EP3C80U484I7 - 81K LE Cyclone III FPGA, 484-FBGA | Intel
MPN: EP3C80U484I7 ✓ Hoạt độngEP3C80U484I7 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. The hierarchy is: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit to implement custom digital logic, DSP pipelines, or soft-processor cores. Cyclone III sits at the low-power, low-cost end of Intel's FPGA portfolio, balancing density with low static and dynamic power consumption.
Key features of the EP3C80U484I7 include 4 embedded PLL blocks (with up to 4 outputs per PLL) for clock synthesis and skew management, dedicated 18x18 hardware multipliers supporting DSP operations, 274 M9K memory blocks for distributed RAM and FIFO buffers, and a rich set of high-speed LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also provides a complete configuration subsystem including JTAG (IEEE 1149.1), Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) interfaces. Per the Altera Cyclone III Device Handbook, the device supports 1.0 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL I/O standards with hot-socketing capability.
Typical applications span industrial motor control, video surveillance encoders, software-defined radio (SDR) baseband, telecom line cards, automotive infotainment pre-processing, medical imaging front-ends, and military/aerospace signal processing prototypes. The 484-FBGA FineLine BGA package provides a 19 x 19 mm footprint with 0.8 mm ball pitch, enabling dense PCB layouts with multiple signal layers.
When designing with this device, ensure the JTAG chain is correctly terminated and that configuration flash (such as EPCS16 or EPCS64) is selected to match the bitstream size of the EP3C80. Quartus II (legacy) or Intel Quartus Prime Lite (current) software is the required design toolchain.
Bộ thay thế dễ dàng lắp đặt cho EP3C80U484I7 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C80U484I7 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Speed Grade, Mounting Type.
EP3C80U484C8N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C80U484C7N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C80U484C6N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C40U484I7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C55U484I7
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C80U484I7 Tỷ lệ tối đa & tính chất điện
| Family | Cyclone III |
| Logic Elements | 81,264 |
| Total Memory Bits | 2,810,880 bits |
| Embedded Memory Blocks | 274 M9K blocks |
| Embedded 18x18 Multipliers | 244 |
| PLLs | 4 (with up to 4 outputs each) |
| Maximum User I/O | 295 |
| Hộp | 484-FBGA (UBGA-484, FineLine BGA) |
| Package Size | 19 x 19 mm |
| Ball Pitch | 0.8 mm |
| Core Voltage | 1.2 V |
| Operating Temperature (Industrial) | -40C to +85C |
| Internal Operating Frequency (max) | 472 MHz |
| Configuration Schemes | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân EP3C80U484I7 19 x 19 mm
Cấu hình chân cho EP3C80U484I7 (19 x 19 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3C80U484I7.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3C80U484I7 phù hợp cho 6 Áp dụngs: Industrial Motor Control, Video Surveillance Encoder, Software-Defined Radio Baseband, Telecom Line Card Interface, Medical Imaging Front-End, Test & Measurement Instrumentation.
Industrial Motor Control
The EP3C80U484I7 is well-suited for industrial motor control because its 81,264 logic elements and 244 18x18 multipliers support multi-axis Field-Oriented Control (FOC) loops in a single device. Each axis typically consumes 4,000-8,000 LEs plus 4-8 hardware multipliers for the Park/Clarke transforms and PID loops; the EP3C80 comfortably handles 4-6 axes simultaneously. The 295 user I/Os accept multi-encoder inputs (QEP, SSI, EnDat) and gate-driver PWM outputs, while the 274 M9K blocks provide buffering for current/voltage sample streams. The industrial temperature grade (-40C to +85C) and 484-FBGA package withstand factory-floor thermal and vibration conditions.
Được đề xuất
Video Surveillance Encoder
In video surveillance encoder designs, the EP3C80U484I7's 81K logic elements and 244 18x18 multipliers implement H.264 AVC Main Profile encoding for 2-3 channels of D1 (720x480) resolution at 30 fps in real time. The 2,810,880 bits of embedded M9K memory buffer macroblock line stores without external SRAM, reducing BOM cost. LVDS I/O pairs receive parallel sensor data from CMOS image sensors, while Ethernet MAC soft-cores (e.g., the Altera Triple-Speed Ethernet IP) drive 100/1000 Mbps network output. The 484-FBGA package supports dense PCB layouts that fit inside compact IP-camera enclosures.
Được đề xuất
Software-Defined Radio Baseband
The EP3C80U484I7 enables SDR baseband processing where the 244 18x18 hardware multipliers perform digital down-conversion (DDC), finite impulse response (FIR) filtering, and channelization at IF sample rates up to ~150 MSPS. The 81K logic elements implement polyphase filter banks, FFT cores (1024-pt to 4096-pt), and digital demodulation state machines. The four embedded PLLs generate multiple clock domains from a single reference, and the 295 user I/Os interface to dual-channel ADC/DAC pairs (LVDS). Industrial temperature grade suits outdoor-mounted radio units.
Được đề xuất
Telecom Line Card Interface
For telecom line card applications, the EP3C80U484I7 supports TDM (T1/E1) aggregation, ATM cell processing, and HDLC framing through soft IP cores within its 81K logic elements. The 274 M9K blocks implement packet buffers and lookup tables for forwarding decisions, while the LVDS I/Os connect to line-interface units (LIUs) and backplane serial links. The 1.2 V core and industrial temperature grade meet NEBS thermal requirements. The 484-FBGA package offers 295 user I/Os which is sufficient for 8-16 T1/E1 ports per device.
Được đề xuất
Medical Imaging Front-End
In medical imaging front-ends (ultrasound beamformers, endoscopic video processors, patient monitor signal paths), the EP3C80U484I7 implements beamforming algorithms, real-time image filters, and display overlay logic. The 244 hardware multipliers accelerate finite-impulse-response (FIR) and image-convolution kernels, while the M9K memory blocks store scanline data and lookup tables for color mapping. LVDS inputs accept high-speed data from analog front-end ADCs, and the industrial temperature range ensures reliability in clinical environments.
Được đề xuất
Test & Measurement Instrumentation
Test and measurement instruments (logic analyzers, protocol analyzers, arbitrary waveform generators) leverage the EP3C80U484I7's 81K logic elements to implement deep state machines, custom protocol decoders, and high-speed sample buffering. The 472 MHz maximum internal frequency supports real-time protocol decoding for USB 2.0, I2C, SPI, UART, and parallel bus standards. The 295 user I/Os accommodate multi-channel probe inputs, and the 244 18x18 multipliers accelerate FFT-based spectrum analysis. Industrial temperature grade supports lab and field-test equipment.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3C80U484I7 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3C80U484C8N | EP3C80U484C7N | EP3C80U484C6N | EP3C55U484I7 | EP3C40U484I7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (UBGA-484, 0.8 mm pitch) | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same | 484-FBGA (UBGA-484) - same |
| Logic Elements | 81,264 | 81,264 - same | 81,264 - same | 81,264 - same | 55,856 | 39,600 |
| Memory Bits | 2,810,880 | 2,810,880 - same | 2,810,880 - same | 2,810,880 - same | 2,396,160 | 1,161,216 |
| 18x18 Multipliers | 244 | 244 - same | 244 - same | 244 - same | 156 | 126 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Speed Grade | I7 | C8 (slower) | C7 | C6 (slowest) | I7 - same | I7 - same |
| Maximum User I/O | 295 | 295 - same | 295 - same | 295 - same | 295 - same | 295 - same |
Bảo phân biệt quan trọng
- Highest logic density in Cyclone III family (vsEP3C55U484I7)
- Industrial temperature grade in same package as commercial variants (vsEP3C80U484C8N)
- I7 speed grade - fastest Cyclone III speed bin (vsEP3C80U484C6N)
Ghi chú thiết kế
Estimated: typical core current for the EP3C80U484I7 is in the 500-900 mA range at 1.2 V depending on logic utilization and toggle rate; add another 100-300 mA for I/O banks at 3.3 V. Use a low-dropout regulator (e.g., TI TPS74401) on each PLL analog supply (VCCA_PLL) to minimize jitter. Decouple every VCC pin with a 0.1 uF X7R ceramic placed within 3 mm of the ball, plus bulk tantalum or polymer capacitors on each power rail. Power sequencing requirements: VCCINT must not exceed VCCIO by more than 0.3 V during ramp to avoid latch-up.
The 484-FBGA package uses 0.8 mm ball pitch on a 19 x 19 mm body. Use a PCB with at least 6 layers (signal-ground-power-signal-ground-signal) and microvia-in-pad technology if budget allows. Route all differential pairs (LVDS, LVDS-EXT) with 100 ohm differential impedance and length matching within 10 mils. Provide a continuous ground plane under the BGA with thermal vias (0.3 mm drill, 1.0 mm pitch) to dissipate the 1.5-3 W typical power dissipation.
Common pitfalls: (1) MSL 3 moisture sensitivity - bake the device at 125C for 24 hours before assembly if the dry-pack indicator shows exposure; (2) configuration mode pin (MSEL[3:0]) must be tied to the correct VCCIO rail via 4.7 kohm resistors - wrong settings cause configuration failure; (3) JTAG chain - ensure TDI/TDO are correctly routed with 4.7 kohm pull-ups on TCK to VCCIO; (4) do not exceed maximum I/O counts when assigning LVDS pairs (each LVDS pair consumes 2 pins plus a dedicated clock input).
Thông tin tuân thủ
RoHS compliant per Altera/Intel product page. Lead-free ball finish (SnAgCu). Not AEC-Q100 qualified - choose EP3C80U484I7N automotive-grade variant for AEC-Q100 applications if available, or implement external qualification.
