is programmable, engineers can implement parallel datapaths, control logic, interfaces, state machines, and signal-processing functions in one integrated device. The Spartan-3 architecture is useful when deterministic hardware timing and flexible post-build updates are more valuable than the simplicity of a fixed-function microcontroller or small PLD. Resource counts should be checked against the complete Xilinx datasheet before assigning a large design, especially when block RAM, DSP, clocking, or high-speed I/O requirements are substantial. Typical uses include industrial control, communications interfaces, test equipment, instrumentation, embedded gateways, and compact control systems. The 124 user I/O pins are useful for parallel buses, status LEDs, capture logic, and external interfaces. Designers must also budget pin multiplexing, clocking, configuration memory or configuration sources, I/O standards, power rails, and board-level signal integrity; those details are not fully specified in the supplied search data and must be verified against the manufacturer datasheet. A key design consideration is that an FPGA replacement must match the physical package, pinout, electrical limits, configuration method, memory resources, and timing requirements. The verified search results identify no pin-compatible substitute in the supplied cross-reference data, so a footprint-compatible replacement should not be assumed. This page consolidates verified specifications, sourcing links, application guidance, and the limitations of the available replacement data.

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XC3S50-4PQG208C - 50K Gate Spartan-3 FPGA | AMD
XC3S50-4PQG208C

XC3S50-4PQG208C - 50K Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4PQG208C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 124 user I/O, and a 630 MHz performance figure in a 208-pin PQFP package. It uses 90 nm fabrication technology, a 1.2 V core supply, and 3.3 V-compatible I/O according to the verified manufacturer-family and distributor information. The commercial-temperature suffix C supports operation from 0°C to 85°C. A field-programmable gate array, or FPGA, is a configurable digital integrated circuit whose logic, signal routing, and I/O behavior are defined by a bitstream loaded into on-chip configuration memory. The XC3S50-4PQG208C belongs to the Spartan-3 product family, which combines programmable logic blocks, block RAM, dedicated I/O structures, and embedded multiplier resources on one semiconductor device. The device provides 50,000 system gates and 1,728 logic cells for control logic, interface conversion, protocol bridging, and other parallel-processing functions. Its 124 user I/Os provide external connectivity for buses, counters, memory interfaces, and mixed-signal control functions. The verified family data also identifies 73 Kbit of block RAM and a 630 MHz performance figure, making it suitable for designs that combine logic with modest embedded data storage. The -4 code identifies the device performance grade within the Spartan-3 family, while PQG208 identifies the 208-pin PQFP package and C identifies the commercial temperature grade. The package uses gull-wing leads and measures 28 mm by 28 mm according to the verified listing data. The 1.2 V core architecture allows lower-voltage logic operation than conventional 3.3 V-only programmable logic implementations. Typical uses include industrial control, communications, sensor aggregation, protocol conversion, and embedded interface bridging. A practical design can place the FPGA between a processor and a legacy parallel peripheral, perform clock-domain or bus-format conversion in programmable logic, and use block RAM for buffering status or packet data. Designers must still verify timing, pin multiplexing, configuration interface support, and bank supply requirements against the complete Spartan-3 documentation. Power and signal-integrity planning are important because external interfaces may operate at 3.3 V while the core uses 1.2 V. Decouple each applicable supply rail locally, route high-speed signals over controlled-impedance paths, and use the package-defined land pattern and manufacturing guidelines. Because no direct manufacturer PDF link was exposed in the supplied verification set, the datasheet field links to the verified Octopart datasheet page rather than an invented document URL. This product record consolidates verified pricing, architecture details, package data, drop-in Spartan-3 family options, comparison parameters, and practical implementation guidance. It highlights which technical facts were explicitly available and identifies unavailable details transparently instead of substituting unverified values.

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XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx
XC3S50-4PQG208I

XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx

The AMD/Xilinx XC3S50-4PQG208I is a Spartan-3 family field-programmable gate array (FPGA) delivering 50,000 system gates, 1,728 logic cells, and 124 user I/O pins in a 208-pin plastic quad flat pack (PQFP / BFQFP) surface-mount package. The device operates from a 1.14V to 1.26V core supply, supports up to 630 MHz internal performance, and is specified for an industrial -40C to +100C junction temperature range (I-suffix). An FPGA (field-programmable gate array) is a reconfigurable integrated circuit whose logic fabric, block RAM, and I/O routing can be redefined after manufacture via a hardware description language (HDL) bitstream. FPGAs sit within the broader programmable logic category alongside CPLDs, and they are commonly chosen over ASICs for low- to mid-volume designs, prototyping, and applications requiring post-deployment firmware updates. The Spartan-3 family positioned Xilinx at the low-cost, high-volume end of the FPGA market, balancing logic density with low static power on a 90 nm process. Key features of the XC3S50-4PQG208I include 50K system gates, 1,728 logic cells organized across four programmable function blocks (CLB rows), 12 dedicated multiplier blocks for embedded DSP (18x18 signed multipliers), distributed SelectRAM, and SelectIO technology supporting LVCMOS, LVTTL, SSTL, and HSTL signaling standards. The 208-pin PQFP provides 124 usable user I/Os once power and JTAG pins are subtracted, and is the largest PQFP offered in the Spartan-3 family. Designers should plan for an external 50 MHz to 100 MHz clock source, a JTAG header for in-system programming via the Platform Flash or iMPACT tools, and decoupling per Xilinx application note UG110. The PQFP-208 footprint is legacy-friendly but offers less thermal performance than BGA packages; with the I-suffix industrial temperature rating the part remains viable for outdoor, automotive under-hood, and factory automation deployments. Typical applications include industrial motor control, low-cost display controllers, glue logic consolidation, and legacy communication bridges. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB-layout design notes not found in the manufacturer datasheet alone.

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XC3S50-4TQ144C - 50K-Gate Spartan-3 FPGA | AMD
XC3S50-4TQ144C

XC3S50-4TQ144C - 50K-Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4TQ144C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 97 user I/Os and 73,728 RAM bits in a 144-LQFP package. It operates from a 1.2 V supply and belongs to the Spartan-3 FPGA family. The -4 speed designation and commercial C temperature grade make it suitable for compact programmable-logic, control, interface and signal-processing designs. A field-programmable gate array is a semiconductor whose logic, interconnects and dedicated resources are configured after manufacture. The FPGA product hierarchy places the XC3S50-4TQ144C among FPGAs, programmable-logic devices and digital semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel control logic, state machines, protocol interfaces and data-processing pipelines in one configurable device. The verified listing identifies 192 logic array blocks, 97 user I/O pins, 73,728 RAM bits and 1,728 logic cells. These resources support concurrent datapaths and moderate control complexity. The 1.2 V core supply can simplify power architecture when paired with appropriate I/O voltage selection, although the complete board design must follow the manufacturer’s bank-specific voltage and decoupling guidance. Architecturally, the Spartan-3 device combines configurable logic blocks, programmable routing, dedicated block RAM and hard input/output resources. This allows designers to balance parallel logic against memory-based pipelines. Compared with larger members of the Spartan-3 family, the XC3S50 emphasizes compact capacity and cost rather than maximum logic density. Typical uses include industrial control, embedded instrumentation, communication-interface bridges, low-pin-count peripheral expansion, digital signal-processing front ends and general embedded control. A 144-LQFP package also provides a familiar gull-wing footprint for conventional multilayer PCB assembly, although its fine pitch requires controlled soldering and inspection. Designers should verify the complete pinout, supported I/O standards, configuration interface and unused-pin requirements against the manufacturer datasheet before layout release. The sparse verified data does not expose a manufacturer part page or complete electrical table, so power, timing and pin details must not be inferred. This page consolidates verified distributor specifications, package evidence, sourcing links and candid data-gap notes. It also separates exact published facts from unavailable electrical, pricing, lifecycle and pin-level information so engineers can make a safer FPGA selection.

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XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD
XC3S50-4TQ144I

XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD

AMD XC3S50-4TQ144I is a Spartan-3 field-programmable gate array (FPGA) with 50,000 system gates, 1,728 logic cells, 90 nm CMOS technology, and a 1.2 V supply in a 144-pin LQFP package. It is designed for embedded logic, control, interface, and signal-processing applications where reconfigurable hardware provides implementation flexibility without changing the PCB when logic requirements evolve. An FPGA is a programmable digital semiconductor whose configurable logic blocks, digital I/O, block RAM, and dedicated resources can be interconnected to implement custom circuits. In the Spartan-3 hierarchy, an FPGA sits below field-programmable logic and combines programmable digital logic with memory and I/O resources. The XC3S50-4TQ144I therefore belongs to the broader category of programmable-logic semiconductors rather than fixed-function processors or analog ICs. The verified product data identifies 50,000 system gates, 1,728 logic cells, 73,728 bits of RAM, and 97 I/O resources. The part is offered in a surface-mount 144-pin LQFP package and uses a 1.2 V FPGA supply as identified by distributor data. Its -4 speed designation indicates a performance-grade ordering option, while the I suffix identifies the industrial-temperature ordering variant. The available distributor references identify the device as an AMD/Xilinx Spartan-3 FPGA. The architecture is useful for parallel datapaths, state machines, protocol bridges, control logic, and small embedded processing systems. On-chip RAM can support buffering, lookup tables, packet handling, and DSP-adjacent functions where a fixed register file would be inefficient. The 144-LQFP package exposes the device's I/O through gull-wing leads, making it suitable for conventional PCB assembly and prototype-to-production migration when the board footprint and pinout are matched. Typical design work includes selecting the correct configuration interface, connecting the 1.2 V core supply and required I/O supplies, programming the configuration memory, and validating timing for the -4 grade. Designers should use the official Spartan-3 documentation for pin names, voltage limits, configuration pins, and package drawings rather than relying on abbreviated distributor descriptions. This page synthesizes verified distributor specifications, sourcing information, package data, and design-oriented guidance for engineers evaluating XC3S50-4TQ144I. It does not infer undocumented timing, current, temperature, or compliance values; missing engineering data is explicitly marked for follow-up.

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XC3S50-4TQG144C - 50K Spartan-3 FPGA, 144-TQFP | AMD Xilinx
XC3S50-4TQG144C

XC3S50-4TQG144C - 50K Spartan-3 FPGA, 144-TQFP | AMD Xilinx

AMD Xilinx XC3S50-4TQG144C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, and a 144-lead TQFP package. The device operates from a 1.14 V to 1.26 V core supply, uses 90 nm fabrication technology, and is offered in a commercial-temperature grade specified for a 0°C to 85°C operating junction range. These characteristics place it in the FPGA and CPLD category, where configurable logic replaces a fixed application-specific integrated circuit. A field-programmable gate array is a semiconductor containing programmable lookup tables, routing, block memory, and configurable input/output resources. It sits within the broader programmable-logic hierarchy of FPGA and CPLD devices, enabling parallel digital logic, control functions, serial communication, and embedded memory to be consolidated into one configurable device. The XC3S50-4TQG144C provides 97 dedicated I/O resources according to its distributor listing, giving a designer a substantial interface complement relative to its 50,000-system-gate logic capacity. The Spartan-3 architecture combines configurable logic with embedded block RAM and dedicated input/output resources in a single device. Its stated 630 MHz performance figure makes it suitable for clocked control logic, data acquisition, industrial interfaces, communications equipment, and embedded system prototypes. The four-speed-grade suffix identifies a device positioned for a maximum 630 MHz operation, while the TQG144 portion identifies the physical 144-pin TQFP package used for surface-mount PCB assembly. The 90 nm process and 1.2 V core supply provide useful context when comparing this device with later programmable-logic families. A 1.2 V core requires appropriate on-board supply regulation and decoupling, while the 144-pin package offers a conventional quad-flat lead arrangement that can simplify inspection and rework. Designers should still follow the AMD Spartan-3 selection guide, pinout, configuration guidance, and power-supply recommendations for the exact device variant. Typical uses include industrial automation, communications, automotive electronics, embedded control, data-capture, and general digital prototyping. In these applications, the FPGA can implement parallel pipelines or state machines while its programmable I/O interfaces external converters, sensors, memories, and communications transceivers. Its commercial operating grade and 50,000-system-gate capacity make it most appropriate when moderate logic density is needed without moving to a larger package. The principal design consideration is migration and configuration reliability. PCB design must preserve the TQFP-144 footprint, power and ground distribution, decoupling, configuration interface, and exposed I/O constraints of the selected Spartan-3 device. Although XC3S50AN-4TQG144C appears in cross-reference results, designers must confirm that configuration behavior, supported I/O standards, memory resources, and power requirements are fully interchangeable before using it as a replacement. This page consolidates verified distributor specifications, package details, temperature information, and candidate replacement data with practical selection guidance. It also distinguishes true same-package options from alternatives that require a different package, helping engineers reduce procurement and PCB-rework risk.

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XC3S50-4TQG144I - 50K Spartan-3 FPGA, 144-TQFP | AMD
XC3S50-4TQG144I

XC3S50-4TQG144I - 50K Spartan-3 FPGA, 144-TQFP | AMD

The AMD XC3S50-4TQG144I is a Spartan-3 field-programmable gate array in a 144-pin TQFP package, built around 50,000 system gates, 1,728 logic cells, 192 configurable logic blocks, 97 user I/Os, and 73,728 bits of block RAM. The device uses a 90 nm process and a nominal 1.2 V core supply, making it suitable for compact embedded, industrial-control, communications, and cost-sensitive logic applications. Its industrial-temperature suffix identifies the XC3S50-4TQG144I as an extended-temperature option for systems requiring operation beyond commercial-temperature limits. A field-programmable gate array is a semiconductor device whose configurable logic, block memory, and programmable I/O can be programmed after manufacture. The Spartan-3 FPGA family belongs to the broader FPGA and programmable-logic hierarchy, while the XC3S50 device provides a balance of logic density, memory, and I/O capacity for control logic, data acquisition, protocol bridging, embedded signal processing, and general-purpose parallel processing. The XC3S50-4TQG144I is therefore a programmable-logic alternative to a collection of fixed-function glue-logic devices when design flexibility and field updates are important. Key resources include 50,000 equivalent system gates, 1,728 logic cells, 192 CLBs, 97 user I/Os, and 73,728 bits of block RAM. The -4 speed designation identifies the device performance grade, while the TQG144 package provides a 144-pin surface-mount footprint. The 1.2 V core operating point supports low-voltage digital core operation, while external circuitry supplies the board-level I/O and power requirements. The Spartan-3 architecture supports parallel programmable logic alongside dedicated block RAM for buffering, FIFOs, and data storage. This combination makes the XC3S50-4TQG144I useful for industrial controllers, communications interfaces, test equipment, embedded control systems, and sensor or acquisition platforms. The 97 available user I/Os provide connectivity for control signals, serial interfaces implemented in programmable logic, memory interfaces, and external peripherals. Designers should verify the device-specific pinout, configuration interface, power rails, decoupling requirements, and supported I/O standards against the official Spartan-3 documentation before layout or schematic release. The TQFP package is pin-compatible with other verified 144-pin Spartan-3 variants only where the exact device, speed grade, package code, and electrical requirements match. Configuration should also include a defined startup path, suitable clocking, and adequate power-supply sequencing. This page consolidates verified distributor and manufacturer-linked specifications, practical application guidance, same-footprint replacement candidates, and design cautions. It is intended to help engineers identify whether the XC3S50-4TQG144I matches the required logic density, memory capacity, package, temperature class, and supply requirements without relying on incomplete catalog summaries.

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