EP20K600CB652C8N - 600K Gate APEX 20KC FPGA, BGA-652 | Altera
MPN: EP20K600CB652C8N ✗ Cuối đờiEP20K600CB652C8N Tóm tắt
An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, programmable I/O cells, and dedicated routing resources. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> loadable PLDs -> FPGAs -> programmable logic ICs. APEX 20KC devices specifically integrate MultiCore architecture combining look-up table (LUT) logic, embedded system blocks (ESBs) that can be configured as RAM/ROM/CAM, and high-speed I/O, allowing a single chip to replace discrete glue logic, memory, and bus-interface components.
Key specifications of the EP20K600CB652C8N include 488 user I/O pins, 4 dedicated inputs, 480 outputs, an internal propagation delay of approximately 1.48 ns (pin-to-pin timing window 1.78 ns), a 1.8 V core supply (1.71 V to 1.89 V), and a commercial operating temperature grade of 0 °C to 85 °C. The part is offered in speed grade 8 (C8).
Architecturally, the device pairs LUT-based logic with embedded memory and uses high-performance, low-power copper interconnect across all metal layers. This combination gives designers flexible on-chip storage for FIFO buffers, register files, and CAM-based lookup tables alongside general-purpose combinatorial and sequential logic, all routable through the same programmable fabric.
Typical applications include telecommunications line cards, high-speed data-packet processors, DSP co-processing, protocol bridging, ASIC prototyping, and high-density glue-logic consolidation for networking and industrial systems. Designers benefit from the APEX 20KC family’s pin-compatibility with APEX 20KE, allowing performance upgrades without PCB rework.
When designing with the EP20K600CB652C8N, engineers must respect the 1.8 V core supply tolerance (1.71 V to 1.89 V) and use Altera’s Quartus II design suite (legacy support) for synthesis, place-and-route, and bitstream generation. Proper decoupling of the 488 user I/O banks and the LVTTL/LVCMOS/PCI-compatible I/O standards is essential for signal-integrity at the 301 MHz internal frequency.
This page synthesizes distributor pricing, APEX 20KC family drop-in alternatives, and practical design notes not found in the original datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP20K600CB652C8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K600CB652C8N (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Speed Grade, Device Type.
EP20K600CB652C8
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600CB652C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600CB652C7ES
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600CB652C-8
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600CB652C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600CB652C7E5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600CB652C8N Tỷ lệ tối đa & tính chất điện
| Family | APEX 20KC |
| Device Type | Loadable PLD / FPGA |
| System Gates | 600,000 |
| Logic Elements | 24,320 cells |
| Embedded Memory | 311,296 bits |
| User I/O Pins | 488 |
| Dedicated Inputs | 4 |
| Outputs | 480 |
| Propagation Delay (typ.) | 1.48 ns |
| Pin-to-Pin Timing | 1.78 ns |
| Internal Frequency (typ.) | 301.21 MHz |
| Core Supply Voltage | 1.8 V nominal (1.71 V to 1.89 V) |
| Process Technology | 0.18 µm all-layer copper-metal |
| Speed Grade | C8 |
| Nhiệt độ hoạt động | 0 °C to 85 °C (commercial) |
| Hộp | 652-ball LBGA, 45 x 45 mm, 1.27 mm pitch |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Architecture | MultiCore LUT + Embedded System Blocks (ESB) |
| Pin-Compatible With | APEX 20KE family |
| Trạng thái RoHS | unknown |
Hướng dẫn cấu hình chân EP20K600CB652C8N 652-ball lbga, 45 x 45 mm, 1.27 mm pitch
Cấu hình chân cho EP20K600CB652C8N (652-ball lbga, 45 x 45 mm, 1.27 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP20K600CB652C8N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP20K600CB652C8N phù hợp cho 6 Áp dụngs: Telecom Line-Card Design, ASIC Prototyping and Emulation, High-Density Glue Logic Consolidation, DSP Co-Processing and Pipeline Acceleration, Industrial Control and Networking Equipment, Legacy Aerospace and Defense Avionics (Sustaining Engineering).
Telecom Line-Card Design
The EP20K600CB652C8N fits telecom line-card designs thanks to its 488 user I/O pins, 311,296 bits of embedded memory, and 24,320 logic elements. These resources support high-channel-count data-packet framing, ATM/SONET/SDH cell processing, and serial-to-parallel protocol conversion without external glue logic. The 301 MHz internal frequency and 1.48 ns typical propagation delay enable line-rate processing for legacy OC-3/OC-12 paths, while the 1.8 V core minimizes per-line power. Its pin-compatible upgrade path to APEX 20KE devices protects design investment when migrating platforms.
Được đề xuất
ASIC Prototyping and Emulation
The EP20K600CB652C8N is well matched to ASIC prototyping because its 600K system gates and MultiCore LUT + embedded memory architecture let designers map large ASIC RTL blocks onto a single device. With 488 user I/O pins, engineers can break out wide on-chip buses to header connectors for logic-analyzer or speed-bridge debugging. The 1.48 ns propagation delay and 301 MHz fabric frequency preserve timing margin when emulating mid-complexity ASICs. Quartus II synthesis with the APEX 20KC device library keeps RTL-to-bitstream flow identical to production silicon.
Được đề xuất
High-Density Glue Logic Consolidation
Designers consolidating discrete CMOS/TTL glue logic onto a single FPGA benefit from the EP20K600CB652C8N's 24,320 logic elements and 480 outputs. Wide address and data buses can be re-mapped on-chip, reducing PCB complexity and improving signal-integrity at 301 MHz. The 311,296 bits of embedded RAM replace external FIFOs and register files used for bus buffering, while 488 user I/O pins support multi-bridge applications such as PCI-to-PCI or memory-controller aggregation. Pin-compatibility with APEX 20KE lets teams scale density without board re-spins.
Được đề xuất
DSP Co-Processing and Pipeline Acceleration
The EP20K600CB652C8N serves as a DSP co-processor by dedicating logic elements to MAC pipelines, FIR filters, and FFT butterflies while embedded memory blocks hold coefficient tables and ping-pong sample buffers. Its 301 MHz fabric frequency and 1.48 ns propagation delay sustain real-time data rates for sample streams up to several hundred MSPS in baseband or modem subsystems. 488 user I/O pins provide ample parallel interface bandwidth to host DSPs, ADCs, and DACs, and pin-compatibility with APEX 20KE preserves board layout across design revisions.
Được đề xuất
Industrial Control and Networking Equipment
Industrial control and networking systems rely on the EP20K600CB652C8N for protocol bridging, multi-port Ethernet switching glue, and fieldbus aggregation. With 488 user I/O pins, the FPGA can terminate multiple serial buses (SPI, I2C, UART, CAN) in parallel and run protocol stacks in logic. The 0 °C to 85 °C commercial temperature range suits factory-floor enclosures, and the 1.8 V core supply (1.71 V to 1.89 V) simplifies power-tree design alongside 3.3 V I/O. Legacy equipment upgrades often select this device because of long-term firmware stability in Quartus II.
Được đề xuất
Legacy Aerospace and Defense Avionics (Sustaining Engineering)
Sustaining-engineering programs in aerospace and defense continue to specify the EP20K600CB652C8N because fielded avionics and mission computers were designed around its APEX 20KC MultiCore architecture. The 652-ball LBGA, 488 user I/O pins, and 311,296-bit embedded memory cover MIL-STD-1553, ARINC 429, and discrete I/O aggregation tasks. Drop-in variants such as EP20K600CB652C7N (C7 speed grade) and EP20K600CB652C7ES (extended screening) allow incremental timing or reliability upgrades without board re-design, preserving form-fit-function across the fleet.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K600CB652C8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K600CB652C8 | EP20K600CB652C7N | EP20K600CB652C7ES | EP20K600CB652C-8 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 652-ball LBGA (45x45 mm, 1.27 mm pitch) | 652-ball LBGA (45x45 mm) - same | 652-ball LBGA (45x45 mm) - same | 652-ball LBGA (45x45 mm) - same | 652-ball LBGA (45x45 mm) - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits |
| User I/O | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C8 | C8 | C7 (faster) | C7 (faster, ES) | C8 |
| Core Voltage | 1.8 V (1.71 V - 1.89 V) | 1.8 V (1.71 V - 1.89 V) | 1.8 V (1.71 V - 1.89 V) | 1.8 V (1.71 V - 1.89 V) | 1.8 V (1.71 V - 1.89 V) |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C (extended screening) | 0 °C to 85 °C |
Bảo phân biệt quan trọng
- Pb-free (N-suffix) variant specified for current lead-free assembly (vsEP20K600CB652C8)
- Faster speed grade available in identical footprint (vsEP20K600CB652C7N)
- Extended-screening (ES) variant for harsh environments (vsEP20K600CB652C7ES)
Ghi chú thiết kế
Estimated: at 1.8 V core and 488 active I/O, the EP20K600CB652C8N core current can reach several hundred mA at 301 MHz with typical toggle rates. Provide at least four 100 µF bulk caps plus 0.1 µF + 0.01 µF decoupling pairs adjacent to each VCCINT and VCCIO ball row. Place a ferrite bead between the regulator and the FPGA VCCINT plane to attenuate the 1.8 V rail noise that couples into the LVTTL I/O thresholds.
The 652-ball LBGA at 1.27 mm pitch requires 4 mil trace-and-space with microvia or via-in-pad stack-ups for reliable breakout. Fan-out escape routing from the inner-row balls uses two-layer dog-bone fan-out. Match lengths within each LVDS or SSTL byte group to within 25 mil to preserve edge-to-edge skew at 301 MHz. Connect all GND balls to a solid ground plane; do not share vias between VCCIO and VCCINT to avoid supply-coupling.
Do not assume APEX 20KE bitstreams run on APEX 20KC silicon; the C8 vs C7 vs KE speed-grade IDs differ. Designers migrating from 20KE must recompile in Quartus II to regenerate configuration data. Also, leaving unused I/O pins floating violates the 1.8 V core supply’s ESD structure - configure all unused pins as outputs driving low or as inputs with internal weak pull-ups enabled.
Series-terminate each LVTTL output near the FPGA when driving more than 2 inches of trace or 4 loads at 100 MHz+. For SSTL2 or SSTL3 I/O standards, use external VTT termination at the receiver end with 50 Ω to the 1.25 V or 1.5 V termination rail. Use the Quartus II board-level IBIS models to simulate simultaneous-switching noise on the 488 I/O banks.
Thông tin tuân thủ
The 'N' suffix typically denotes Pb-free lead finish per Altera/Intel legacy ordering convention; RoHS and REACH status were not explicitly stated in the verified web data and are marked unknown.
