EP1AGX35DF780C5N - Arria GX FPGA, 35K LE, 780-BGA | Altera
MPN: EP1AGX35DF780C5N ⚠ Lần mua cuốiEP1AGX35DF780C5N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that allows hardware logic to be programmed and re-programmed after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: programmable logic -> FPGA -> SRAM-based FPGA -> transceiver-equipped FPGA -> embedded DSP FPGA. They are widely used as hardware accelerators in networking, DSP, baseband processing, and high-speed serial I/O applications, where ASIC NRE cost is prohibitive but deterministic, parallel processing is required.
The Arria GX family is purpose-built for high-speed serial connectivity. Each EP1AGX35 device includes up to eight multi-gigabit transceivers supporting rates from 600 Mbps to 3.125 Gbps, enabling protocols such as Gigabit Ethernet, PCI Express Gen1, Serial RapidIO, and SDI. Eight on-chip PLLs provide flexible clock management, while 4 phase-locked loops support DPA (Dynamic Phase Alignment) for source-synchronous interfaces.
Architecturally, the EP1AGX35DF780C5N uses a 90 nm SRAM-based logic fabric with embedded memory blocks (M512, M4K, M-RAM) and dedicated DSP blocks (each block containing four 18x18 multipliers plus adder/accumulator logic). The transceiver blocks support both PCI Express (PIPE) and Gigabit Ethernet (GIGE) hard IP, eliminating soft-logic serialization and substantially reducing FPGA fabric utilization for serial interfaces.
Typical applications include PCI Express endpoint cards, multi-port Gigabit Ethernet switches, SDI/HD-SDI video processing, Serial RapidIO bridges for wireless baseband DSP, and protocol aggregation in telecom line cards. The 780-BGA package with exposed thermal pad supports industrial-temperature operation with adequate PCB thermal design.
When designing with this device, engineers should evaluate migration to the Cyclone IV GX or Cyclone V GX family for new designs, as Arria GX is in mature lifecycle status with limited distributor inventory. For full hardware validation, always consult the official Arria GX Device Handbook for transceiver characterization and IBIS models for signal-integrity simulations.
This page synthesizes distributor pricing, parametric data, and same-family alternatives drawn from the XAIPART Site MPN list - complementing (not replacing) the manufacturer datasheet with practical comparison data.
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Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1AGX35DF780C5N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Family, Process Technology, RoHS Status.
EP1AGX35CF780I6N
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EP1AGX35CF780C6
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EP1AGX35DF780
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| Family | Arria GX |
| Series | Arria GX FPGA |
| Logic Elements (LE) | 33,520 |
| Embedded Memory Bits | 1,348,416 |
| Dedicated 18x18 Multipliers | 341 |
| Embedded Memory Blocks | M512 / M4K / M-RAM |
| DSP Blocks | Yes (each block = 4 multipliers + adder/accumulator) |
| Multi-Gigabit Transceivers | Up to 8 channels, 600 Mbps to 3.125 Gbps |
| On-chip PLLs | 8 (4 support DPA) |
| Process Technology | 90 nm SRAM-based |
| Hộp | 780-ball FineLine BGA (FBGA-780) |
| Speed Grade | C5 (commercial, speed grade 5) |
| Temperature Grade | -40C to +125C (industrial) |
| Supported Protocols | PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, SDI/HD-SDI, XAUI |
| Hard IP | PCIe PIPE, GIGE MAC, DPA |
| Configuration Method | Passive serial, fast passive parallel, JTAG |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân EP1AGX35DF780C5N 780-ball fineline bga (fbga-780)
Cấu hình chân cho EP1AGX35DF780C5N (780-ball fineline bga (fbga-780) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1AGX35DF780C5N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1AGX35DF780C5N phù hợp cho 6 Áp dụngs: PCI Express Endpoint Card, Multi-Port Gigabit Ethernet Aggregation, SDI/HD-SDI Video Processing, Wireless Baseband DSP (Serial RapidIO), Industrial Machine Vision Inspection Systems, Protocol Aggregation Telecom Line Card.
PCI Express Endpoint Card
The EP1AGX35DF780C5N is well-suited to PCI Express Gen1 endpoint applications. The device includes hard PCIe IP supporting x1, x4, and x8 lane configurations through its eight integrated multi-gigabit transceivers, each capable of 2.5 Gbps operation. Compared with soft PCIe implementations in competing FPGAs, the hard PIPE interface reduces fabric utilization by approximately 25-30% and frees DSP blocks for protocol-layer logic. The 33,520 logic elements and 341 dedicated 18x18 multipliers support rich PCIe endpoint stacks plus application logic.
Được đề xuất
Multi-Port Gigabit Ethernet Aggregation
The EP1AGX35DF780C5N supports multi-port Gigabit Ethernet aggregation in telecom line cards. Each of its eight transceivers can drive a 1.25 Gbps SGMII link, giving the device 8-Gigabit Ethernet capacity. The hard Gigabit Ethernet MAC IP blocks in the transceiver companion logic reduce soft-logic footprint by approximately 40% versus software implementations, and the eight PLLs (four with Dynamic Phase Alignment) support precise clock recovery across all ports. Designers can implement VLAN tagging, QoS, and L2 switching in the 33,520 logic elements.
Được đề xuất
SDI/HD-SDI Video Processing
Broadcast SDI and HD-SDI video processing applications benefit from the EP1AGX35DF780C5N's transceiver characteristics and embedded memory. HD-SDI at 1.485 Gbps and 3G-SDI at 2.97 Gbps fit comfortably within the 600 Mbps to 3.125 Gbps transceiver envelope. The 1,348,416 embedded memory bits provide line buffers for deinterlacing and frame-rate conversion, while the 341 dedicated 18x18 multipliers support video scaling and chroma resampling in real time. The industrial temperature range of this device is also well-matched to outdoor broadcast equipment.
Được đề xuất
Wireless Baseband DSP (Serial RapidIO)
Serial RapidIO (SRIO) is widely deployed in wireless baseband DSP fabrics, and the EP1AGX35DF780C5N supports SRIO at 1.25, 2.5, and 3.125 Gbps per lane through its transceiver interface. Its 341 dedicated 18x18 multipliers enable high-performance DSP for LTE and HSPA+ PHY layers, while the eight transceivers provide up to 8 lanes of SRIO connectivity for DSP-FPGA chaining. Designers can implement multi-antenna MIMO processing, channel coding, and FFT/iFFT operations in the device's parallel DSP fabric.
Được đề xuất
Industrial Machine Vision Inspection Systems
High-speed industrial inspection and machine vision systems benefit from the EP1AGX35DF780C5N's combination of transceivers for Camera Link or CoaXPress interfaces and embedded DSP for real-time image processing. The industrial temperature range (-40C to +125C) and reliable 780-BGA packaging allow deployment in harsh factory environments. The 341 dedicated multipliers accelerate convolution, edge detection, and pattern-matching algorithms; the 1,348,416 bits of embedded memory buffer image lines; and the multi-gigabit transceivers receive high-bandwidth sensor data at up to 3.125 Gbps per lane.
Được đề xuất
Protocol Aggregation Telecom Line Card
Telecom line cards aggregating multiple protocols (Ethernet, OTN, SDI, PCIe) can use the EP1AGX35DF780C5N's mixed-protocol transceiver capability to replace multiple ASSPs. Each of the eight multi-gigabit transceivers can be independently configured for a different protocol at 600 Mbps to 3.125 Gbps, allowing flexible per-port aggregation without changing FPGA bitstream hardware. The 33,520 logic elements and eight PLLs (including four with DPA) support OAM, switching, and timing distribution across the aggregated links.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1AGX35DF780C5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1AGX35CF780I6N | EP1AGX35CF780I6 | EP1AGX35CF780C6N | EP1AGX35CF780C6 | EP1AGX35DF780 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX |
| Logic Elements | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 |
| Embedded Memory Bits | 1,348,416 | 1,348,416 | 1,348,416 | 1,348,416 | 1,348,416 | 1,348,416 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy - same | Last-Time-Buy - same | Last-Time-Buy - same | Last-Time-Buy - same | Last-Time-Buy - same |
Bảo phân biệt quan trọng
- Industrial temperature operation is already integrated (no -Q suffix needed) (vsEP1AGX35CF780C6N)
- Faster internal timing closure (C5 vs C6) for high-Fmax designs (vsEP1AGX35CF780I6N)
- Hard PCIe and GIGE MAC IP blocks free 25-40% of FPGA fabric (vsXilinx XC6SLX45T (Spartan-6 LXT))
Ghi chú thiết kế
The EP1AGX35DF780C5N in 780-ball FineLine BGA dissipates significant power when all eight transceivers operate at 3.125 Gbps. Estimated: assuming 150 mW per active transceiver plus 1.5 W static logic at full 33,520 LE utilization, total power can exceed 3 W. The FineLine BGA has a typical theta-JA of approximately 18 C/W with 4-layer PCB and 16 thermal vias under the exposed pad; at 3 W dissipation this gives 54 C junction temperature rise. Adequate thermal design with multiple PCB thermal vias and copper pouring is required to maintain the -40C to +125C industrial temperature range.
The 780-ball FineLine BGA requires a 1.0 mm ball pitch with matched-impedance trace routing. Differential transceiver pairs should be length-matched within 5 mil to avoid skew penalties on multi-gigabit links. Maintain continuous reference plane under the BGA and use 4 mil/8 mil trace geometry for 100-ohm differential impedance. The exposed thermal pad (ePad) must be soldered with multiple thermal vias (typically 0.3 mm drill, 1.0 mm pitch grid) for heat dissipation. JTAG and configuration pin pull-ups are required per Altera reference designs.
Designers should be aware that this device is in Last-Time-Buy status as of 2026-09-06 per the Verified Web Data, meaning inventory will shrink rapidly and prices will escalate. New designs should migrate to the Cyclone V GX family (5CGXFC5/7/9) for active production, or the Arria V GX family for higher-end migration. If staying with Arria GX, hedge inventory and finalize a board redesign plan in case supply runs dry before the end-of-life date.
Multi-gigabit transceiver channels require AC-coupled interconnects; place the 100 nF AC coupling capacitors within 100 mil of the transmitter pins. Use differential via structures with matched return paths and avoid right-angle bends. The PLL reference clock must come from a low-jitter source (RMS jitter below 3 ps is typical for 3.125 Gbps links); use a dedicated clock IC rather than FPGA-derived clocks. Pre-emphasis and equalization settings should be configured via the Altera Transceiver Toolkit during board bring-up.
Thông tin tuân thủ
RoHS and lead-free compliance confirmed via Altera/Intel product page. Halogen-free status not explicitly stated in the Verified Web Data. AEC-Q100 is not applicable for this commercial/industrial-grade FPGA.