EP3CLS150F780C8 - Cyclone III LS FPGA 150K LE BGA-780 | Intel
MPN: EP3CLS150F780C8 ✓ Hoạt độngEP3CLS150F780C8 Tóm tắt
A Cyclone III FPGA is a low-cost, low-power SRAM-based programmable logic device that combines configurable logic, embedded memory blocks, and high-speed I/O in a single chip. FPGAs sit in the programmable logic hierarchy alongside CPLDs, and are commonly deployed where parallel processing, custom interfaces, or hardware-accelerated signal paths are required. The Cyclone III LS sub-family specifically adds enhanced security and signal-integrity features for communications, industrial control, and military applications.
Key specifications include 9,428 Logic Array Blocks (LABs), 4 embedded PLL blocks, dedicated multiplier blocks for DSP acceleration, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-pin FBGA package provides ample routing density for high-pin-count memory buses and parallel interfaces. The LS suffix indicates low-static-power variant targeting power-sensitive designs.
Architecturally, the EP3CLS150F780C8 uses a Look-Up Table (LUT) based fabric with embedded M9K memory blocks (each 9 Kbit) totaling approximately 6.14 Mbit of on-chip RAM. The device supports configuration via JTAG, passive serial, active serial, and fast passive parallel modes. Hardware multipliers are organized into DSP blocks enabling efficient FIR filters and FFT engines for signal processing pipelines.
Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, telecom line cards, test-and-measurement instrumentation, and embedded vision systems. The large logic capacity and rich I/O mix make it suitable for custom peripheral aggregation in factory automation. The device is also widely used in education and prototyping where a generous logic budget is required at low unit cost.
When designing with this FPGA, plan for a 3.3 V auxiliary supply for I/O banks and a clean 1.2 V core rail; decoupling requires bulk plus 0.1 uF high-frequency capacitors near each supply ball. For signal integrity on the 780-ball FBGA, use microvia or via-in-pad PCB technology to break out all 780 connections.
This page synthesizes distributor pricing, drop-in Cyclone III LS variants, and practical board-level design notes that complement the manufacturer datasheet and existing XAIPART resource pages.
Bộ thay thế dễ dàng lắp đặt cho EP3CLS150F780C8 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3CLS150F780C8 (cùng hình factor và footprint) — khác nhau ở Process Technology, Package, Logic Elements, Speed Grade, Family.
EP3CLS150F780C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3CLS150F780C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C120F780C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C120F780C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3CLS100F780C8
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C55F780C8
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3CLS150F780C8 Tỷ lệ tối đa & tính chất điện
| Family | Cyclone III LS |
| Series | Cyclone III |
| Logic Elements / Cells | 150,848 |
| Total Memory Bits | 6,137,856 |
| Number of LABs | 9,428 |
| Number of Logic Array Blocks | 9,428 |
| User I/O Pins | 413 |
| Number of PLLs | 4 |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Maximum Operating Frequency | 402 MHz |
| Nhiệt độ hoạt động | 0 C to 85 C (Commercial) |
| Package Type | FBGA-780 |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Kiểu lắp đặt | Surface Mount |
| Lead Free / RoHS | Compliant |
| Configuration Mode | JTAG, Passive Serial, Active Serial, Fast Passive Parallel |
Hướng dẫn cấu hình chân EP3CLS150F780C8 29 x 29 mm
Cấu hình chân cho EP3CLS150F780C8 (29 x 29 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3CLS150F780C8.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3CLS150F780C8 phù hợp cho 6 Áp dụngs: Industrial Motor Control, Video Processing Bridge, Telecom Line Card Glue Logic, Test and Measurement Instrumentation, Software Defined Radio Front-End, Embedded Vision and Image Processing.
Industrial Motor Control
The EP3CLS150F780C8's 150,848 logic elements, 4 PLLs, and 413 user I/O pins make it an ideal Cyclone III LS device for multi-axis industrial motor control. Its 18x18-bit hardware multipliers support simultaneous Field-Oriented Control (FOC) loops for two or three axes without offloading to external DSP. The 1.2 V core plus 3.3 V auxiliary rails integrate cleanly with 24 V industrial bus systems, and the 780-ball FBGA delivers the IO density needed for parallel encoder, resolver, and gate-driver interfaces. Compared with smaller Cyclone III LS variants, the EP3CLS150F780C8 provides ~30% more headroom for additional safety logic and PMSM/PWM peripherals in servo drives.
Được đề xuất
Video Processing Bridge
For video processing bridge applications such as HDMI-to-MIPI, SDI-to-LVDS, or camera-to-SoC aggregation, the EP3CLS150F780C8 supplies 413 user I/O including differential pairs supporting LVDS and SSTL I/O standards. The 9,428 LABs and 6.14 Mbit of M9K block RAM allow line buffers, color-space conversion matrices, and frame-rate conversion in a single device. Hardware DSP blocks accelerate chroma resampling and scaling, while 4 PLLs generate pixel clocks, memory clocks, and reference clocks simultaneously. The 65 nm Cyclone III LS process at 1.2 V keeps total bridge-card power under 3 W in typical 1080p60 pipelines.
Được đề xuất
Telecom Line Card Glue Logic
Telecom line cards demand wide parallel buses, multi-standard SERDES-like I/O, and deterministic clocking. The EP3CLS150F780C8 satisfies these with 413 user I/O spanning LVTTL/LVCMOS/SSTL/HSTL, 4 PLLs for backplane and fabric clock synthesis, and 6.14 Mbit of block RAM for cell/packet buffer queues. Its Cyclone III LS architecture delivers low static power for always-on telecom deployments, and the FBGA-780 footprint supports high-density backplane fan-out. Compared with CPLDs or smaller FPGAs, the EP3CLS150F780C8 lets designers integrate framer, mapper, and front-panel glue in a single chip.
Được đề xuất
Test and Measurement Instrumentation
Benchtop test and measurement instruments such as protocol analyzers, logic state machines, and oscilloscope front-ends benefit from the EP3CLS150F780C8's 402 MHz fabric, 4 PLLs, and abundant user I/O. The 150K logic elements accommodate parallel state machines and deep trigger sequencers, while 6.14 Mbit of M9K memory serves as circular sample buffers. The 65 nm LS process keeps thermal output manageable in fanless instrument enclosures. The device's JTAG boundary-scan support eases in-system test integration, and the FBGA-780 package supplies sufficient I/O for multi-channel digitizer aggregation.
Được đề xuất
Software Defined Radio Front-End
Software Defined Radio (SDR) front-ends leverage the EP3CLS150F780C8's hardware multipliers for digital down-conversion (DDC) and digital up-conversion (DUC), with the 6.14 Mbit block RAM storing I/Q sample windows and FFT scratch buffers. The 4 PLLs derive baseband and intermediate-frequency clocks from a common reference, while 413 user I/O handle ADC/DAC data interfaces plus LVDS links to baseband processors. Compared with smaller Cyclone III LS devices, the EP3CLS150F780C8 enables wider-bandwidth multi-channel SDRs without splitting logic across multiple FPGAs, lowering board complexity and BOM cost.
Được đề xuất
Embedded Vision and Image Processing
Embedded vision systems including industrial inspection cameras, barcode sorters, and machine-vision controllers fit naturally on the EP3CLS150F780C8. Its 150K logic elements execute edge-detection, thresholding, and feature-extraction pipelines in parallel; the 18x18-bit multipliers accelerate convolutional kernels at line rate. The 6.14 Mbit of block RAM stores multiple image rows for Sobel, Laplacian, and morphological operators without external memory pressure. The 4 PLLs drive parallel image-sensor, memory, and Ethernet PHY clocks, and the 1.2 V core plus LVDS I/O support low-EMI integration near sensitive analog front-ends.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3CLS150F780C8 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3CLS150F780C7N | EP3CLS150F780C7 | EP3C120F780C8 | EP3CLS100F780C8 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-780 | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Logic Elements | 150,848 | 150,848 (same) | 150,848 (same) | 119,088 (-21%) | 100,848 (-33%) |
| Total Memory Bits | 6,137,856 | 6,137,856 | 6,137,856 | 3,981,312 (-35%) | 3,732,480 (-39%) |
| Number of LABs | 9,428 | 9,428 | 9,428 | 7,440 | 6,300 |
| User I/O | 413 | 413 | 413 | 373 | 423 |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C8 | C7 (slower) | C7 (slower) | C8 (same) | C8 (same) |
| Operating Temperature | 0 to 85 C (Commercial) | 0 to 85 C (Commercial) | 0 to 85 C (Commercial) | 0 to 85 C (Commercial) | 0 to 85 C (Commercial) |
Bảo phân biệt quan trọng
- Highest logic density in Cyclone III LS family (vsEP3C120F780C8)
- Largest block RAM budget in the LS family (vsEP3CLS100F780C8)
- Cyclone III LS security and low-static-power features (vsNon-LS Cyclone III EP3C120F780C8)
Ghi chú thiết kế
The EP3CLS150F780C8 requires two supply rails: a clean 1.2 V core (VCCINT) and a 3.3 V auxiliary supply (VCCA). Decoupling strategy: place 0.1 uF ceramic capacitors within 100 mils of each VCCINT ball, plus bulk 47 uF tantalum or polymer capacitors near the regulator. The Cyclone III LS family has integrated POR (power-on-reset) but VCCA must ramp before or simultaneously with VCCINT to avoid latch-up. Use a sequenced power supply or dual-rail regulator to enforce this constraint.
Breaking out 780 balls at 1.0 mm pitch requires microvia or via-in-pad PCB technology. Use an 8- or 10-layer stack-up with continuous GND planes adjacent to signal layers for return-path continuity. The 29 x 29 mm package demands at least 4 inner routing layers to escape the inner ball rows. Recommended pad finish is ENIG or OSP for lead-free reflow compatibility per JEDEC J-STD-020.
At typical 1 GHz-equivalent toggle rates the EP3CLS150F780C8 dissipates roughly 1.5 to 2.5 W. Estimate: assume 2 W worst-case and compute theta_JA from the package thermal model (typically 12 C/W with 1 oz copper on 4 inner GND planes). With ambient 60 C industrial operation this yields 24 C rise, keeping junction well below the 125 C silicon limit. For designs with high I/O toggle rates (LVDS, DDR), verify thermal headroom by measuring under worst-case workload.
Common pitfalls: (1) tying MSEL pins to logic levels that select the wrong configuration mode - recheck MSEL[3:0] per configuration mode table. (2) Omitting the JTAG TCK pull-down resistor, which leaves TCK floating and causes unreliable boundary-scan. (3) Driving CLK pins before configuration completes - all outputs are tri-stated during configuration. (4) Mixing single-ended I/O standards in the same bank with conflicting VCCIO values.
For LVDS operation, use 100 ohm differential impedance traces and keep intra-pair skew under 20 mil. Place AC-coupling capacitors at the receiver end for source-synchronous LVDS pairs. Reference the Altera AN 224: Using LVDS in Cyclone III for recommended PCB stack-up, and use the Altera Signal Tap logic analyzer to validate received data integrity on first prototypes.
Thông tin tuân thủ
RoHS and REACH compliance per Intel product declaration. Halogen-free status not explicitly confirmed in provided data; marked as unknown. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
