ATSAMD51J19A-MUT-EFP - 120 MHz Cortex-M4F MCU, 64-VQFN | Microchip
MPN: ATSAMD51J19A-MUT-EFP ✓ Hoạt độngATSAMD51J19A-MUT-EFP Tóm tắt
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile memory (SRAM), non-volatile memory (Flash), and a rich set of peripherals such as timers, ADCs, communication controllers (SERCOM), USB, and I/O ports. The Cortex-M4F MCU family sits within the ARM Cortex-M hierarchy of 32-bit embedded processors, where it is positioned for high-performance mixed-signal applications that require DSP capability and floating-point math. Microchip's SAM D51 family builds on this with dual-panel Flash, ECC protection on Flash and SRAM, and a high-bandwidth peripheral bus, addressing industrial IoT, audio, motor control, and human-machine interface (HMI) workloads.
Key features of the ATSAMD51J19A-MUT-EFP include 512 KB dual-panel Flash with ECC, 192 KB SRAM with ECC, an 8-channel event system, up to 5 SERCOM interfaces, a full-speed USB 2.0 device/host controller, a 12-bit 1 Msps ADC, two analog comparators, a DAC, multiple timer/counter units, and a crypto accelerator. The 120 MHz Cortex-M4F core delivers 150 CoreMark and approximately 1.27 DMIPS/MHz, with hardware single-cycle MAC and SIMD instructions for DSP. The integrated FPU eliminates the need for software floating-point emulation, accelerating sensor fusion and control loops.
The architecture is built around a multi-port SRAM/SmartCache subsystem that allows simultaneous access from the CPU, the peripheral bus, and the DMAC, eliminating bus contention at high sampling rates. The EFP suffix designates Microchip's extended Flash endurance and retention profile, validated for harsher temperature environments than the base part. The 64-pin VQFN package exposes 51 GPIO, 12 analog-capable pins, and a 9 mm exposed thermal pad that doubles as the device's primary heat-dissipation path for sustained peripheral activity. Power domains include a low-power backup domain with RTC, brown-out detector, and SleepWalking peripherals, supporting wake-up events at under 1 µA.
Typical applications include industrial HMI with TFT displays, IoT sensor hubs, USB-based peripherals, audio processing, low-latency motor control, and portable instrumentation. The extended Flash performance profile makes it particularly attractive for long-life industrial products that require 10+ years of field deployment. Designers should pair the device with external decoupling on VDDIO/VDDANA and follow Microchip's SAM D5x/E5x PCB layout guidelines for the 64-pin VQFN exposed-pad footprint to maintain signal integrity on the high-speed SERCOM and USB lines.
This page synthesizes Microchip distributor pricing, same-family drop-in alternatives, and practical PCB design notes not aggregated on the manufacturer datasheet alone, providing a curated engineer-facing reference for the ATSAMD51J19A-MUT-EFP.
Bộ thay thế dễ dàng lắp đặt cho ATSAMD51J19A-MUT-EFP — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ATSAMD51J19A-MUT-EFP (cùng hình factor và footprint) — khác nhau ở Package, ADC, SRAM, DAC, Core.
ATSAME51J19A-MUT-EFP
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAMD51J19A-AUT-EFP
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAMD51J19A-MU-EFP
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAMD51J19A-AFT
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAMD51J18A-MU
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAMD51G19A-MFT
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →ATSAMD51J19A-MUT-EFP Tỷ lệ tối đa & tính chất điện
| Core Architecture | ARM Cortex-M4F with single-precision FPU |
| Maximum CPU Clock | 120 MHz |
| Flash Memory | 512 KB (dual-panel with ECC) |
| SRAM | 192 KB with ECC |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Hộp | 64-pin VQFN (9x9 mm) with exposed thermal pad |
| GPIO Count | 51 (multiplexed) |
| ADC | 12-bit, up to 1 Msps, 16 channels |
| DAC Channels | 2 (10-bit) |
| USB | USB 2.0 Full-Speed Device/Host |
| SERCOM / COM Interfaces | Up to 5 (UART/SPI/I2C configurable) |
| Timers | Multiple TC, TCC, and 32-bit RTC |
| Nhiệt độ hoạt động | -40 C to +85 C (industrial) |
| Kiểu lắp đặt | Surface Mount |
| Cấp MSL | 3 (168 hours) |
| Trạng thái RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes (per Microchip product page) |
Hướng dẫn cấu hình chân ATSAMD51J19A-MUT-EFP 64-pin vqfn (9x9 mm) with exposed thermal pad
Cấu hình chân cho ATSAMD51J19A-MUT-EFP (64-pin vqfn (9x9 mm) with exposed thermal pad gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho ATSAMD51J19A-MUT-EFP.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
ATSAMD51J19A-MUT-EFP phù hợp cho 6 Áp dụngs: Industrial Human-Machine Interface (HMI), USB-Based Peripherals and Dongles, Audio Processing and Synthesis, Low-Latency Motor Control and Field-Oriented Control (FOC), IoT Sensor Hubs and Edge Aggregation, Portable Instrumentation and Data Loggers.
Industrial Human-Machine Interface (HMI)
The ATSAMD51J19A-MUT-EFP's 120 MHz Cortex-M4F core, 192 KB SRAM, and integrated TFT/LCDC-capable peripheral set make it ideal for industrial HMI panels with TFT displays up to 480x320. Its 12-bit 1 Msps ADC supports touch-screen voltage-division scanning, while the SERCOM controllers can drive QSPI Flash for fast image retrieval. The Extended Flash Performance (EFP) grade guarantees retention over 10+ years of continuous industrial duty at 85 C, ideal for factory-floor panels.
Được đề xuất
USB-Based Peripherals and Dongles
With on-chip USB 2.0 Full-Speed Device/Host and the Cortex-M4F core's deterministic latency, the ATSAMD51J19A-MUT-EFP powers USB HID, CDC, and custom-class peripherals such as industrial dongles, configuration tools, and embedded test instruments. The 512 KB Flash holds USB stack plus application code; the 192 KB SRAM supports bidirectional USB buffering without DMA thrash. The 64-pin VQFN keeps PCB footprint below 9x9 mm, ideal for compact dongle designs.
Được đề xuất
Audio Processing and Synthesis
The Cortex-M4F DSP extensions and single-precision FPU accelerate audio sample-rate conversion, FFT-based spectral analysis, and synthesized instrument playback at 48 kHz and 96 kHz. The 12-bit 1 Msps ADC and dual 10-bit DAC pair with I2S/SSC peripherals to deliver full-duplex audio paths. The 192 KB SRAM accommodates 3840 samples of 16-bit audio at 96 kHz with room for DMA ping-pong buffers, while USB 2.0 Full-Speed delivers the device-side audio stream to a host.
Được đề xuất
Low-Latency Motor Control and Field-Oriented Control (FOC)
The ATSAMD51J19A-MUT-EFP's TCC timer units deliver PWM with sub-microsecond dead-time insertion for 3-phase FOC of PMSM/BLDC motors. The Cortex-M4F core executes Park/Clarke transforms in single-cycle MAC instructions, while the 12-bit ADC synchronizes to PWM edges for sub-µs current-loop sampling. The 192 KB SRAM holds a full PID loop plus sensor-fusion buffers, and the 64-pin VQFN exposed pad dissipates thermal load at sustained 50 kHz PWM switching.
Được đề xuất
IoT Sensor Hubs and Edge Aggregation
The five configurable SERCOM interfaces let the ATSAMD51J19A-MUT-EFP aggregate UART/SPI/I2C sensor data from multiple buses simultaneously. Cortex-M4F DSP accelerates on-device sensor fusion (e.g., IMU + magnetometer 9-DoF fusion), and the Event System routes peripheral triggers without CPU wake-ups, cutting average current to the low-power backup domain. The 1.71V-3.6V supply tolerates Li-Ion battery droop directly. Extended Flash endurance ensures multi-year field deployment.
Được đề xuất
Portable Instrumentation and Data Loggers
The ATSAMD51J19A-MUT-EFP's USB 2.0, 12-bit 1 Msps ADC, and 192 KB SRAM form a portable data-logger front-end: capture multiple analog channels, stream via USB or buffer to external QSPI Flash, and run on USB bus power or Li-Ion. The Cortex-M4F DSP accelerates FFT-based vibration or power-quality analysis. The Extended Flash Performance (EFP) profile ensures long-term Flash integrity in field-deployed loggers at industrial temperatures.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ATSAMD51J19A-MUT-EFP — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ATSAME51J19A-MUT-EFP | ATSAMD51J19A-AUT-EFP | ATSAMD51J19A-MU-EFP | ATSAMD51J19A-AFT | ATSAMD51J18A-MU | ATSAMD51G19A-MFT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin VQFN (9x9 mm) | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin TQFP | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same |
| Core / Architecture | ARM Cortex-M4F @ 120 MHz with FPU | ARM Cortex-M4F @ 120 MHz with FPU | ARM Cortex-M4F @ 120 MHz with FPU | ARM Cortex-M4F @ 120 MHz with FPU | ARM Cortex-M4F @ 120 MHz with FPU | ARM Cortex-M4F @ 120 MHz with FPU | ARM Cortex-M4F @ 120 MHz with FPU |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 256 KB |
| USB | USB 2.0 Full-Speed Device/Host | USB 2.0 Full-Speed Device/Host | USB 2.0 Full-Speed Device/Host | USB 2.0 Full-Speed Device/Host | USB 2.0 Full-Speed Device/Host | USB 2.0 Full-Speed Device/Host | USB 2.0 Full-Speed Device/Host |
| Crypto Accelerator | No | Yes (TRNG, AES, SecureBoot) | No | No | No | No | No |
| Operating Temperature | -40 C to +85 C (industrial, EFP) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Bảo phân biệt quan trọng
- Extended Flash Performance (EFP) grade for long-life industrial deployment (vsATSAMD51J19A-MF)
- Dual-panel Flash with ECC on both Flash and SRAM (vsATSAMD51J18A-MU)
- Tape & Reel packing for high-volume production lines (vsATSAMD51J19A-MU-EFP)
- Higher-SRAM drop-in available for memory-bound workloads (vsATSAMD51G19A-MFT)
Ghi chú thiết kế
The 64-pin VQFN (9x9 mm) has a large central exposed thermal pad that doubles as the primary heat-dissipation path. Solder this EP to a continuous, ground-plane-connected copper pour using an array of thermal vias (typically 0.3 mm drill, 0.5 mm pitch, 5x5 grid) to meet Microchip's thermal specifications. Failing to solder the EP results in thermal derating and intermittent failures at sustained CPU + ADC activity.
Use the dedicated VDDIO and VDDANA pins separately, with 100 nF + 10 µF decoupling on each rail placed within 2 mm of the pin. The 1.71V-3.6V supply tolerates Li-Ion droop, but the VDDANA noise budget directly impacts ADC accuracy - keep its ground return current separate from the VDDIO return path. The brown-out detector should be configured for the application's minimum rail to prevent Flash corruption during power-down.
Place the 12-bit ADC analog inputs away from switching PWM outputs and route them over a continuous ground reference plane to maintain < 1 LSB noise. Per Microchip's SAM D5X hardware-design guidelines, isolate the analog ground via a ferrite bead or 0-ohm resistor from the digital ground; the SAR ADC's sample capacitor draws transient current that injects noise into the digital return path if grounds are not split.
Do not reuse the 64-pin VQFN layout for the 64-pin TQFP variant without verification - while both are pin-compatible in functional terms, the EP-thermal path differs and thermal performance is not equivalent. Boot pin state and NVMCTRL settings must match between firmware revisions; otherwise, a new build can lock the device into an unintended boot mode. Always populate a debug-header footprint (SWD/SWDIO) for field recovery.
The USB 2.0 Full-Speed lines (DP, DM) require 90-ohm differential impedance and series resistors (typically 22-ohm) near the MCU side per Microchip's USB hardware checklist. Series ferrite beads on VBUS and shield-ground bonding through a 4.7 nF Y-capacitor are recommended for EMI. Route USB DP/DM away from clock traces to avoid 480 MHz harmonics coupling into adjacent analog channels.
Thông tin tuân thủ
RoHS and lead-free compliance per Microchip product page. Not AEC-Q100 qualified - SAM D51 family does not target automotive grade 115. For automotive-grade Cortex-M4F in this density class, see SAM V71 family instead.
