EP2S130F1020I4N - Stratix II 132K LEs FPGA, 742 I/O | Intel / Altera
MPN: EP2S130F1020I4N ✗ Cuối đờiEP2S130F1020I4N Tóm tắt
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device belonging to the programmable logic family of integrated circuits. FPGAs sit hierarchically as: FPGA -> programmable logic -> digital logic IC -> semiconductor. They combine configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, multipliers/DSP slices, PLLs, and (in newer families) transceivers, giving designers ASIC-class performance with the flexibility of in-system reprogrammability for prototyping, low-volume production, and standards-based acceleration.
Key features of the EP2S130F1020I4N include 6,627 LABs (Logic Array Blocks), up to 711.24 MHz internal operation, dedicated DSP blocks for fixed- and floating-point math, TriMatrix embedded memory with true dual-port RAM, eight PLLs for clock management, and 12 phase-locked high-speed source-synchronous interfaces. The 1020-FBGA package provides abundant routing for DDR/DDR2 external memory interfaces with dedicated DQS logic.
Architecturally, Stratix II uses an adaptive logic module (ALM) that combines look-up-table and register resources, yielding approximately 2.5x the logic density of the original Stratix family. Hard IP such as transceivers, multipliers, and block RAM removes overhead from soft implementations, allowing designers to push Fmax higher and lower system power versus gate-array equivalents.
Typical applications include high-performance DSP for wireless baseband, ASIC prototyping, military radar, broadcast video processing, medical imaging, high-speed data acquisition, and telecommunications line cards. The 742 I/O count supports wide parallel buses and multiple external memory banks on a single device.
Designers should leverage the Stratix II Device Handbook for pin assignments, IBIS models, and reference designs; Quartus II software is required for synthesis, place-and-route, and timing closure. Note that this family has reached end-of-life and is now distributed primarily through the secondary market.
This page synthesizes distributor pricing, EOL status, and same-package alternative MPNs from the Stratix II family that are not consolidated on a single manufacturer or distributor page, with explicit notes on temperature grade and speed-bin differences.
Bộ thay thế dễ dàng lắp đặt cho EP2S130F1020I4N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2S130F1020I4N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Operating Temperature, Package, RoHS Status, Logic Elements.
EP2S130F1020I4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S130F1020C5N
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Xem tài liệu →EP2S130F1020C4N
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Xem tài liệu →EP2S130F1020C3N
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Xem tài liệu →EP2S130F1020C5NRB
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Xem tài liệu →EP2S130F1020C4RB
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Xem tài liệu →EP2S130F1020I4N Tỷ lệ tối đa & tính chất điện
| Family | Stratix II |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total RAM Bits | 6,747,840 |
| User I/O Count | 742 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| Nhiệt độ hoạt động | -40C to +100C (TJ, Industrial) |
| Hộp / Vỏ | 1020-BBGA (FineLine BGA, FC-FBGA) |
| Supplier Device Package | 1020-FBGA |
| Kiểu lắp đặt | Surface Mount |
| Process Node | 90 nm |
| Internal Operating Frequency | up to 711.24 MHz |
| Speed Grade | I4 (Industrial, speed bin 4) |
| Configuration | SRAM-based, volatile configuration memory |
| Design Software | Quartus II (legacy) |
Hướng dẫn cấu hình chân EP2S130F1020I4N 1020-fbga
Cấu hình chân cho EP2S130F1020I4N (1020-fbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2S130F1020I4N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2S130F1020I4N phù hợp cho 7 Áp dụngs: Wireless Baseband DSP, ASIC Prototyping, Military Radar Signal Processing, Broadcast Video Processing, Medical Imaging Systems, Telecommunications Line Cards, High-Speed Data Acquisition.
Wireless Baseband DSP
The EP2S130F1020I4N's 132,540 logic elements and dedicated DSP blocks make it well suited for multi-antenna wireless baseband processing where hundreds of FIR filters and FFT engines must run in parallel. Its industrial -40C to +100C TJ rating supports outdoor radio units and small-cell deployments. Stratix II DSP blocks deliver dedicated 18x18 multipliers so a single device can implement a complete LTE PHY layer including channel estimation, MIMO decoding, and crest-factor reduction, while the 6,747,840 bits of TriMatrix embedded memory buffer OFDM symbols on-chip without external SRAM.
Được đề xuất
ASIC Prototyping
Design teams use the EP2S130F1020I4N as an ASIC prototype vehicle because its 132K logic elements map cleanly from multi-million-gate ASIC netlists, and its 742 I/O pins preserve the wide external buses of the target ASIC. The Stratix II adaptive logic module handles synthesis-friendly RTL with minimal padding, and the Quartus II flow provides timing closure on partitions larger than 5 MHz. With multiple EP2S130F1020I4N boards stacked or cabled together, multi-FPGA prototyping emulates 5-10 million ASIC gates for pre-silicon software development and validation.
Được đề xuất
Military Radar Signal Processing
Defense radar systems benefit from the EP2S130F1020I4N's industrial temperature range and high DSP throughput, which is required for pulse-Doppler and SAR processing where each radar return must be range-compressed, FFT-transformed, and detected in real time. The 90 nm Stratix II silicon meets the long-lifecycle and traceability requirements of defense programs. Engineers leverage the embedded TriMatrix memory blocks for window buffers and corner-turn memories used in SAR image formation.
Được đề xuất
Broadcast Video Processing
Broadcast studios deploy EP2S130F1020I4N in routing switchers, multi-viewers, and up/down/cross converters where multiple HD-SDI or 3G-SDI streams must be processed frame-synchronously. The 742 I/O pins accept dozens of SDI inputs alongside audio embedding, while embedded DSP blocks perform scaling, de-interlacing, and color-space conversion at 1080p60 rates. Industrial-temperature parts suit the thermally-constrained rack environments of outside-broadcast trucks.
Được đề xuất
Medical Imaging Systems
CT, MRI, and ultrasound scanners rely on the EP2S130F1020I4N for back-end image reconstruction because its embedded DSP blocks run parallel beamformers and back-projection kernels in real time. The 6,747,840 bits of block RAM hold sinogram and k-space data on-chip, reducing external memory traffic and overall system latency. Long-term support and the established Quartus II design flow are critical for medical OEMs that must maintain hardware platforms for 10-15 years.
Được đề xuất
Telecommunications Line Cards
Telecom line cards use the EP2S130F1020I4N for protocol-aware traffic management, deep packet inspection, and high-speed serial backplane bridging. The 742 I/O count supports multiple SGMII / SerDes lanes and parallel Utopia/Interlaken interfaces to network processors. Industrial temperature rating allows deployment in NEBS-compliant central-office racks where ambient temperatures reach 55C. Embedded PLLs synthesize the line-card clocks from a single backplane reference.
Được đề xuất
High-Speed Data Acquisition
Scientific instruments and test equipment integrate the EP2S130F1020I4N to capture and pre-process data from multi-gigasample-per-second ADCs. The wide LVDS banks support parallel ADC interfaces at 1 Gbps per pair, while on-chip DSP blocks perform real-time filtering, decimation, and FFT spectral analysis. The 6,747,840 bits of block RAM form deep capture FIFOs that buffer bursts before DMA to host memory via PCIe or external memory interfaces.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2S130F1020I4N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2S130F1020I4 | EP2S130F1020C5N | EP2S130F1020C4N | EP2S130F1020C3N | EP2S130F1020C5NRB |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-FBGA | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same | 1020-FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| User I/O | 742 | 742 | 742 | 742 | 742 | 742 |
| Embedded RAM Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| Temperature Grade | Industrial (-40C to +100C TJ) | Industrial (-40C to +100C TJ) | Commercial (0C to +85C TJ) | Commercial (0C to +85C TJ) | Commercial (0C to +85C TJ) | Commercial (0C to +85C TJ) |
| Speed Grade | I4 | I4 | C5 | C4 | C3 | C5 |
| Terminal Finish | Lead-free (N suffix) | Lead-bearing (no N suffix) | Lead-free | Lead-free | Lead-free | Reballed / refurbished lead-free |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL (aftermarket reball) |
Bảo phân biệt quan trọng
- Highest logic density in Stratix II family with 132,540 LEs (vsEP2S60F484I4N)
- Industrial temperature rating suitable for harsh environments (vsEP2S130F1020C3N)
- Lead-free terminal finish (N suffix) for RoHS-compliant assembly (vsEP2S130F1020I4)
Ghi chú thiết kế
The EP2S130F1020I4N in a 1020-FBGA package dissipates significant power at full utilization; reference the Stratix II Device Handbook power estimator (PowerPlay Early Power Estimator) to model worst-case junction temperature. Industrial-grade parts are rated to +100C TJ, so a heatsink or forced-air cooling is typically required when logic utilization exceeds 70 percent and toggle rates average above 30 percent. Always measure delta_T_JA on the actual PCB with a thermal-couple test coupon before finalizing the cooling solution.
The 1020-FBGA uses a 1.0 mm ball pitch per JEDEC MO-216; PCB design must follow the JEDEC registered escape pattern with microvia-in-pad construction to break out the full 1020 balls. Use a stackup of 8-12 layers with dedicated ground planes beneath the BGA and at least two reference planes for each signal layer. Per Intel/Altera layout guidelines, all VCCINT and VCCIO decoupling capacitors must be placed on the opposite side of the BGA within 100 mils of their associated balls; high-frequency decoupling must be co-located with via-in-pad.
Stratix II DDR/DDR2 external memory interfaces rely on matched DQS-to-DQ trace lengths within 25 mils on FR-4. Use the Stratix II Device Handbook pin-out file and the Quartus II pin planner to enforce length-matching rules at place-and-route time. Source-synchronous interfaces above 200 MHz DDR require 50 ohm single-ended or 100 ohm differential impedance with controlled 90 ohm differential skew per Intel's DDR2 implementation guide.
Do not assume any cross-family pin compatibility between Stratix II and Stratix III/IV/V devices even when the ball count and package appear similar - bank voltages, transceiver locations, and configuration pin assignments differ. For second-source resilience on a long-lifecycle product, design with the largest Stratix II device (EP2S130) and qualify one lower-density device (EP2S60 or EP2S90) on a compatible footprint, then use Quartus II's incremental recompile feature to migrate between them.
Stratix II is SRAM-based, so a configuration bitstream must be loaded on every power-up from an EPCS or EPCQ flash device, a microcontroller, or JTAG. Industrial users must validate bitstream integrity at cold-start to avoid POR failures below -40C. Use the ALTREMOTE_UPDATE megafunction if in-field upgrades are required, and always store a factory fallback image in a second flash page.
Thông tin tuân thủ
RoHS and REACH compliance status not confirmed in verified web data; the 'N' suffix indicates Pb-free terminal finish per JEDEC J-STD-609, consistent with RoHS-compliant assembly. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC. Refer to Intel/IMDS for full material declaration.
