EP2A70B724C9 - APEX II 540 I/O 724-BGA FPGA | Altera / Intel
MPN: EP2A70B724C9 ✗ Cuối đờiEP2A70B724C9 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) that combines the flexibility of software-based design with near-ASIC performance and parallelism. APEX II sits in the hierarchy of programmable logic: PLD -> CPLD/FPGA family -> high-density SRAM-based FPGA -> multi-gigabit transceiver-capable device. APEX II was engineered for high-bandwidth DSP, datapath-intensive designs, and on-chip memory-rich applications requiring up to 1.146 Mbits of embedded system block (ESB) RAM and PLLs for clock management.
Key features include embedded RAM blocks (ESBs) configurable as true dual-port, simple dual-port, or single-port synchronous memory, with self-timed write enable that eliminates external WE signal generation. The device supports up to four PLLs for clock multiplication, division, and phase shifting, and offers true 1 Gbps LVDS I/O for chip-to-chip interconnect. The 540 user I/Os include dedicated high-speed channels suitable for HyperTransport, RapidIO, and LVDS signalling, making APEX II well suited to high-throughput bridging and protocol conversion designs.
The architecture combines Look-Up Table (LUT)-based logic with ESB memory, allowing designers to trade logic capacity against memory capacity per design block. Multi-level interconnect with fast row and column paths targets DSP and datapath workloads where sustained arithmetic throughput matters more than raw clock rate. FineLine BGA packaging supports dense board layouts while preserving signal integrity for the high-speed LVDS channels, which require matched impedance routing and careful length matching.
Typical applications include high-speed serial protocol bridging (RapidIO, HyperTransport, custom LVDS links), DSP co-processing for wireless baseband or video pipelines, datapath acceleration in telecom line cards, and high-density glue logic with embedded memory buffering. The wide I/O count also suits it for memory-controller fanout and large bus-conversion designs where many parallel interfaces must be aggregated.
When designing with this device, ensure proper LVDS signal integrity with controlled-impedance routing and matched-length traces; verify JTAG chain integrity in production programming; and follow Altera's power estimation flow using the Quartus APEX II power calculator before sign-off. Synchronous RAM blocks require careful clock-domain crossing analysis when shared with asynchronous logic.
This page synthesizes distributor pricing for EP2A70B724C9, same-family drop-in alternatives within the APEX II lineup, and practical design notes beyond what the manufacturer datasheet alone provides.
Bộ thay thế dễ dàng lắp đặt cho EP2A70B724C9 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2A70B724C9 (cùng hình factor và footprint) — khác nhau ở Process Technology, Package, Configuration Method, Speed Grade, System Gates.
EP2A70B724C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A70B724C8
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A70B724C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A70B724C7ES
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A70B724C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A70B724C9 Tỷ lệ tối đa & tính chất điện
| Family | APEX II |
| Logic Elements | 67200 |
| Embedded Memory (bits) | 1146880 |
| User I/O Count | 540 |
| Hộp | 724-BBGA, FCBGA (FineLine BGA) |
| Process Technology | 0.15 um all-layer copper (up to 8 metal layers) |
| LVDS Channels | Up to 8 LVDS pairs at 1 Gbps |
| I/O Standards Supported | True-LVDS, LVPECL, PCML, HyperTransport |
| Embedded Memory Type | ESB (synchronous, self-timed WE, true dual-port / simple dual-port / single-port) |
| PLLs | Up to 4 |
| Speed Grade | C9 (commercial, speed bin 9) |
| Nhiệt độ hoạt động | 0C to +85C (commercial) |
| Supply Voltage (core) | 1.5 V |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Trạng thái RoHS | Non-compliant (per IC-Components listing) |
Hướng dẫn cấu hình chân EP2A70B724C9 724-bbga, fcbga (fineline bga)
Cấu hình chân cho EP2A70B724C9 (724-bbga, fcbga (fineline bga) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2A70B724C9.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2A70B724C9 phù hợp cho 6 Áp dụngs: High-Speed LVDS Chip-to-Chip Bridge, Telecom Line-Card Datapath Acceleration, DSP Co-Processor for Wireless Baseband, Memory-Controller Aggregation Hub, HyperTransport / RapidIO Protocol Bridge, Industrial Glue Logic with Embedded Buffers.
High-Speed LVDS Chip-to-Chip Bridge
The EP2A70B724C9 is well suited to chip-to-chip bridging over LVDS links because of its eight dedicated 1 Gbps True-LVDS channels and HyperTransport-compatible I/O. The 724-ball FineLine BGA exposes enough user I/Os to fan out multiple parallel LVDS lanes alongside control and status signals. Designers use the APEX II's PLLs (up to 4) to generate the precise LVDS clocks required for source-synchronous channels, while the embedded ESB memory acts as elastic buffering for inter-chip FIFOs. Compared with discrete serializer/deserializer parts, the integrated approach removes BOM cost and eliminates board-level clock-skew problems.
Được đề xuất
Telecom Line-Card Datapath Acceleration
In telecom line cards the EP2A70B724C9 can accelerate cell/packet processing, framing, and traffic-management functions because of its 67,200 logic elements and 1.146 Mbits of embedded synchronous memory. The ESB blocks act as on-chip CAM/RAM hybrids for table lookups, while the abundant user I/Os fan out to UTOPIA, POS-PHY, or SPI-4.2 interfaces. The C9 commercial speed grade delivers the throughput needed for OC-48 / 2.5 Gbps class line cards. Quartus II IP cores for ATM, HDLC, and POS map cleanly onto APEX II resources.
Được đề xuất
DSP Co-Processor for Wireless Baseband
The APEX II architecture is well known for DSP co-processing, and the EP2A70B724C9's 67,200 logic elements plus dense ESB memory enable parallel multiply-accumulate pipelines for baseband signal processing. The up-to-four PLLs support the multiple clock domains required for chip-rate, symbol-rate, and DSP-clock generation. The 1.5 V core keeps power consumption manageable in dense line cards, while LVDS I/Os feed high-speed ADC/DAC samples to and from the FPGA. Quartus II DSP Builder integrates with MATLAB/Simulink for rapid DSP design entry.
Được đề xuất
Memory-Controller Aggregation Hub
With 540 user I/Os, the EP2A70B724C9 can aggregate multiple memory interfaces (DDR, QDR, SRAM, RLDRAM) into a single FPGA fabric for buffering, protocol conversion, and queuing. The 1.146 Mbits of embedded RAM supplies high-bandwidth on-chip buffering for line-rate memory traffic, and the ESB true dual-port blocks enable simultaneous read/write at different clock rates. Compared with discrete memory-controller ASICs, the APEX II approach lets designers re-tune timing and arbitration via firmware updates rather than respins.
Được đề xuất
HyperTransport / RapidIO Protocol Bridge
Because the APEX II family explicitly supports HyperTransport technology and RapidIO-style serial protocols, the EP2A70B724C9 can act as a bridge between processors, DSPs, and ASICs that speak different protocols. Its LVDS and PCML I/O standards handle the high-speed serial lanes at gigabit rates, while the abundant logic and memory implement the protocol state machines. The 724-ball BGA provides the signal-integrity-friendly power/ground distribution required for gigabit signalling with controlled impedance.
Được đề xuất
Industrial Glue Logic with Embedded Buffers
Beyond high-speed applications, the EP2A70B724C9 also serves as a flexible glue-logic platform in industrial controllers, factory-automation backplanes, and test equipment. The 540 I/Os handle many disparate buses (PCI, ISA, I2C, SPI, custom parallel) and the embedded ESB blocks provide large FIFOs and lookup tables. The C9 commercial temperature range (0C to +85C) covers most industrial enclosures, and the Quartus II SOPC Builder enables Nios soft-processor cores for control-plane tasks.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2A70B724C9 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2A70B724C8N | EP2A70B724C8 | EP2A70B724C7N | EP2A70B724C7ES | EP2A70B724C7 |
|---|---|---|---|---|---|---|
| Package | 724-BBGA, FCBGA | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same | 724-BBGA, FCBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Logic Elements | 67200 | 67200 | 67200 | 67200 | 67200 | 67200 |
| Embedded Memory (bits) | 1146880 | 1146880 | 1146880 | 1146880 | 1146880 | 1146880 |
| User I/O Count | 540 | 540 | 540 | 540 | 540 | 540 |
| Speed Grade | C9 | C8 (slower) | C8 (slower) | C7 (slower) | C7 (slower) | C7 (slower) |
| LVDS Channels | Up to 8 at 1 Gbps | Up to 8 at 1 Gbps | Up to 8 at 1 Gbps | Up to 8 at 1 Gbps | Up to 8 at 1 Gbps | Up to 8 at 1 Gbps |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| RoHS Status | Non-compliant | Lead-free finish | Non-compliant | Lead-free finish | Lead-free finish | Non-compliant |
Bảo phân biệt quan trọng
- Fastest commercial speed grade in the 724-ball APEX II lineup (vsEP2A70B724C8N)
- Largest I/O count in the APEX II family (540 user I/Os) (vsEP2A70B652C9)
- RoHS-compliant lead-free finishes available in alternative bins (vsEP2A70B724C8N)
Ghi chú thiết kế
The EP2A70B724C9 724-ball BGA requires a multilayer PCB with continuous ground and power planes directly beneath the package to provide low-impedance return paths for the high-speed LVDS and HyperTransport signals. BGA breakout should use microvia-in-pad or dog-bone fan-out with matched trace lengths for the LVDS pairs. A 1.5V core plane with at least four decoupling capacitors per power pin (0.1uF, 0.01uF, bulk 10-47uF) is recommended to suppress simultaneous-switching-noise on the I/O banks.
For the up-to-eight 1 Gbps LVDS channels on EP2A70B724C9, route each differential pair with 100-ohm differential impedance, length matching within 5 mils, and continuous reference plane on an adjacent layer. Avoid splitting power planes under LVDS traces and place AC-coupling capacitors close to the receiver end. Use the IBIS model from the Altera APEX II literature page for pre-layout and post-layout signal-integrity simulation; verify eye-diagram mask margins at the 1 Gbps data rate before tape-out.
Do not assume the EP2A70B724C9 is RoHS compliant: the IC-Components listing explicitly flags it as RoHS non-compliant because the leaded finish is part of the C9 design. For RoHS-compliant assembly choose EP2A70B724C8N, EP2A70B724C7N, or EP2A70B724C7ES, which carry the lead-free finish suffix 'N' or 'ES'. Also remember that downgrading from C9 to C7/C8 speed bins reduces fmax; verify timing closure at the slower speed grade before substituting.
Thông tin tuân thủ
RoHS non-compliant per IC-Components distributor listing (leaded finish on C9 speed grade). REACH and conflict-mineral status not stated in verified data. AEC-Q100 not applicable - this is a commercial-grade FPGA. For RoHS-compliant assembly use the lead-free N or ES variants.
