EP2SGX30CF780C3 - Stratix II GX FPGA, 33.88K LE, 780-BGA | Intel
MPN: EP2SGX30CF780C3 ✗ Cuối đờiEP2SGX30CF780C3 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy: programmable logic IC -> FPGA -> SRAM-programmable FPGA -> high-density FPGA with transceivers. They allow hardware designers to implement custom parallel processing pipelines, custom I/O protocols, and glue logic without the NRE cost of an ASIC, which is why Stratix II GX parts are commonly used in prototyping and low-volume production.
Key specifications of the EP2SGX30CF780C3 include up to 33,880 logic elements, 1,694 LABs, 1,369,728 RAM bits, 361 user I/Os, embedded 3.125 Gbps transceivers for serial connectivity, and support for DDR/DDR2/QDRII external memory interfaces via dedicated PHY. The 780-ball FineLine BGA package supports high I/O count while keeping the PCB footprint manageable for mid-complexity boards. Operating temperature is graded commercial (0C to +85C), and the speed grade is -3.
The Stratix II GX architecture uses a logic-element fabric with adaptive look-up tables (ALUTs), a TriMatrix memory subsystem, and dedicated DSP blocks. The GX suffix indicates the integration of high-speed serial transceivers, which historically positioned this family for communication-infrastructure, broadcast video, and high-speed serial-protocol bridging applications. Designers should pay attention to Quartus II tool support, as Quartus versions for legacy Stratix II devices are mature but no longer under active development, and Intel recommends migrating to Stratix IV/V families for new designs.
Typical applications include communication infrastructure (protocol bridges, backplane SERDES), broadcast video processing, industrial test and measurement, ASIC prototyping, and high-speed data acquisition. The combination of transceivers, block RAM, and abundant logic density makes the EP2SGX30CF780C3 suitable for custom packet-processing engines and for replacing discrete logic + memory glue in mid-complexity designs.
When designing with this part, ensure your PCB layout supports the 1.0 mm or 1.27 mm pitch BGA fanout and that signal-integrity simulations are run on the transceiver channels. Because the Stratix II family is mature, plan firmware/quartus tool availability in your long-term roadmap. For new designs, also evaluate Stratix IV GX, Cyclone V GX, or Cyclone 10 GX as modern drop-in-compatible successors with active toolchain support.
This page synthesizes distributor stock, datasheet parameters, drop-in compatible Stratix II GX variants, and design notes not aggregated on a single manufacturer page.
Bộ thay thế dễ dàng lắp đặt cho EP2SGX30CF780C3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2SGX30CF780C3 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Speed Grade, RoHS Status, Transceivers.
EP2SGX30CF780C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2SGX30DF780C3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2SGX30DF780I4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S30F780C3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP2S130F780C3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP2SGX30CF780C3 Tỷ lệ tối đa & tính chất điện
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Array Blocks (LABs) | 1,694 |
| Embedded RAM Bits | 1,369,728 |
| User I/Os | 361 |
| Hộp | 780-ball FineLine BGA |
| Process Node | 90 nm |
| Speed Grade | -3 |
| Nhiệt độ hoạt động | 0C to +85C (commercial) |
| Transceivers | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | DDR / DDR2 / QDRII PHY |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Hướng dẫn cấu hình chân EP2SGX30CF780C3 780-ball fineline bga
Cấu hình chân cho EP2SGX30CF780C3 (780-ball fineline bga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2SGX30CF780C3.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2SGX30CF780C3 phù hợp cho 6 Áp dụngs: Communication Protocol Bridging, Broadcast Video Processing, Industrial Test and Measurement, ASIC Prototyping, High-Speed Data Acquisition, Legacy System Sustainment.
Communication Protocol Bridging
The EP2SGX30CF780C3 fits protocol-bridging applications because it integrates up to 3.125 Gbps embedded transceivers alongside 33,880 logic elements and 1,369 Kb of block RAM. The Stratix II GX architecture lets designers implement custom 10/40G Ethernet MACs, SONET/SDH framers, or proprietary backplane protocols without external SERDES chips. In a typical bridge design the FPGA sits between an SFP/SFP+ cage and a switch ASIC, framing packets and buffering them in MLAB/M4K memory before forwarding; the 361 user I/Os in the 780-ball BGA expose enough LVDS pairs for multi-lane interfaces plus parallel sideband management.
Được đề xuất
Broadcast Video Processing
The EP2SGX30CF780C3 is well suited for broadcast video processing because its 33,880 logic elements and 1,369 Kb of embedded RAM provide the parallelism required for SDI/HD-SDI/3G-SDI processing, color-space conversion, and on-screen-display composition. The GX transceivers support SMPTE 259M/292M/424M serial video interfaces, eliminating external cable equalizers. The 780-ball BGA exposes enough LVDS and LVCMOS pairs for parallel video buses plus GPIO control. Design consideration: at 148.5 MHz pixel rates for 1080p60, place critical timing paths in adjacent LABs and use the dedicated PLL to clock the parallel video domain.
Được đề xuất
Industrial Test and Measurement
The EP2SGX30CF780C3 fits industrial test and measurement because the combination of 33,880 LEs, abundant block RAM, and integrated SERDES enables custom stimulus/response generation, mixed-signal test sequencing, and protocol-aware pattern generation. In a typical ATE or bench instrument the FPGA drives parallel DACs/ADCs, captures responses in MLABs, and reports via PCIe or Ethernet; the 361 I/Os expose wide parallel buses for instrumentation front ends. The commercial temperature grade is sufficient for lab and factory environments, but for outdoor or military test, migrate to the EP2SGX30DF780I4N industrial variant.
Được đề xuất
ASIC Prototyping
The EP2SGX30CF780C3 is widely used for ASIC prototyping because the Stratix II GX architecture is well documented, has mature Quartus II timing closure, and offers sufficient logic density to map mid-complexity ASIC RTL. With 33,880 LEs and 1,369 Kb of RAM, designers can prototype custom ASICs in the 30K-gate-equivalent range and validate functional behavior before taping out. The 780-ball BGA exposes 361 user I/Os which match typical ASIC prototype breakout board requirements. Best practice: partition the design into clock domains matching the target ASIC and use Quartus II LogicLock regions to constrain the placement.
Được đề xuất
High-Speed Data Acquisition
The EP2SGX30CF780C3 fits high-speed data acquisition because its 3.125 Gbps transceivers can sink ADC/FIFO data from high-bandwidth analog front ends, while 1,369 Kb of block RAM allows real-time sample buffering. A typical DAQ design uses the GX transceivers to receive serialized ADC LVDS streams from front-end digitizers, then processes the samples in DSP blocks and forwards them over PCIe to a host. The 361 user I/Os support parallel GPIO control of front-end attenuators, trigger signals, and clock distribution. Thermal note: the 780-ball BGA has limited heatsinking options; for sustained high-throughput DAQ, attach a thermal pad or heat spreader to keep junction temperature within spec.
Được đề xuất
Legacy System Sustainment
The EP2SGX30CF780C3 is appropriate for legacy system sustainment because many deployed telecom, defense, and industrial systems still rely on Stratix II GX silicon, and the EP2SGX30CF780C3 is a known stock part for field repairs and re-spins. With 33,880 LEs, embedded SERDES, and 361 user I/Os in a 780-ball BGA, it can be slotted into legacy PCBs to replace failing units. Because the part is obsolete, design teams should plan for stock-out contingencies and identify the EP2SGX30CF780C5N or EP2SGX30DF780I4N as alternative sources that retain the same footprint for second-source qualification.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2SGX30CF780C3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2SGX30CF780C5N | EP2SGX30DF780C3 | EP2SGX30DF780I4N | EP2S30F780C3 | EP2S130F780C3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 132,540 |
| Embedded RAM | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 6,747,840 bits |
| User I/Os | 361 | 361 | 361 | 361 | 361 | 361 |
| Speed Grade | -3 | -5N (faster) | -3 | -4N | -3 | -3 |
| Transceivers | Embedded GX (up to 3.125 Gbps) | Embedded GX | Embedded GX (more channels) | Embedded GX (more channels) | None (non-GX) | None (non-GX) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
Bảo phân biệt quan trọng
- Integrated multi-gigabit transceivers (vsEP2S30F780C3)
- Higher transceiver count for high-port designs (vsEP2SGX30DF780C3)
- Industrial temperature grade option in same footprint (vsEP2SGX30DF780I4N)
Ghi chú thiết kế
The 780-ball FineLine BGA at 1.0 mm or 1.27 mm pitch requires multilayer PCB with microvia or via-in-pad construction for clean signal escape. Route differential transceiver pairs with 100-ohm differential impedance and length-match intra-pair to within 5 mils; length-match inter-pair to within 50 mils for 3.125 Gbps operation. Place the decoupling network (100 nF + 10 uF per power pin) as close to the BGA balls as physically possible. Estimated: at 100% transceiver utilization, the board stack-up should be a 6-layer or 8-layer PCB with dedicated ground and power planes adjacent to the BGA fanout layer.
Although the commercial-temperature EP2SGX30CF780C3 is rated for 0C to +85C operation, sustained high transceiver utilization can drive junction temperature into the high 70s C. Estimated: with all transceivers active at 3.125 Gbps and 50% logic utilization, expect 3 to 5 W of power dissipation. The 780-ball BGA does not have an integrated heat spreader; use a thermal pad or copper pour on the top of the package connected to a ground plane to keep theta_JA within margin.
Do not assume newer Quartus Prime versions support Stratix II GX. Quartus II 13.0sp1 / 13.1 is the last major release with full Stratix II support; attempting to compile in Quartus Prime 15.0 or later without the legacy device support will fail. For long-term projects, document the Quartus version in the design's version control. Common pitfall: assuming a non-GX Stratix II (e.g., EP2S30F780C3) can be substituted for a GX variant - the non-GX has no transceivers and the SERDES ball assignments differ; verify with the pin-out file before board respin.
Thông tin tuân thủ
RoHS and lead-free confirmed by Intel/Altera product documentation. REACH compliance typically confirmed; AEC-Q100 not applicable for FPGA family. Halogen-free status not explicitly listed in available datasheet excerpts - reported as unknown.